A power supply includes a metal case, a power conversion module and an insulation connecting plate. The power conversion module is arranged in the metal case and at interval with the metal case. The power conversion module includes a circuit board. The insulation connecting plate is respectively connected with the circuit board and the metal case. The insulation connecting plate is isolated between at least a portion of the circuit board and at least a portion of the metal case. A creepage distance between the metal case and a high voltage area of the circuit board are extended by the insulation connecting plate so as to fulfill the safety requirements.

Disclosed herein is a cooling system for two-dimensional array power converters. The cooling system includes: a plurality of power converters arranged in two-dimension; a compressor configured to generate compressed air; vortex tubes each installed in the respective power converters, the vortex tubes configured to generate low-temperature air based on compressed air from the compressor; valves installed between the compressor and the vortex tubes; temperature sensors each installed in the respective power converters to measure temperature inside the power converters; and a controller configured to determine whether to supply the low-temperature air into the power converters by using the vortex tubes, based on the temperature measured by the temperature sensors, and to control the valves depending on a result of the determination.

Disclosed is a power supply system, including: a high-voltage input power distribution cabinet, a high-low voltage conversion cabinet, and a low-voltage output and control cabinet, the high-low voltage conversion cabinet is provided with at least one high-voltage chamber provided with a high-voltage bus bar, at least one low-voltage chamber provided with a low-voltage bus bar, an insulating partition between the high-voltage chamber and the low-voltage chamber and a plurality of power supply modules; each of the power supply modules bridges the high-voltage and low-voltage chambers and includes a high-voltage cavity, a low-voltage cavity and an isolation unit, connecting terminals of the high-voltage and low-voltage cavities are respectively disposed corresponding to the high-voltage and low-voltage chambers and electrically connected to the high-voltage and low-voltage bus bars respectively, and the isolation unit is connected to one end of the high-voltage cavity and one end of the low-voltage cavity.

A frame portion is a plate-like member to which a cooler is attached for cooling an electric circuit element configured to operate for power conversion that causes generation of heat. The capacitor is a structural member disposed in a direction perpendicular to the frame portion and including a capacitor element electrically connected to the electric circuit element. The capacitor includes a first support surface and a second support surface that are external surfaces facing in opposite directions from each other and parallel to the direction perpendicular to the frame portion. The first frame and the second frame each have an end portion fixed to a connection frame. The first frame includes a first attachment surface fixed to a first support surface. The second frame includes a second attachment surface fixed to a second support surface.

A subrack including a frame defining a subrack space and adapted to receive a device module to an operative position, the frame comprising four side walls and an end wall. The subrack comprises a coupling system adapted for coupling the subrack to four other subracks in order to form a subrack matrix, the coupling system comprising at least one wall recess on an inner surface of each of the side walls, and at least one primary screw hole in each of the side walls such that the at least one primary screw hole is located in the at least one wall recess.

The invention relates to a medium or high voltage converter (2), preferably a modular multilevel converter, as well as to a power module (1), which comprises at least one power semiconductor module (4), at least one energy storage module (5), at least one cooling device (6), and wherein the cooling device (6) is formed as a cooling plate (7) which can be run through by a coolant, in particular flown through by a cooling liquid, and which has a smaller cooling plate thickness (10) as compared to a cooling plate length (8) and a cooling plate height (9) and the cooling plate (7) has at least one support region (12) defined by the cooling plate length (8) and the cooling plate thickness (10) and/or a part of the cooling plate height (9) of the cooling plate (7), for load transfer of the power module (1) onto a rack (3) of the medium or high voltage converter (2).

An insulating piece for an electronic device is provided. The electronic device includes a first housing component and a second housing component. The first housing component includes at least one hook portion connected to the second housing component. The insulating piece includes a first covering portion, a second covering portion and at least one concave structure. The first and second covering portions extend in different directions. The concave structure is connected between the first and second covering portions. The concave structure and the second housing component form an accommodating space therebetween to accommodate the hook portion. The first and second covering portions cover inner sides of the first and second housing components respectively.

An apparatus includes an enclosure comprising first and second abutting compartment and at least one cable passing between the first and second compartments through a sealing multi-cable transit mounted in a wall shared by the first and second compartments. The first compartment may contain arc-generating equipment and the second compartment may contain equipment vulnerable to arc damage. The first compartment may include a medium-voltage cubicle and the second compartment may include a low-voltage control cubicle.

The present disclosure relates to a power supply system (1) including a main unit (10) including a protective main housing (11) and a distribution circuit (20) disposed in the protective main housing (11); a first module unit (30a) including a first protective module housing (31a) and a first electric module (40a) disposed in the first protective module housing (31a). The system also includes a passive cooling system (70) for cooling of the main unit (10) and the first module unit (30a). A first protective connection system (CS1) and a second protective connection system (CS2) is also a part of the system, wherein the first protective connection system (CS1) is configured to provide a releasable electrical and mechanical connection between the main unit (10) and the first module unit (30a). The passive cooling system (70) includes cooling fins (71) disposed on an outer surface of the first protective module housing (31a).

This invention discloses a rackless modular power electronic system that optimizes thermal management, modularity, manufacturability, transportation, and installation. Such a power electronic converter system consists of one or more modular power electronic converters mounted one-on-top-of-another and/or one-next-to-another through mounting units, such as screws, nuts and bolts. Each modular power electronic converter is built with a case with heat-dissipating fins on the exterior surface and with vertical and horizontal mounting mechanisms, such as holes, bolts, nuts and screws, which are aligned vertically and horizontally, respectively, for easy mounting. One or more electric fans can be mounted to the system to enhance heat dissipation. Possible applications include any field that adopts power electronic converters, e.g., in wind power, solar power, storage systems, home appliances, IT equipment, motor drives, electric vehicles, more-electric aircraft, and all-electric ships.