A power electronics system comprising an environmentally sealed electronics compartment for housing power electronics equipment is provided. The system includes a heater configured to raise the air temperature inside the sealed electronics compartment, an internal environmental sensor for sensing conditions within the sealed electronics compartment, and providing environmental data, and an external environmental sensor for sensing conditions outside the sealed electronics compartment, and providing environmental data, and a controller. The controller is configured to receive environmental data from the internal environmental sensor, and the external environmental sensor, and control the operation of the heater to maintain a set humidity level. The system further includes a passive water vapor transport membrane placed in the walls of the sealed electronics compartment.

The invention relates to a medium or high voltage converter (2), preferably a modular multilevel converter, as well as to a power module (1), which comprises at least one power semiconductor module (4), at least one energy storage module (5), at least one cooling device (6), and wherein the cooling device (6) is formed as a cooling plate (7) which can be run through by a coolant, in particular flown through by a cooling liquid, and which has a smaller cooling plate thickness (10) as compared to a cooling plate length (8) and a cooling plate height (9) and the cooling plate (7) has at least one support region (12) defined by the cooling plate length (8) and the cooling plate thickness (10) and/or a part of the cooling plate height (9) of the cooling plate (7), for load transfer of the power module (1) onto a rack (3) of the medium or high voltage converter (2).

The invention relates to a power module (4) for a medium or high voltage converter (1), preferably a modular multilevel converter, comprising at least one power semiconductor module (7), preferably an IGBT assembly, at least one energy storage module (9), preferably a capacitor module, at least one cooling device (14), wherein the cooling device (14) is formed as a cooling plate (17) that can be run through by a coolant, in particular flown through by a cooling liquid, and the at least one power semiconductor module (7) and/or the at least one energy storage module (9) are arranged on an upper side (18) and/or bottom side (19) of the cooling plate (17), and wherein the at least the power semiconductor module (7) is connected with the cooling plate (17) in a thermally conductive manner, and wherein the cooling plate (17) is provided for load-bearing support on a rack (2) of an assigned receiving space (3) of the medium or high voltage converter (1) and comprises support surfaces (16) projecting laterally in the transverse direction (11) with respect to at least one energy storage width (21) of the energy storage module (9).

An apparatus, such as a power routing apparatus, includes an enclosure having first and second compartments having respective first and second opposing walls. A cooling structure is disposed between the first and second compartments and has a coolant passage defined therein configured to support a coolant flow in a direction parallel to the first and second opposing walls. First and second semiconductor switches (e.g., static switches) are disposed on the first and second walls on opposite sides of the coolant passage and are configured to be cooled by the coolant flow.

A switch cabinet includes an electric component, e.g. a power converter, having at least three cable connection elements. Each of the cable connection elements has an electric contact area capable of being contacted by a cable lug, and an assembly area. The cable connection element is fastenable at the assembly area to a body of the electric component and is connected to the body of the electric component at the assembly area. The electric contact area and the assembly area are arranged on the cable connection element in such a way that a plane of the electric contact area and a plane of the assembly area intersect at a positioning angle.

The invention provides the system supporting variable speed drive comprising a three-sided service cabinet embodiment. The cabinet comprising two heat exchange circuits limited by the basic elements of the cabinet embodiment, the first of which is configured to interact with an external environment and with the second heat exchange circuit, wherein the second heat exchange circuit which is configured without an ability to interact with the external environment includes a sealed cell for installing power electronics and the cell for installing a power connection and the cell for installing a measurement equipment. The cabinet comprising a dust and moisture filter, a plate heat exchanger, and a moisture removal device. The cabinet may be assembled with joined end-to-end metal sheets with curved joined ends which form strengthening ribs. The system supporting variable speed drive further comprising a cell for installing a passive filter or a filter compensation device or a capacitor bank preconfigured for compliance with variable speed drive and configured in such a way that it is dismountable in a form of a cabinet of the same height and depth as the cabinet of variable speed drive and closely aligned with the cabinet of variable speed drive. The cell for installing a power connection located on a side of the cell for installing a passive filter or a filter compensation device or a capacitor bank, wherein all connections between the cabinet of variable speed drive and the cell for installing a passive filter or a filter compensation device or a capacitor bank are made in the internal part of the embodiment.

A mounting rack is described for a power electronics installation, including busbars for electrically connecting a plurality of assemblies, which busbars are arranged on the rear side of the mounting rack. A corresponding power electronics installation is also described.

A power conversion device according to an embodiment includes an element unit and a capacitor unit. The element unit includes a first positive electrode bus, a first negative electrode bus, and a first outer frame member. The capacitor unit includes a second positive electrode bus, a second negative electrode bus, and a second outer frame member. The first outer frame member and the second outer frame member are separable from each other. The first positive electrode bus and the second positive electrode bus are removably connected to each other. The first negative electrode bus and the second negative electrode bus are removably connected to each other.

A module panel and method include an exterior housing, at least one heat sink disposed in the housing, a power delivery circuit disposed in the housing and coupled to one side of the at least one heat sink, and a controller circuit disposed in the housing and coupled to an opposite side of the at least one heat sink. The power delivery circuit operates using one or more different voltages than the controller circuit.

A slide rail structure for fixing a power supply to a machine frame is disposed between the machine frame and the power supply. The machine frame includes at least two longitudinal left racks and at least two longitudinal right racks at two sides thereof. The slide rail structure includes two inner slide rails and two outer slide rails. One inner slide rail is laterally fixed to the two left racks, and the other inner slide rail is laterally fixed to the two right racks. The two outer slide rails are laterally locked to two sides of the power supply, respectively. The outer slide rails are slidably connected to the inner slide rails, respectively. Through the slide rail structure, the power supply won't sway left and right in the machine frame, thereby enhancing the stability of the power supply.