A modular data center includes: a modular information technology component (MITC), in which the MITC includes an information handling system (IHS) and a utility control component (UCC), in which the IHS and the UCC are affixed to a bottom side of the MITC; and a front access component and a rear access component, in which the front access component is connected to a front side of the MITC, in which an area of the front access component is equal to an area of the front side of the MITC, in which the rear access component is connected to a rear side of the MITC, and in which an area of the rear access component is equal to an area of the rear side of the MITC.

A modular data center includes: a modular information technology component (MITC), in which the MITC includes a plurality of information handling systems (IHSs), a utility control component (UCC), and a first connection interface, in which the first connection interface includes a first set of mechanical and electrical connection components (MECCOMs); and a modular environmental control component (MECC), in which the MECC includes a plurality of environmental control components (ECCs) and a second connection interface, in which the second connection interface includes a second set of MECCOMs to be paired with the first set of MECCOMs to generate at least a portion of the modular data center, and in which the first connection interface is connected to the second connection interface, in which an area enclosed by the first connection interface is equal to an area enclosed by the second connection interface.

A modular information technology component includes: an information handling system; a floor, in which the floor includes a floor track apparatus and the information handling system is located on the floor; and a rack mounting component, in which the rack mounting component affixes the information handling system to the floor track apparatus.

An electrical connector includes an insulative housing extending in a horizontal direction, a plurality of conductive terminals retained in the insulative housing, a metallic stiffener surrounding the insulative housing, a load plate pivotally mounted upon the metallic stiffener and moveable between an open position and a closed position, and a carrier frame used for retaining and receiving a central processing unit (CPU) and carrying the CPU to the insulative housing. After retaining the CPU, the carrier frame is mounted on the insulative housing along a vertical direction perpendicular to the horizontal direction. The load plate is rotated to the closed position to fix the CPU on the insulative housing.

A bracket for mounting a processor and a support structure for receiving bracket-supported processors for cluster computing are provided. In some embodiments, a bracket may be configured to receive a processor and fasten the processor to the bracket. The bracket may be configured to mount the processor to a support structure. The support structure may be configured to receive an array of brackets. The support structure may be configured to be stacked in combination with additional support structures.

A bracket for mounting a processor and a support structure for receiving bracket-supported processors for duster computing are provided. In some embodiments, a bracket may be configured to receive a processor and fasten the processor to the bracket. The bracket may be configured to mount the processor to a support structure. The support structure may be configured to receive an array of brackets. The support structure may be configured to be stacked in combination with additional support structures.

A bracket for mounting a processor and a support structure for receiving bracket-supported processors for cluster computing are provided. In some embodiments, a bracket may be configured to receive a processor and fasten the processor to the bracket. The bracket may be configured to mount the processor to a support structure. The support structure may be configured to receive an array of brackets. The support structure may be configured to be stacked in combination with additional support structures.

A transmission device includes a housing, and a plurality of plug-in assemblies mounted in the housing, wherein each of the plug-in assembly that executes signal transmission and includes a board, heat generating parts mounted over the board and a fan that cools the heat generating parts.

A bracket for mounting a processor and a support structure for receiving bracket-supported processors for duster computing are provided. In some embodiments, a bracket may be configured to receive a processor and fasten the processor to the bracket. The bracket may be configured to mount the processor to a support structure. The support structure may be configured to receive an array of brackets. The support structure may be configured to be stacked in combination with additional support structures.

A computer case has a box having a back board with an opening; and a graphics card fixing board having a plurality of graphics card shields, wherein the graphics card fixing board corresponds in position to the opening of the back board and thereby is unfastenably attached to the back board of the box either longitudinally or transversely, allowing the graphics card shields to be lengthwise parallel to a height of the box whenever the graphics card fixing board is attached to the back board of the box longitudinally, and allowing the graphics card shields to be lengthwise perpendicular to the height of the box whenever the graphics card fixing board is attached to the back board of the box transversely. Therefore, a graphics card is selectively mounted in place, lying or upright, in the computer case.