An inverter drive assembly includes a first array of inverters, a second array of inverters spaced from the first array of inverters and defining a plenum therebetween, and a crossover bus bar spanning the plenum and electrically connecting the first array of inverters to the second array of inverters. The crossover bus bar includes a first laminated bus section electrically connected to the first array of inverters, a second laminated bus section electrically connected to the second array of inverters, and a solid bus connection interconnecting the first laminated bus section with the second laminated bus section.

A switching apparatus provides switching modules, each of which can switch a voltage from an independent power source. Additionally, the switching apparatus provides a single output for independent sources, with the single output providing a power source for a load (e.g., server). In order to dissipate thermal energy, the switching apparatus includes a heatsink that is directly coupled to the switching modules. As a result of the connection between the heatsink and the switching modules, the switching apparatus can reduce the size of the heatsink as well the number of heatsinks. In this manner, the size, footprint, and amount of material of the switching apparatus is reduced, thus reducing the cost of the switching apparatus as well as increasing the ability to provide additional switching apparatuses in a volume, such as a cabinet.

A power converter for a power system includes an input ceramic layer, an output ceramic layer, an input stage coupled to the input ceramic layer, an output stage coupled to the output ceramic layer, and a planar transformer coupled between said input stage and said output stage. The input receives a power input and the output stage generates a power output at least partially as a function of the power input. The planar transformer includes an input winding coupled to the input stage and an output winding coupled to the output stage. The input winding has a plurality of input turns and the output winding has a plurality of output turns. The input turns interleave the output turns.

A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.

A load board includes an electronic component and first wiring connected thereto. A power supply board includes a DC/DC converter and second wiring connected thereto. A bus block includes prismatic block-shaped conductors arranged with a gap interposed therebetween and fixed. The bus block is held between the first plate member and the second plate member such that the end faces of the block-shaped conductors are in contact with the load board and the power supply board. The bus block is connected to the first wiring and the second wiring such that current flows in a direction from the power supply board to the load board in one of two adjacent block-shaped conductors and that current flows in a direction from the load board to the power supply board in the other block-shaped conductor.

A module includes a power circuit enclosed in a casing. A first power terminal and a second power terminal of the power circuit each extend to an exterior of the casing. The first power terminal and the second power terminal separated by a gap are disposed in a stack on the exterior of the casing.

A power electronics arrangement has a power semiconductor module, with a contact spring, with a load connecting element and with a mounting device which is embodied as part of an electrically operated vehicle. The power semiconductor module has a load connection element which preferably projects outwards from the interior of the power semiconductor module, and preferably has there a first external contact face for external connection, and the load-connecting element has a second contact face. An electrically conductive pressure contact connection is embodied between the first contact face and the second contact face by a contact spring, wherein the pressure on the contact spring which is necessary for this is implemented by connecting the power semiconductor module in a frictionally locking fashion to the mounting device.

The disclosure provides a power supply including a high heat-dissipation circuit board assembly system in which a rack is installed on a circuit board so as to be connected to a transformer. Heat produced when electronic components installed on the circuit board are actuated may be conducted and dissipated thereby. The efficiency and the heat conductivity effect of the power supply may be further enhanced by distributing the amount and the flowing direction of the current from the transformer.

A semiconductor device includes a base plate, a semiconductor chip, and a first to a fourth terminal plates. The first terminal plate includes a first main body unit. The second terminal plate includes a second main body unit. The second main body unit opposes the first main body unit. The third terminal plate includes a third main body unit. The third main body unit opposes the first main body unit and the second main body unit. The fourth terminal plate includes a fourth main body unit. The fourth main body unit opposes the third main body unit. A thickness of the third main body unit is thinner than a thickness of the first main body unit. A thickness of the fourth main body unit is thinner than a thickness of the second main body unit.

A power conversion apparatus 2 has a configuration in which a plate-like bus-bar 80, 80′ is disposed vertically so that a width direction thereof is set in a vertical direction, electrically connected to positive electric potential of a battery and fixed to a resin case 50 to include a flat plate-like bus-bar body 81, 82, to which positive electric potential of the battery is applied, and a voltage measuring terminal 82 to 85 branched from the bus-bar body 81, 82. The voltage measuring terminal 82 to 85 includes a projecting portion 83 projecting from the bus-bar body 81, 82, an upright portion 84 extending from the projecting portion 83 upward toward a circuit board 100, and a measuring terminal portion 85 that is an upper part of the upright portion 84 and electrically connected to the circuit board 100.