An electric fan for producing thrust to propel an aircraft is disclosed. The electric fan comprises a stator, a fan rotor rotatably mounted relative to the stator and an electric motor mounted to the stator and drivingly engaged with the fan rotor to cause rotation of the fan rotor relative to the stator. The fan rotor comprises an annular body defining a flow passage therethrough and a plurality of fan blades disposed in the flow passage and mounted for common rotation with the annular body about a fan rotation axis. The electric motor has a motor rotation axis that differs from the fan rotation axis.

A portable information handling system structure located between housing hinges along one side of the housing has first and second antenna disposed at opposing ends with a cooling fan between the first and second antenna and over the antenna structure to isolate the first and second antenna. In one embodiment, a parasitic element disposed between the first and second antenna and under the cooling fan has resonance tuned to isolate wireless signals of a frequency supported by the first and second antenna.

A method for cooling a display assembly includes forcibly circulating gas about an airflow pathway extending within a housing and extending along opposing sides of an image assembly is provided. Ambient air is ingested into the housing through an intake, passed within the housing in a manner which provides thermal interaction with the circulating gas in said airflow pathway, and exhausted from the housing through an exhaust to change a temperature of the circulating gas.

A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

A heat dissipating mechanism is for heat dissipation of a display module and a heat generating module of a display apparatus and includes a frame structure, a first airflow generating device, and a conductive cover structure having first, second, and third covers. The first cover is connected to the frame structure for containing the display module. The second cover has an air inlet and an air outlet and is connected to the first cover to form a channel. The third cover is connected to the second cover for containing the heat generating module. The first airflow generating device is disposed in the air inlet to guide air into the channel and out of the air outlet, so as to form an airflow for heat dissipation of the display module and the heat generating module.

A computing unit configured to be mounted in a HPC cabinet, the computing unit comprising an external body, and an internal body comprising secondary electronic components. The internal body is releasably coupled with the external body in order to allow extraction of the internal body when the external body is secured fixedly to the HPC cabinet. The internal body includes a bottom tray, comprising bottom secondary electronic components, a top tray comprising at least one duct for conducting an air flow from the front to the rear, and a plurality of manual coupling members, accessible from the top of the top tray, releasably coupling the top tray with the bottom tray.

A solid state drive apparatus includes a casing including a top plate, a bottom plate, a first sidewall, and a second sidewall. A first substrate is disposed inside the casing. At least one first semiconductor chip is mounted on the first substrate. A second substrate is disposed inside the casing. At least one second semiconductor chip is mounted on the second substrate. A heat dissipation structure is disposed between the first substrate and the second substrate and includes a lower heat dissipation panel contacting the at least one first semiconductor chip. An upper heat dissipation panel contacts the at least one second semiconductor chip. An air passage is provided between the lower heat dissipation panel and the upper heat dissipation panel and extends from the first sidewall of the casing to the second sidewall.

Disclosed is a computing device, comprising a frame, a computing apparatus, a controller, a power source and a heat dissipation device, wherein the computing apparatus is arranged in the frame and comprises a power source interface; the power source comprises a power source connection end, and also comprises a connection box connected to the frame; the power source interface extends from the frame into the connection box; the power source connection end extends into the connection box; and the power source interface and the power source connection end are connected in the connection box via one or more conducting bars.

A heat dissipating mechanism is for heat dissipation of a display module and a heat generating module of a display apparatus and includes a frame structure, a first airflow generating device, and a conductive cover structure having first, second, and third covers. The first cover is connected to the frame structure for containing the display module. The second cover has an air inlet and an air outlet and is connected to the first cover to form a channel. The third cover is connected to the second cover for containing the heat generating module. The first airflow generating device is disposed in the air inlet to guide air into the channel and out of the air outlet, so as to form an airflow for heat dissipation of the display module and the heat generating module.

An electronic device is provided. The electronic device includes a rear cover including an air inlet and an air outlet; a middle frame which is assembled with the rear cover to define a containing cavity in communication with the air inlet and the air outlet; a heat source arranged in the containing cavity; a heat transfer assembly arranged on a side of the middle frame facing towards the rear cover, and including first and a second ends; and a fan arranged opposite to the second end in the containing cavity. The first end and the heat source are stacked in a thickness direction of the electronic device. The heat transfer assembly is configured to transfer heat of the heat source to the second end. The fan draws air flow through the air inlet and discharges the air flow through the air outlet.