The present disclosure discloses an electronic element support frame, an electronic element assembly, and an electrical assembly. The electronic element support frame has a body, an isolative wall, and a pair of retaining parts. The body has an axial direction. The isolative wall is arranged to continuously extend along the axial direction of the body. The pair of retaining parts are arranged on the body and disposed at two sides of the isolative wall, respectively. The retaining parts together with the isolative wall enclose a pair of accommodating parts, respectively. The accommodating parts extend continuously along the axial direction of the isolative wall to accommodate pins of the electronic element, respectively. The electronic element support frame of the present disclosure can avoid erroneous contact between the pins of the electronic element, thereby enhancing safety performance.

An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.

Disclosed is a socket apparatus for ball grid array (BGA) balls, including a base member of electrically insulative material, a plurality of electrical contact members disposed in row and column configuration attached to the electrically insulative material, a plate member extending in a row direction, and a plurality of extension members connected to the plate member and configured to press BGA balls of a mounted BGA into the plurality of electrical contact members when the plate member is pulled in a first direction.

Some forms relate to an electronic assembly that includes a plurality of electronic package. The electronic assembly includes a frame and a first electronic package mounted on the frame. The first electronic package includes a first pin grid array. The electronic assembly further includes a second electronic package mounted on the frame. The second electronic package includes a second pin grid array. The electronic assembly further includes an actuation mechanism on the frame. The actuation mechanism is configured to move the first electronic package and the second electronic package relative to the frame during operation of the actuation mechanism.

The present invention discloses an ejector pin device for chip packaging, which comprises a pin cylinder, a base and an ejector pin base module, wherein the pin cylinder sleeves the ejector pin base module, the base is located below the ejector pin base module and is configured to fix the ejector pin base module; and the ejector pin base module comprises a knob unit and a supporting unit. An effect of adjusting the knob unit can be acted on the corresponding supporting unit, so that the requirements of the numbers and positions of the ejector pins required by different products are satisfied and metal foreign matters are reduced, thereby improving the efficiency of replacing products by a worker.

An anti-misplug guiding module for mounting a CPU emulator into a motherboard socket is provided. The module includes a frame with upper and lower surfaces, latching structures at the corners for orientation-constrained engagement with a CPU emulator retention fixture, and a chamfered corner alignment structure for enforcing a single correct insertion orientation. The frame includes screw holes for attachment to the emulator and may have a hollow central region and openings to accommodate adapter pins and protruding screws without altering vertical spacing. In some embodiments, a temperature sensing circuit integrated on the lower surface detects localized thermal conditions near the socket. When a threshold is exceeded, a comparator triggers visual indicators and optionally activates a fan via a control circuit.

A processing apparatus for controlling, measuring and/or regulating, comprising an appliance for installation for output and/or input, with an intermediate housing, a unit for display and/or operation, and a main board connected to the unit having a central computer unit, wherein the appliance for installation is provided for use in a device or for a device such as a weighing device, metering device, conveying device, screening device, grinding device, mixing device, filter device, status monitoring device and/or material analysis device, wherein the main board serves as an electronic platform regardless of use and has, for each use, a particular combination of interfaces to the device in question. Furthermore, the invention relates to a processing apparatus for controlling, measuring and/or regulating having such an appliance for installation.

An apparatus and method for reducing differential cross-talk in a pin arrangement of a socket are described. Socket pins within a differential pair use a modified shape to tighten the intra-pair pin coupling to reduce the crosstalk without changing the pin map. The middle vertical segment of one pin of a diagonally adjacent differential pin pair is modified to be closer to the other pin than other corresponding locations of the pins. The spring beam that extends from the middle vertical segment of the one pin is modified to accommodate the package landing pad that the spring beam contacts to maintain a uniform pitch.