An electronic module includes a module substrate has an upper surface and a lower surface. The module substrate has a package pad array having package contact pads at the upper surface. The module substrate has a socket pad array having socket contact pads at the upper surface. The module substrate has guide pin locating pads associated with the socket pad array. The electronic module has an electronic package coupled to the package contact pads at the package pad array. The electronic module has guide pins surface mounted to the guide pin locating pads. The electronic module has a socket assembly coupled to the module substrate. The socket assembly has a socket housing holding socket contacts. The socket contacts are coupled to the socket contact pads at the socket pad array. The socket frame including pockets receiving the guide pins to locate the socket assembly relative to the module substrate.

A processing apparatus for controlling, measuring and/or regulating, comprising an appliance for installation for output and/or input, with an intermediate housing, a unit for display and/or operation, and a main board connected to the unit having a central computer unit, wherein the appliance for installation is provided for use in a device or for a device such as a weighing device, metering device, conveying device, screening device, grinding device, mixing device, filter device, status monitoring device and/or material analysis device, wherein the main board serves as an electronic platform regardless of use and has, for each use, a particular combination of interfaces to the device in question. Furthermore, the invention relates to a processing apparatus for controlling, measuring and/or regulating having such an appliance for installation.

A processor package module comprises a processor-memory stack including one or more compute die stacked and interconnected with a memory stack on a substrate. One or more photonic die is on the substrate to transmit and receive optical I/O, the one or more photonic die connected to the processor-memory stack and connected to external components through a fiber array. The substrate is mounted into a socket housing, such as a land grid array (LGA) socket. An array of processor package modules are interconnected on a processor substrate via fiber arrays and optical connectors to form a processor chip complex.

Techniques and mechanisms for coupling packaged devices with a dual-sided socket device. In an embodiment, two interfaces of the socket device comprise, respectively, first metallization structures and second metallization structures on opposite sides of a socket body structure. The first metallization structures each form a respective corrugation structure to electrically couple with a corresponding conductive contact of a first packaged device. The corrugation structures facilitate such electrical coupling each via a vertical wipe of the corresponding conductive contact. In another embodiment, a pitch of the first metallization structures is in a range of between 0.1 millimeters (mm) and 2 mm. One such metallization structure has a vertical span in a range of between 0.05 mm and 2.0 mm, where a portion of a side of the metallization structure forms a corrugation structure, and has a horizontal span which is at least 5% of the vertical span.

A power delivery module includes a frame having rails defining an opening that receives an electronic package. A bottom of the frame is mounted to a host circuit board and faces an upper surface of the electronic package. The frame is a layered structure including a power plate, a ground plate, and an insulator electrically isolating the power plate from the ground plate. The power deliver module includes module power contacts electrically connected to the power plate and extending from the bottom for electrical connection to package power contacts of the electronic package. Module ground contacts are electrically connected to the ground plate and extend from the bottom for electrical connection to package ground contacts of the electronic package. The module power contacts and the module ground contacts deliver power to the electronic package.

An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.

A cable socket connector assembly for an electronic system includes a socket assembly having a socket substrate including socket substrate conductors. The socket assembly has socket contacts extending between terminating ends and mating ends with the terminating ends terminated to corresponding socket substrate conductors and the mating ends configured to be terminated to corresponding package contacts of an electronic package of the electronic system. The cable socket connector assembly includes a cable assembly terminated to the socket assembly having an array of cables each having a cable conductor terminated to a corresponding socket substrate conductor. The socket contacts and the corresponding socket substrate conductors define electrical paths between the cable conductors of the cables and the package conductors of the electronic package.

A universal replaceable fan unit and method of reversing an airflow direction of a universal replaceable fan unit is provided. The universal replaceable fan unit includes a fan assembly designed to create an airflow from an intake end to an output end. The universal replaceable fan unit also includes a fan mounting that receives and secures the fan assembly in an operable position. The fan mounting includes a frame member and a securing member. The fan mounting is designed to allow the fan assembly to be moved between a first position defining a first airflow direction and a second position defining a second airflow direction. The first airflow direction is opposite the second airflow direction. The universal replaceable fan unit further includes an electrical connector removably attached to the fan assembly. The electrical connector allows electricity to be provided to the fan assembly for operation.

A socket connector includes a socket assembly having a socket frame, a socket substrate coupled to the socket frame and socket contacts terminated to the socket substrate. The socket substrate has first and second upper mating areas including first and second socket substrate conductors for mating with an electronic package and an electrical component, respectively. The socket contacts define an interface with the electronic package. The socket assembly is configured to electrically connect the electronic package with both a host circuit board and the electrical component.

A power delivery module includes a frame having rails defining an opening that receives an electronic package. A bottom of the frame is mounted to a host circuit board and faces an upper surface of the electronic package. The frame is a layered structure including a power plate, a ground plate, and an insulator electrically isolating the power plate from the ground plate. The power deliver module includes module power contacts electrically connected to the power plate and extending from the bottom for electrical connection to package power contacts of the electronic package. Module ground contacts are electrically connected to the ground plate and extend from the bottom for electrical connection to package ground contacts of the electronic package. The module power contacts and the module ground contacts deliver power to the electronic package.