Aspects of the invention include receiving a printed circuit board (PCB) having one or more of mounting pads thereon, determining a stencil for applying a solder paste to the one or more mounting pads, the stencil having a smallest aperture for a component requiring a standoff, determining a maximum threshold size for standoff particles based on the smallest aperture, determining a first concentration of the standoff particles based on the smallest aperture, determining a minimum threshold size for standoff particles to create the standoff for the component, determining a second concentration of the standoff particles to create a three-standoff seating plane for the component, introducing the standoff particles to the solder paste, the standoff particles in the solder paste having a concentration between the first concentration and the second concentration, and a size between the maximum threshold size and the minimum threshold size.

A stretchable mounting board that includes a stretchable substrate having a main surface, a stretchable wiring disposed on the main surface of the stretchable substrate, a mounting electrode section electrically connected to the stretchable wiring, solder electrically connected to the mounting electrode section and including bismuth and tin, and an electronic component electrically connected to the mounting electrode section with the solder interposed therebetween. The mounting electrode section has a first electrode layer on a side thereof facing the stretchable wiring and which includes bismuth and tin, and a second electrode layer on a side thereof facing the solder and which includes bismuth and tin. A concentration of the bismuth in the first electrode layer is lower than a concentration of the bismuth in the second electrode layer.

The present disclosure relates to surface modification of solder paste stencils to provide improved adhesion of a functional coating. The disclosed surface modifications include laser structuring, plasma treatments, and primers. Methods of using the solder paste stencils are further disclosed.

Disclosed is a printing screen assembly, a frame for a printing screen and method for their construction. The printing screen assembly has a frame (310) with an elongate first frame member (320, 320a) and an elongate second frame member (320, 320b) parallel to the first frame member (320, 320a) and in fixed relation thereto; and a corresponding cantilevered first and second tensioning arrangement (326) extending from each frame member (320) along a length thereof. A predictable pre-tensioning force may be applied by resiliently deflecting the tensioning arrangements (326) into contact with an abutment arrangement (328) and securing a printing screen to an attachment portion (326b) of the first tensioning arrangement (326a), while the first tensioning arrangement (326) is in contact with the first abutment arrangement (326a). The frame may be formed by preselecting the resilience of the tensioning arrangement (326) so as to preselect the tension applied when tensioning a printing screen in use.

The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.

An anisotropic conductive film includes, as conductive particles for anisotropic conductive connection, metal particles such as solder particles having on the surface an oxide film. In this anisotropic conductive film, the metal particles are contained in an insulating film and regularly arranged as viewed in a plan view. A flux is disposed to be in contact with, or in proximity to, at least one of ends of the metal particles on a front surface side of the anisotropic conductive film and a rear surface side of the anisotropic conductive film. Preferable metal particles are solder particles. Preferably, the insulating film has a structure of two layers, and the metal particles are disposed between the two layers.

To suppress waste of bonding material in a printing device. A printing device includes a dispenser, a squeegee, and a controller. The dispenser individually feeds bonding material to a plurality of apertures formed in a mask. The squeegee moves with an edge portion pressed against the mask and prints the bonding material fed to the apertures from the dispenser on a substrate. The controller drive-controls the dispenser and the squeegee.

Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, particles of solder powder 20 are arranged in a one-layer sheet form. In the solder powder-containing adhesive layer 3, solder powder 30 and an adhesive component 31 are mixed so as to have such a thickness that two or more layers of the solder powder 30 are stacked.

A tolerance compensation element is for circuit configurations having a DCB (direct copper bonded) substrate and a PCB (printed circuit board). A circuit configuration further includes the tolerance compensation element. A tolerance compensation element is positioned in a targeted manner between the DCB substrate and PCB in a gap A for the contact-connection of components on the DCB substrate via additive manufacturing and is formed so as to close the gap.

A printing device includes a storage that stores allowable time for which use of solder supplied to a screen mask can be allowed, a timer that measures time for which the solder is supplied to the screen mask, a determination unit that determines whether or not the solder supplied to the screen mask has exceeded the allowable time based on time measured by the timer, and a notifier that notifies a worker in a case where the determination unit determines that the solder supplied to the screen mask has exceeded the allowable time. The timer measures time by weighting a measurement interval of time for which the solder is moved on the screen mask by a squeegee so as to become greater than a measurement interval of time for which the solder does not move on the screen mask.