A heating and air purifying apparatus using electronic device heat includes: a cabinet accommodating electronic devices including a central processing unit (CPU), a graphic processing unit (GPU), a power supply unit (PSU), and a main board, having an air inlet on a side, and having an air outlet on a top; one or more partition plates disposed vertically, horizontally, or diagonally across the inner surface of the cabinet; and a discharge fan installed at the air outlet and discharging air in the cabinet to the outside, in which a cooling fan of the GPU is disposed on a side of the one or more partition plate, a GPU body including a graphic card of the GPU is disposed on the opposite side, and the CPU, the PSU, and the main board are accommodated in a space facing a side of the one or more partition plate.

A vertical architecture for incorporating cooling devices onto a baseboard. The architecture forms four layers: baseboard, electronic device layer, contact layer, and cooling layer. In the electronic device layer multiple electronic chips of different characteristics are mounted onto the baseboard. In the contact layer multiple contact devices are attached to the electronic chips to match the form factor of the chips to the respective cooling device and to function to transfer heat from the chip to the respective cooling device. In the cooling layer multiple cooling devices are used to extract the heat using passive or active air cooling, liquid cooling, or hybrid and/or phase change cooling.

An in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle, where the in-vehicle computing apparatus includes two stacked mainboards, and a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards, and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator.

Provided is a rechargeable battery system comprising at least a battery cell and an external cooling means, wherein the battery cell comprises an anode, a cathode, an electrolyte disposed between the anode and the cathode, a protective housing that at least partially encloses the anode, the cathode and the electrolyte, and at least one heat-spreader element disposed partially or entirely inside the protective housing and wherein the external cooling means is in thermal contact with the heat spreader element configured to enable transporting internal heat of the battery through the heat spreader element to the external cooling means. Also provided is a method of operating a rechargeable battery system, the method comprising implementing a heat spreader element in one or each of a plurality of battery cells and bringing the heat spreader element in thermal contact with one or a plurality of external cooling means.

Apparatuses, systems, and techniques to cool computing devices. In at least one embodiment, a system includes a heatsink including one or more connector pins to laterally couple the heatsink to one or more computing devices.

Systems and methods are disclosed relating to welding-type power supplies. In some examples, the power supplies may have no vents, which may help prevent environmental contaminants from entering the power supplies. Instead, the power supplies include one or more thermal interfaces configured to conduct heat generated by internal circuitry of the power supply from the interior of the power supply to an exterior of the power supply. Additionally, the thermal interface(s) may be configured for attachment to one or more exterior heat dissipating devices.

A heat dissipation system of a portable electronic device is provided. The heat dissipation system includes a body and at least one fan. A heat source of the portable electronic device is disposed in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet, at least one flow outlet, and at least one spacing portion. The flow outlet faces toward the heat source, and the spacing portion surrounds the flow inlet and abuts against the body, so as to isolate the flow inlet and the heat source in two spaces independent of each other in the body.

Electronic equipment (10) has multiple cooling fans (15) for sending air to a heat sink (30). The multiple cooling fans (15) generate airflow (Fh) passing through the heat sink (30) from a first side (H1) to a second side (H2) thereof. The heat sink (30) is arranged obliquely to a crosswise direction and a longitudinal direction of the electronic equipment (10). A sheathing member (40) has an air inlet opening (41i) formed obliquely to the crosswise and longitudinal directions along the first side (H1) of the heat sink (30).

An oven comprises an interior electronics cavity defined within electronics cavity walls. The oven includes an air inlet for receiving ambient air from an ambient space outside the electronics cavity into the interior electronics cavity and a first air outlet for returning steam laden air from a cooking space to the ambient space outside the cooking space. The oven also includes a second air outlet positioned to separate flow going into the air inlet from flow from the first air outlet. An air plenum can be defined outside of the cooking space, and the air inlet can be defined in a first portion of an exterior interface of the air plenum. The second air outlet can be defined in a second portion of the exterior interface.

A method for cooling a display assembly includes forcibly circulating gas about an airflow pathway extending within a housing and surrounding an image assembly. Forcibly ingesting ambient air into the housing through an intake, passing the ingested ambient air within the housing in a manner which provides thermal interaction with the circulating gas in said airflow pathway, and exhausting the ingested ambient air from the housing through an exhaust to cool the circulating gas.