A lamination circuit board structure lamination circuit board structure includes a printed circuit board substrate including conductive wiring traces on at least a first wiring face, a prepreg layer formed over the first wiring face, and a patch having an area smaller than 1,000 mm.sup.2. The patch includes conductive wiring traces formed on a wiring face and is laminated to the printed circuit board substrate over the prepreg layer, oriented with the wiring face in contact with and pressed into the prepreg layer. Portions of the prepreg layer fill interstices between the conductive wiring traces.

A component-embedded substrate includes a cavity including through-holes penetrating through resin sheets in a stacked body of resin sheets having flexibility. An electronic chip component including external electrodes is disposed in the cavity. The resin sheet on which the electronic chip component is located is provided with through-holes into which conductive pastes are filled. The resin sheet includes cut-away portions communicating with a through-hole and located at a distance from each other across the through-hole. When this stacked body is hot-pressed, the conductive pastes overflow from the through-holes. However, the overflowing conductive pastes enter the cut-away portions.

A laser soldering technique prevents generation of scorching of a substrate or heat-susceptible components in the surroundings, residues, etc. A method includes adjusting a height of the laser soldering device 1 to a position at which laser light has a preset irradiation diameter D1 larger than a diameter of a solder droplet S, irradiating the solder droplet S with the laser light to heat the solder droplet S to a temperature at which a flux solvent component volatilizes and a solder powder does not melt; adjusting the height of the laser soldering device to a position at which the laser light has a preset irradiation diameter D2 smaller than the diameter of the solder droplet S, and irradiating the solder droplet S with the laser light to heat the solder droplet S to a temperature at which the solder powder melts, and performing soldering.

As electronic equipment has become smaller in size, printed circuit boards which cannot be subjected to cleaning have been developed, and a no-clean lead-free solder paste is becoming necessary. In order for a solder paste not to require cleaning, it is necessary that the color of the residue be transparent and that the residue be non-tacky. A maleated rosin, which is a rosin suited for no-clean paste, has a high acid value so it is not suitable for a flux for lead-free solder. As a means of suppressing a reaction between a flux containing a maleated rosin and a Sn—Ag—Cu based solder alloy powder, a Sn—Ag—Cu—Sb based solder alloy powder is used which adds 1-8 mass % of Sb to a Sn—Ag—Cu based solder alloy. As a result, it is possible to provide a solder paste which has the excellent effect that the solder paste does not easily undergo changes over time and has a long pot life.

The present invention relates to an inspection apparatus and method, and a system and a method for mounting components including the same. In the system for mounting components according to the present invention, solder paste inspection equipment receives mounting tolerance information from component mounting equipment, generates warp information of a flexible array board by measuring the flexible array board, generates mount-impossible information on a region where mounting of components is impossible by comparing the mounting tolerance information and the warp information, and transmits the mount-impossible information to the component mounting equipment. The component mounting equipment mounts components on remaining regions except for the region where mounting of components is impossible based on the mount-impossible information.

A paste supply apparatus includes: a pot holder which holds a paste pot including an inner lid movable in a container; an ejecting member; an annular protruding portion protruding downward from a lower surface of the ejecting member; a suction power generating mechanism which generates suction power in an internal space surrounded by the annular protruding portion; and an ejecting member lifting unit which moves up and down the ejecting member, The ejecting member lifting unit causes the ejecting member to press down the inner lid of the paste pot held by the pot holder to eject the paste from the through hole, and thereafter lifts the ejecting member which holds the inner lid by the suction power generated within the internal space of the annular protruding portion by the suction power generating mechanism.

A working machine for a board including a working device that selectively performs work for mounting conductive balls on a circuit board by a ball holder and work for transferring viscous fluid onto the circuit board by transfer pins, and a tray in which the viscous fluid is stored, when the conductive balls are to be mounted on the circuit board, the viscous fluid being transferred onto the circuit board by the transfer pins and the conductive balls having been immersed in the viscous fluid are mounted on the transferred viscous fluid. Accordingly, the conductive balls can be fixed onto the circuit board by the viscous fluid, which is transferred onto the circuit board by the transfer pins, and the viscous fluid that adheres to the conductive balls due to the immersion of the conductive balls in the viscous fluid.

A method for controlling an ejector is disclosed, wherein the ejector comprises an actuator arrangement configured to eject a droplet of viscous medium onto a substrate, and wherein the droplet forms part of a sequence of a plurality of droplets. The method comprises obtaining a control parameter for controlling the operation of the actuator arrangement, and operating the actuator arrangement, using the control parameter, in order to eject the droplet. The obtained control parameter is based on at least one of: a time period between the droplet and a previous droplet in the sequence, a difference in target size of the droplet and a size of the previous droplet in the sequence, and the droplets position in the sequence.

A method for making a firmly-bonded connection involves a) providing an electronic component and a substrate having surfaces to be connected; b) applying a copper paste onto at least one of the surfaces and drying the layer of copper paste; c1) applying a solder agent onto the copper paste and arranging the component and the substrate in contact via the combination of copper paste and solder agent; or c2) arranging the component and the substrate in contact via the dried copper paste, and applying a solder agent next to the layer of dried copper paste; and d) soldering the arrangement. The copper paste contains (i) particles of copper, copper-rich copper/zinc alloy, and/or copper-rich copper/tin alloy containing a phosphorus fraction of 0 to ≦500 wt-ppm, (ii) solder particles which are tin, tin-rich tin/copper alloy, tin-rich tin/silver alloy, and/or tin-rich tin/copper/silver alloy, and (iii) vehicle.

A solder paste that contains or consists of (i) 10-30% by weight of at least one type of particles that each contain a phosphorus fraction of >0 to ≦500 wt-ppm and are selected from copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 60-80% by weight of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 3-30% by weight solder flux, in which the mean particle diameter of metallic particles (i) and (ii) is ≦15 μm.