A connection structure, of a short bar forming a conductive path and a land on a printed circuit board, in which the short bar includes a plate portion having a flat plate shape and a protrusion protruding in a stepped shape from a surface of the plate portion, the protrusion is threadably fastened to the printed circuit board by a screw inserted into a land-side through hole formed through the land, from an opposite side of the printed circuit board with respect to the protrusion, in a state where a flat surface portion formed, at a position spaced apart from the surface of the plate portion, on an outer surface of the protrusion is in close contact with the land.

In the printed circuit board 100 in the power supply device, cover layers C1 and C2 are formed on a surface other than the connection areas 95A′ and 95B′ within a coil pattern EC, which corresponds to a surface-shaped exposure area exposed to the outside so that the size of the surface-shaped exposure area to which the conductive pattern E is exposed is adjusted, so that an effect, which restrains a conductor from being damaged, especially at a time of carrying the printed circuit board 100 while maintaining a heat radiating property of the conductor, is achieved.

An electronic control unit includes a substrate, an electronic component, a heat sink, a cover, a heat accumulator, and a screw. A wiring pattern is formed on the substrate. The electronic component is mounted on the substrate and generates heat upon energization thereof. The heat sink is provided on one side of the substrate in its thickness direction. The cover is made of resin and is provided on the other side of the substrate in its thickness direction. The heat accumulator is fixed to a part of the cover on the substrate-side and is in contact with a surface of the substrate on the cover-side. One end of the screw is connected to the heat sink. A central portion of the screw is inserted through a hole passing through the substrate in its thickness direction. The other end of the screw is connected to the heat accumulator.

A substrate and a first circuit board each have an upper side and a lower side. The substrate lower side is connected to a cooling body. On the upper side of the substrate, first electronic switching elements connect an alternating current potential at a phase terminal to a high direct current potential at a first potential terminal and to a low direct current potential at a second potential terminal. Second electronic switching elements connect the alternating current potential to a middle direct current potential at a third potential terminal. The substrate is spaced from the first circuit board under the first circuit board lower side. The upper side of the substrate faces toward the first circuit board. The second switching elements are at least on the upper side of the first circuit board, possibly additionally also on the lower side of the first circuit board.

A power-conversion device includes a power-converter converting power from the power-supply. A filter-capacitor part eliminates noise from power in the power-converter. A housing contains a power unit comprising the filter-capacitor part and the power-converter stacked on the filter-capacitor part and to enable the power unit to be taken in and out from an upper surface and a side surface thereof. A guide rail is located on a bottom surface of the housing to extend in a direction substantially perpendicular to the side surface and guides the power unit when the power unit is taken in and out from the side surface of the housing. A protrusion is located on the filter-capacitor part to fit upward into a hole or a concave portion formed on the power-converter and guides the power-converter when the power-converter is taken in and out from the upper surface of the housing.

A power converter is provided to improve connection reliability of internal components of the power converter. The power converter may include a power semiconductor module that converts DC current into AC current, a casing that forms a housing space for housing the power semiconductor module, an AC relay bus bar that is connected to an AC terminal of the power semiconductor module by weld connection, and an AC terminal block that is connected to an AC terminal of a motor. The AC relay bus bar may be supported by the casing through an insulating member, and the AC terminal block may be connected to the AC relay bus bar and supported by the casing.

A power-supply device including: a casing having a space therein and formed by metal stamping or having a thickness ranging from 0.3 to 3.0 mm; and a circuit board disposed inside the casing, wherein the casing includes a casing portion having an opening, and a cover portion disposed to cover the opening of the casing portion, the casing portion has a through hole formed at a position corresponding to a connector terminal connected to the circuit board, and the cover portion includes a storage portion bulging outward from the casing, the storage portion storing either one of an electronic component provided to a face of the circuit board which faces the cover portion and an electronic component provided across the circuit board.

Disclosed herein is an inverter. The inverter includes a base provided with a heat dissipation part, a main board disposed on the base to output an input power along an independent power flow through a rectification part and a inverter part, and a control board fixed to be electrically connected to the main board to form a flow of a secondary power and a flow of an electrical signal, the flow of the secondary power and the flow of the electrical signal being independent from each other.

Disclosed herein is a motor drive unit. The motor drive unit includes a base part; a middle base part disposed above the base part; a heat discharging part mounted on the base part and disposed under the middle base part to slide on the middle base part, wherein an area in which the heat discharging part is installed is smaller than an area of the middle base part; and a power PCB part disposed above the middle base part, an EMC PCB part disposed above the power PCB part with a spacing; a control PCB part coupled with a side portion of the power PCB part; and a condenser unit penetrating the middle base part to be fixed to it, wherein a lower end of the condenser unit is disposed on a side of the heat discharging part.

A semiconductor module includes a first power semiconductor element having a first surface and a second surface. The semiconductor module also includes a second power semiconductor element having a first surface and a second surface. The semiconductor module also includes first, second, third, and fourth conductor plates, and a connecting part. The connecting part is integrally formed with the second conductor plate, extends toward the third conductor plate, and is connected to the third conductor plate.