An electrical connector includes an insulating body, multiple terminals respectively correspondingly accommodated in the insulating body, and a shielding member provided on the insulating body. The terminals includes at least one grounding terminal and at least one signal terminal having identical structures. Each terminal includes a base, an elastic arm bending upward and extending from the base for being conductively connected with a chip module, and at least one strip connecting portion formed by extending upward from the base for being connected with a strip. The shielding member is provided with multiple holes for the grounding terminal and the signal terminal to pass therethrough, and at least one abutting portion corresponding to the strip connecting portion of the grounding terminal and protrudingly extending toward at least one of the holes so as to be in contact with the strip connecting portion of the grounding terminal.

An electric contact configured to make a section between a first contact part and a second contact part extendable/contractible. A spring part has a wave-like shape by continuously forming wave-shaped parts alternately on one and the other sides of an axis L as a center for connecting the first contact part and the second contact part, and is formed into a cylindrical shape while having a projection of the wave-shaped part on one side confronting a recess between projections of the wave-shaped parts on the other side. The projection of the wave-shaped part on the one side enters into the recess between the wave-shaped parts on the other side to bring the projection on the one side into abutment on the projection adjacent to the recess upon contraction of the spring part to stop a contracting motion, and establish a conduction state between the projections abutted on each other.

A connector for electrically connecting to conductive structures formed on a semiconductor device includes a core including an isolation layer and signal vias and ground vias formed in the isolation layer; a first ground plane formed on a surface of or in the core and electrically connected to the ground vias; a first set of contact elements formed on a first surface of the core and electrically connected to the signal vias to form signal pins; a second set of contact elements formed on the first surface and electrically connected to a subset of the ground vias to form ground pins. The remaining ground vias without contact elements form buried ground vias. The first and second sets of contact elements are arranged on the first surface of the core to surround each signal pin by at least one adjacent ground pin and one or more adjacent buried ground vias.

An electrical connector includes an insulative housing retaining a plurality of contacts therein. The contact includes a mating part with a first body and a spring arm extending therefrom for mating a conductive pad of a CPU (Central Processing Unit), and a soldering part with a second body and a solder tail extending therefrom for mounting a solder ball thereon. The spring arm is downwardly pressed by the CPU to contact the soldering part when the CPU is mounted upon the electrical connector The mating part and the soldering part are spaced from each other either without any connection, or alternately linked with each other via a bridge transversely connected therebetween wherein the latter may optionally omit the barbed structure from one of the mating part and the soldering part.

Embodiments include a transmission line-land grid array (TL-LGA) socket, a method of forming the TL-LGA socket, and a semiconductor package assembly. The TL-LGA socket includes interconnects having a vertical portion and a horizontal portion. The TL-LGA socket has a housing body, where the vertical portions are disposed in the housing body, and the interconnects are disposed in the housing body in a cascaded configuration. The interconnect may have the horizontal portion coupled to the vertical portion and a pad on a conductive base layer of a package. The conductive base layer may include pads and corresponding pad openings surrounding the pads. The TL-LGA socket may have the horizontal portion disposed between and parallel to the base layer and a top conductive layer of the housing body. The TL-LGA socket may have the base layer and/or the conductive layer coupled to a ground reference.

This disclosure relates to a structure that conveniently and easily releases computer components from a supporting structure. A typical computer component would be a PCIe card within a GPU tray. The disclosed structure does not require the use of tools to release computer components, and can be used where computer components ordinarily cannot be released due to limitations of space. The structure lifts the computer component to a height where the computer component can be easily grasped by human fingers for removal of the component.

The socket of the present disclosure includes: a terminal unit assembly with a plurality of terminal units, each extending in a longitudinal direction, arranged along a lateral direction orthogonal to the longitudinal direction; and a frame member including an assembly accommodating recess that accommodates the terminal unit assembly. The terminal units each include: a terminal holding part extending in the longitudinal direction; a plurality of terminals; and a side wall. The plurality of terminals each includes a body held by the terminal holding part, a contact part protruding upward beyond an upper surface the terminal unit or protruding downward beyond a lower surface of the terminal unit, and a contact arm connecting the body and the contact part; and the side wall extends in the longitudinal direction, includes a plurality of abutting parts capable of abutting the contact arm, and is arranged adjacent to the terminal holding part in the lateral direction. When the contact part receives force in a vertical direction orthogonal to the lateral direction and the longitudinal direction, the side wall receives force toward one side in the longitudinal direction.

A connector for electrically connecting to conductive structures formed on a semiconductor device includes a core with first, second and third ground planes isolated from each other and signal vias and ground vias formed therein, conductive signal traces formed coplanar with the second ground plane and isolated from a conductive ground layer forming the second ground plane, where one or more conductive signal traces are shielded by the conductive ground layer and by the first and third ground planes. The connector includes a first set of contact elements electrically connected to signal vias that are electrically connected to first ends of the conductive signal traces and a second set of contact elements electrically connected to signal vias that are electrically connected to second ends of the conductive signal traces.

An electrical connector includes an insulating body and multiple terminals. The insulating body has multiple terminal holes running through an upper surface and a lower surface thereof. Each terminal has a connecting portion correspondingly located in a corresponding terminal hole, a conducting portion extending from the connecting portion, an elastic arm formed by bending upward and extending from the connecting portion upward out of the corresponding terminal hole, and a contact portion bending upward and extending from the elastic arm. When a chip module is pressed downward, a bottom surface of each conductive sheet of a circuit board downward abuts a top surface of the contact portion, and the elastic arm deforms downward. The contact portion, the elastic arm, the connecting portion and the conducting portion are integrally formed. A thickness of the connecting portion is greater than a thickness of the contact portion.

An electrical connector includes an insulating body and conductive terminals. The insulating body defines receiving holes, each of the receiving holes receiving a respective one of the conductive terminals. Each receiving hole includes a first hole portion, a second hole portion and a third hole portion. Each conductive terminal includes a main body, an elastic arm, and a connection portion. The main body is received in the second hole portion, the first hole portion and the third hole portion are respectively positioned on two opposite sides of the main body, and the elastic arm is at least partially positioned above the first hole portion. The insulating body includes a support portion located on a side of the main body, and the support portion and the third hole portion are located on the same side of the main body.