The present invention comprises a method of manufacturing electronics without PCBs and an apparatus for manufacturing electronics without PCBs.

An electronic device which connects a circuit film to a display panel by applying a conductive material to the insides of holes formed in the circuit film, so as to improve reliability of bonding, and a display device using the same, are discussed.

A bumped solder pad and methods for adding bumps to a solder pad are provided. A substrate is provided having metal layer formed thereon and a solder pad formed from a portion of the metal layer. A surface treatment is applied to the solder pad. The surface treatment is patterned. The surface treatment is etched to produce at least one bump on the solder pad.

Selective soldering system for selective wave soldering of circuit boards, including a solder pot, a solder nozzle which can be detachably arranged on the solder pot, wherein the solder nozzle has a nozzle base and a nozzle neck, wherein at the free end of the nozzle neck a nozzle opening is provided, the solder pot being arranged on a moving unit, which can be moved along an x and y axis in a horizontal plane and along a z axis in the vertical direction, and a control unit for controlling the moving unit.

Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wettable surface of a planar substrate; aligning the pin with the solder disposed on the non-wettable surface of the planar substrate; inserting the pin in the solder; and/or performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

The present disclosure relates to a support device for a phase shifter for a base station antenna. The support device includes a support plate suitable for fixation of a main printed circuit board of the phase shifter. The support plate includes a plate-shaped body and at least one support leg located at a lower portion of the body. At least one said support leg extends along a direction perpendicular to the body and is located on one side of the body, so that the support plate can be arranged in the base station antenna in a first orientation by at least one said support leg, or arranged in the base station antenna in a second orientation by the body itself according to layout requirements. The present disclosure also relates to an assembly for a phase shifter for a base station antenna and a method for soldering a coaxial cable to a phase shifter for a base station antenna.

A printed wiring board to which an electronic component is soldered by a jet soldering device, the printed wiring board includes as insulating substrate, a land provided on one surface of the insulating substrate, the one surface serving as a soldering surface, a through hole provided in the land and passing through the insulating substrate in a thickness direction of the insulating substrate. A lead of the electronic component is inserted into the through hole from the other surface of the insulating substrate, the other surface is opposed to the one surface, and an auxiliary conductor is provided in a region of a plane on the one surface, the region is adjacent to the land in a predetermined direction. The auxiliary conductor is provided to have a width equal to a width of the land in the same region of the plane.

A printed circuit board includes a circuit board body and a solder pad row disposed on a back of the circuit board body. The solder pad row includes a solder thief pad and a plurality of circular pin solder pads. An outline of an edge, on the solder thief pad proximate to the pin solder pads is an arc that is concave toward the solder thief pad.

Solder-pinning metal pads for electronic components and techniques for use thereof to mitigate de-wetting are provided. In one aspect, a structure includes: a substrate; and a solder pad on the substrate, wherein the solder pad has sidewalls extending up from a surface thereof. For instance, the sidewalls can be present at edges of the solder pad, or inset from the edges of the solder pad. The sidewalls can be vertical or extend up from the solder pad at an angle. The sidewalls can be formed from the same material or a different material as the solder pad. A method is also provided that includes forming a solder pad on a substrate, the solder pad comprising sidewalls extending up from a surface thereof.

A method of making a printed circuit board pallet is provided. The method of making the pallet illustratively includes the steps of: providing a base in a form of a polymer sheet stock; applying a fluid onto the base at selective locations where the pallet will be built-up to a three-dimensional form; depositing a polymer powder onto the base at the selective locations applied with the fluid; removing any excess amounts of the polymer powder not adhered to the fluid; and heating the pallet to fuse the polymer powder together and to the base.