A method of assembling a switching module may arrange a first pressing member on a first supporting member, stack a plurality of switches and a plurality of cooling plates on the first pressing member along a vertical direction, arrange a second pressing member and a supporting member on the uppermost cooling plate, support the first supporting member and a second supporting member using a plurality of supporting rods, press the first pressing member using a pressing device to separate between the first pressing member and the first supporting member, and insert a third pressing member between the first pressing member and the first supporting member.

A communication device can be used for communicating between a power equipment controller and power equipment devices of a high-voltage power electronics system. The communication device includes a controller interface communicatively coupled with the power equipment controller, an RF module coupled to the controller interface, and an antenna port coupled to the RF module. A mounting structure is configured to attach the communication device to a valve hall containing the power equipment devices. The mounting structure is permeable for RF signal communication between the communication device and power equipment devices in the valve hall. The mounting structure has a low voltage side to enable placement of the controller interface, the RF module and the antenna port so as to be shielded from disturbances due to high voltages inside the valve hall.

Each of the first and second switching modules may include first through (n+1)th cooling plates stacked along a vertical direction with respect to the support module; first through nth switches respectively disposed between the first through (n+1)th cooling plates; a first electrode plate disposed on the (n+1)th cooling plate; a first supporting member disposed on the first electrode plate; a first pressing member disposed between the first electrode plate and the first supporting member; a second electrode plate disposed below the first cooling plate; a second supporting member disposed below the second electrode plate; and a second pressing member disposed between the second electrode plate and the second supporting member.

A temperature control system (300) for a variable frequency drive (10, 100) includes a sealed enclosure (310), a power electronic component (330) and/or a power magnetic component (320) positioned inside the sealed enclosure (310), and a controller (400) configured to control a temperature of the power electronic component (330) and/or the power magnetic component (320) relative to an internal air temperature (Tair) inside the sealed enclosure (310) prior to an electrical energy application and operation of the power electronic component (320) and/or power magnetic component (320) to prevent condensation induced electrical failure of the power electronic component (330) and/or power magnetic component (320) utilizing a cooling system (340) and/or a heating system (350).

A switch assembly of a reactive power compensation apparatus may include a first switching module having a first stack structure perpendicular to a supporting module, a second switching module having a second stack structure perpendicular to the supporting module, the second switching module being connected in parallel with the first switching module, and first and second supporting members disposed above and below the first and second switching modules.

A power converter path of a modular multilevel power converter includes a multiplicity of modules forming an electrical series circuit. The series circuit includes four groups of modules, of which two successive or sequential groups are disposed one above the other in a tower structure. A modular multilevel power converter with a power converter path is also provided.

A high voltage electrical unit is installed above a floor of a vehicle between left and right seats. A bracket is fixed on the floor between the left and right seats, and the high voltage electrical unit is fixed on a bracket top plate of the bracket. A protect cover for covering the high voltage electrical unit is fixed on the bracket. Strength of the protect cover against a lateral load is made higher than strength of the bracket against the lateral load.

A power conversion device includes a first stage, a second stage, a first electric field relaxation shield unit, a second electric field relaxation shield unit, and a plurality of stage posts. The first electric field relaxation shield unit is arranged to surround outer periphery of the first stage. The second electric field relaxation shield unit is arranged to surround outer periphery of the second stage. The plurality of stage posts connect the first stage and the second stage. The plurality of stage posts have outer peripheral surfaces formed of insulating bodies. Power conversion units loaded on the first stage are arranged inside a columnar region which includes at least some of the plurality of stage posts as sides.

A switch assembly of a reactive power compensation apparatus may include a first switching module having a first stack structure perpendicular to a supporting module, and a second switching module having a second stack structure perpendicular to the supporting module, the second switching module being connected in parallel with the first switching module. Each of the first and second switching modules may include a plurality of cooling plates stacked along a vertical direction with respect to the supporting module, and a plurality of switches disposed between the plurality of cooling plates. The cooling plate may include an engagement portion disposed on one side of the upper surface to be located at a normal position by guiding the switch.

The performance of a power supply module is to be improved. The occurrence of discharge in the power supply module is to be prevented, and the size of the power supply module is to be reduced. In a power supply module, substrates are provided being stacked in a planar view. A low voltage circuit and a high voltage circuit are formed on a first substrate such that a distance is kept for preventing surface discharge, and a low voltage circuit is formed on a second substrate. A distance between a component of a high voltage alternating current circuit on the high voltage circuit and a component of the low voltage circuit is three times a shortest distance, at which space discharge does not occurs, between a component that constitutes a high voltage direct current circuit on the high voltage circuit and a component that constitutes the low voltage circuit.