An electrical generator system includes a generator unit and an inverter unit. The generator unit is coupled to the inverter unit through a coupling mechanism, wherein the coupling mechanism includes at least one busbar connection.

A capacitor component comprising a first busbar, a second busbar, one or more capacitor elements and a housing, the housing having a first portion and a second portion, wherein the first portion and the second portion are arranged to extend around an aperture, the first portion includes a section for housing the one or more capacitor elements, with the second portion extending between a first end and a second end of the first portion, wherein the first busbar and the second busbar are arranged to extend around the first portion and the second portion of the housing, a first power supply terminal is formed at the first end of the first portion and a second power supply terminal is formed at the second end of the first portion, wherein the first power supply terminal is coupled to the first busbar and the second power supply terminal is coupled to the second busbar, wherein a first conductive layer of the one or more capacitor elements is coupled to the first busbar and a second conductive layer of the one or more capacitor elements is coupled to the second busbar.

The power conversion device includes: a boost, converter which includes a magnetically-coupled reactor and a plurality of semiconductor switching elements connected to the magnetically-coupled reactor; an inverter; a cooler for cooling the magnetically-coupled reactor; a bus bar which is a conductive wiring member; and a current sensor for detecting a magnetic flux generated around the bus bar. The magnetically-coupled reactor includes a first winding, a second winding, and a core for magnetically coupling the first winding and the second winding. The core has a composite magnetic body containing soft magnetic powder and a binder, and at least parts of the first winding and the second winding are embedded in the composite magnetic body. The cooler is provided in contact with the magnetically-coupled reactor. The current sensor is provided on a side opposite to the magnetically-coupled reactor with the cooler therebetween.

A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device. The cooling device has a first and a second main surface. The power semiconductor module is arranged on the first main surface and is in thermally conducting contact with the cooling device and the capacitor device is arranged on the second main surface and is in thermally conducting contact with the cooling device. At least one DC connection device is connected to a DC module connection of the power semiconductor module and has a first cooling section, which is in thermally conducting contact with the cooling device.

A power electronics module for an industrial or vehicle battery charger system or the like is provided. The power electronics module utilizes a chassis housing including a heatsink surface and a plurality of sidewalls. A main power section printed circuit board is disposed adjacent to the heatsink surface of the chassis housing a. A low voltage, low power printed circuit board is disposed adjacent to the main power section printed circuit board opposite the heatsink surface of the chassis housing. An alternating current input filter portion printed circuit board including electromagnetics is disposed along one of the plurality of sidewalls of the chassis housing and separated from the low voltage, low power printed circuit board within the chassis housing.

An object of the invention is to suppress that resistance against vibrations is reduced, while reducing the number of components. A power conversion device according to the present invention includes: a power semiconductor module that converts a DC current into an AC current; a plate conductor that transfers the DC current or the AC current; a resin sealing material that seals the plate conductor; and an electric component that is used to control the power semiconductor module, wherein the resin sealing material includes a supporting member that supports the electric component, and wherein the plate conductor is buried in a portion of the resin sealing material that is disposed to face the electric component.

A power commutation module includes a printed circuit board, a first plate-shaped bus bar, and a first plurality of power switches each including a plurality of connection pins which are connected on the upper face of the printed circuit board and a metal base plate which is applied against the bus bar. The first plurality of power switches is mounted on the first bus bar. The power switches are generally aligned along a longitudinal edge of the first bus bar, in that said longitudinal edge of the first bus bar is arranged along a first longitudinal edge of the printed circuit board, and the portion of the first bus bar on which the power switches are mounted is arranged next to the printed circuit board.

An intelligent power module includes: a heat radiation device; an attachment frame disposed on a mounting surface of the heat radiation device; a power semiconductor module mounted on the attachment frame and configured to seal a semiconductor device; and a drive circuit part mounted on the power semiconductor module via a heat insulating sheet and configured to drive the power semiconductor module.

Second fixation portions of a terminal conversion adaptor are fitted into and engaged with engagement portions abutting on first fixation portions of a power semiconductor module. By use of one common fixation screw, each of the fixation portions and each of the second fixation portions are fixed to a cooler. Pin connection type external connection terminals of the power semiconductor module are connected to conversion terminals (which are provided with screw connection portions) of the terminal conversion adaptor so that the pin connection type external connection terminals can be converted into screw connection. Thus, it is possible to provide a conversion adaptor which can convert a connection form of each external connection terminal of a power semiconductor module easily and a power semiconductor module device in which the connection form of the external connection terminal can be converted into a desired connection form by the conversion adaptor.

The present invention provides a power module including a substrate and a modular housing structure. The substrate includes an electronic element disposed thereon. The modular housing structure is disposed on the substrate and located around the electronic element. The modular housing structure includes a plurality of sidewalls configured to connect with each other detachably. Each sidewall includes two connecting elements disposed on two opposite ends thereof respectively. The two connecting elements of any one of the sidewalls are connected to two corresponding connecting elements of two adjacent sidewalls respectively. Consequently, the numbers and connections of the sidewalls are adjustable and varied according to the size of the substrate so as to avoid the waste of space and enhance the power density.