Modular inverter platforms and methods for providing physical and electrical configurability and scalability are disclosed. The modular inverter apparatus includes a printed circuit board (PCB) comprising at least two modules and one or more mounting components structured to switch the at least two modules between a plurality of physical configurations. The modular inverter apparatus also includes a plurality of electrical interconnections structured to electrically connect the at least two modules and to switch the at least two modules between a plurality of electrical configurations.

Provided is a power converter without a crack in a board or peeling-off of a pattern at the time of being grounded to a metal base. A GND protruding terminal is molded in a metal base in an integrated manner. A drive circuit board is provided with rectifier elements, first to third wiring patterns, and a ground pattern. A ground metal conductor, which connects the ground pattern and the metal base, is placed on a top surface of the GND protruding terminal, and is screwed to a female screw portion of the GND protruding terminal.

A semiconductor module comprises a semiconductor device; a substrate, on which the semiconductor device is attached; a molded encasing, into which the semiconductor device and the substrate are molded; at least one power terminal partially molded into the encasing and protruding from the encasing, which power terminal is electrically connected with the semiconductor device; and an encased circuit board at least partially molded into the encasing and protruding over the substrate in an extension direction of the substrate, wherein the encased circuit board comprises at least one receptacle for a pin, the receptacle being electrically connected via the encased circuit board with a control input of the semiconductor device.

An electric power conversion apparatus includes a semiconductor module, a control circuit board and a wireless communication unit. The semiconductor module has at least one semiconductor element built therein. The control circuit board is configured to control the semiconductor module. The wireless communication unit is configured to wirelessly communicate electrical signals between the semiconductor module and the control circuit board. The wireless communication unit includes a first communication device provided on the control circuit board so as to face the semiconductor module, and a second communication device provided on the semiconductor module so as to face the control circuit board. Moreover, there are no obstacles on a straight path between the first and second communication devices.

The integrated dual-motor controller includes a controller housing, a bus magnetic ring component, an all-in-one module, a control plate, an isolation plate and a drive plate. The bus magnetic ring component, the all-in-one module, the control plate, the isolation plate and the drive plate are all integrated in the controller housing. The integrated dual-motor controller is designed to achieve a high level of integration, and a modular design is used inside to facilitate mounting and reduce the size.

A mechano-electrical integrated power conversion device includes power drive unit and voltage converter that are housed within a single housing box and formed as a module. The box includes box body, upper lid member, and side lid member. The box body includes: a box body main portion disposed above a casing of an electric motor; and a box body remainder portion connected integrally to a side wall of the box body main portion and extending downwardly to a side of the casing. The upper lid member is mounted on the box body main portion, a first housing chamber being defined therebetween and housing the power drive unit. The side lid member is mounted on a side open end part of the box body remainder portion, a second housing chamber being defined between the box body remainder portion and the side lid member and housing the voltage converter.

The fire shield enclosure makes use of a set of external metal shields that can be attached to a wall mounted variable frequency drive (VFD) in the field either before or after the VFD has been installed for the purpose of providing adequate protection from a fire as defined by a UL2043: Fire Test for Heat and Visible Smoke Release (UL2043 fire test). The fire shield enclosure pertains to a VFD for which may use a polymer material as an integral part of its enclosure housing.

Electronic control system for electric machine and electric assembly. The electronic system includes an electronic power module for converting a DC current into an AC current, and an electronic control module configured to generate a control signal for the electronic power module. The electronic control module includes a first electronic sub-assembly including at least a first trace and at least one electronic control component, the at least one electronic control component being electrically connected to the at least one first trace. A second electronic sub-assembly, separate from the first electronic sub-assembly, includes an electronic control device for generating the control signal and/or an electronic measuring device for measuring an operating parameter of the electronic power module. The second electronic sub-assembly being connected to the first electronic sub-assembly by a first control pin. An electric assembly includes the electronic system and a rotating electric machine.

A vehicle inverter terminal sealing arrangement comprising a electrical terminal of said inverter sealed into an inverter and having a distal portion of said terminal protruding external to said inverter, wherein said terminal is sealed into said inverter by means of a resilient peripheral seal, said peripheral seal surrounding a portion said terminal, and said seal being wedged between said terminal and at least one portion of said inverter.

A power conversion apparatus with modified cooling properties has been disclosed. The apparatus comprises an AC port, at least one DC port, a chassis, at least one power conversion module mounted in said chassis connectable to off-board conductors and said AC and said at least one DC ports, a module heat sink attached to each one of said at least one power conversion module for cooling said module, wherein said off-board inductors are mounted in said chassis together and separate from modules with one or more of an inductor heat sink and cooling fluid circulator for cooling said inductors.