A rotating buckle includes a first fixing member, a second fixing member, and a hook body. The first fixing member includes protruding posts. The second fixing member defines limiting slots and comprises a fixing portion. The fixing portion fixes the second fixing member to the first fixing member through a first resilient member. The hook body is received between the first fixing member and the second fixing member. The hook body defines a mounting hole, an inclined slot, and a receiving slot. The protruding posts are inserted through the mounting hole, the inclined slot, and the limiting slots. The fixing portion is inserted through the receiving slot. The hook body is fixed to the first fixing member through a second resilient member.

Embodiments include a carrier assembly, a method of forming the carrier assembly, and a semiconductor package. A carrier assembly includes a socket on a package substrate, and a carrier having a transparent material, a first opening, first alignment openings, and barbs. The carrier assembly also includes an electronic device embedded into the first opening of carrier and coupled to the carrier by barbs. The carrier assembly further includes a bolster plate on the package substrate, the bolster plate having a second opening, loading studs, and second alignment openings, and the second opening surrounds the socket. Each loading stud is positioned on a corner edge of the bolster plate. The carrier assembly may align the first alignment openings above the second alignment openings to couple the carrier onto the bolster plate. The carrier assembly may include a heat sink disposed on the electronic device, carrier, and bolster plate.

A bracket for mounting a processor and a support structure for receiving bracket-supported processors for cluster computing are provided. In some embodiments, a bracket may be configured to receive a processor and fasten the processor to the bracket. The bracket may be configured to mount the processor to a support structure. The support structure may be configured to receive an array of brackets. The support structure may be configured to be stacked in combination with additional support structures.

An example electrical connector includes a body to receive a circuit board. The body includes a first end and a second end. The electrical connector also includes a first latch rotatably attaches to the first end. The electrical connector further includes a second latch rotatably attaches to the second end. The electrical connector further includes a link member attached to the body. In response to a rotation of the first latch, the link member is to slide across the body from the first latch towards the second latch to rotate the second latch.

A motherboard, comprises a signal transmitting terminal and a plurality of connectors connected to the signal transmitting terminal, respectively. Each of the connectors supports a plurality of connection specifications for assembling a detachable module. The detachable module includes a golden finger connecting member and an I/O port.

A securing mechanism for retaining a CPU to an electrical connector mounted upon a top surface of the PCB, includes a fastening device mounted upon the top surface of the PCB beside the electrical connector, and a back plate mounted upon the undersurface of the PCB and located between the PCB and a metallic case. The fastening device cooperates with the back plate to be secured to the PCB via a first set of fixing units. The case forms an opening/recessed region to receive a thickened central region of the back plate and is secured to the back plate via a second set of fixing units surrounding said opening. The thickened central region is fully received within the opening in the vertical direction. The first set of fixing units are located in the central region of the back plate.

A computing system including a chassis and a canister slidably insertable within the chassis, where the canister includes first and second angled slots. A CPU module mounted within the canister includes a plurality of first connectors and a plurality of I/O modules are positioned within the chassis and include a second connector. A plurality of riser cards including a third connector coupled to a bottom edge and a fourth connector coupled to a rear edge, where the third connector on each riser card is connected to one of the first connectors and the fourth connector on each riser card is connected to one of the second connectors. Actuation of ejector levers pivotally mounted to the bottom panel of the chassis cause pins to move in the angled slots and the canister to move relative to the chassis so as to connect and disconnect the second and fourth connectors.

This disclosure relates to a host computer for vehicle including a casing, an electronic assembly, a thermal conductive block, at least one input-output interface and at least one dust-proof assembly. The casing has an opening and a heat dissipation structure respectively located at two opposite sides thereof. The casing has at least one mount hole located between the opening and the heat dissipation structure. The electronic assembly includes a circuit board, a processor and a first connector. The circuit board is located in the casing. The processor and the first connector are respectively located at two opposite sides of the circuit board. The opening exposes the first connector. The thermal conductive block is connected to the processor and the heat dissipation structure. The input-output interface is mounted at the mount hole. The dust-proof assembly is located at the mount hole to cover part of the input-output interface.

A computing system including a housing assembly having a front and a rear, a CPU module positioned towards the front of the housing assembly and including a plurality of I/O connectors, and a plurality of I/O modules positioned towards the rear of the housing assembly, where each I/O module includes a second I/O connector. The computing system also includes a plurality of riser cards each having a PCB with opposing side surfaces, a front edge, a rear edge, a top edge, a bottom edge, a third I/O connector coupled to the bottom edge and a fourth I/O connector coupled to the rear edge. The third I/O connector on each riser card is connected to one of the first I/O connectors and the fourth I/O connector on each riser card is connected to one of the second I/O connectors so that the riser cards are oriented in parallel with each other.

A card edge connector includes an insulative elongated housing defining an elongated slot extending along a longitudinal direction. Two rows of contacts are disposed in the housing so as to be paired in each cross-sectional plane in a transverse direction. A pair of towers are located at two opposite ends of the housing in the longitudinal direction. A pair of ejectors/lockers are disposed in the corresponding towers and rotational about a pivot extending along the transverse direction. Each ejector has a bottom kicker adapted to intimately confront a bottom edge of the memory module for ejecting the memory module out of the housing. The kicker slightly interferes with the contacting sections of the neighboring contacts when the ejector is located at an outer position so as to be retained in position with regard to the housing.