An electronic control device includes: a circuit board including a substrate and an electrolytic capacitor connected to the substrate; a heat sink including a recess that houses the electrolytic capacitor; and heat dissipation material provided in the recess. The electrolytic capacitor has an end surface facing a bottom surface of the recess, and the heat dissipation material is in contact with the end surface and the bottom surface.

A gasket is disclosed that includes an edge structure and a honeycomb structure surrounded by the edge structure.

A power supply device (20, 20′, 20″) and a printed circuit board device (100, 100′, 100″) including the same are provided in embodiments of the present disclosure. The power supply device (20, 20′, 20″) is mounted on a mainboard (10) and includes a first surface (11). The power supply device (20, 20′, 20″) includes: a magnetic device (22) located above the first surface (11) of the mainboard (10) and electrically connected to the mainboard (10); at least one accommodating portion (24) located on a surface of the magnetic device (22) facing towards the first surface (11); and a semiconductor device (26) which is at least partially accommodated in the at least one accommodating portion (24) and electrically connected to the mainboard (10).

Pierced thermal interface constructions including a thermal interface material (TIM) structure comprising: a TIM sheet comprising a plurality of piercings, where each of the plurality of piercings comprises a cavity and displaced material, and where the displaced material from each of the plurality of piercings protrudes away from the TIM sheet.

Printed circuit board assembly (PCBA) technology is disclosed. A PCBA can include a printed circuit board (PCB). The PCBA can also include a capacitor operably mounted on a side of the PCB. In addition, the PCBA can include a damper material coupled to the PCB and operable to dissipate kinetic energy generated by the capacitor during operation. An electronic system including a capacitor and damping material, and a method for minimizing acoustic vibration in an electronic system are also disclosed.

A control device for an electric machine includes a circuit board and a cooling body, which are joined together, wherein a heat-conducting paste is introduced between the circuit board and the cooling body at least for thermally connecting the circuit board to the cooling body. The circuit board and/or the cooling body has at least one recess, wherein the recess is formed in the lateral direction between a region to be protected and the introduced heat-conducting paste in such a way that, when the circuit board and the cooling body are joined, an excess portion of the laterally spreading heat-conducting paste can be received by the recess.

To provide a heat-dissipating sheet having good close-contact properties with an adherend such as a heat-generating body and being easy to handle. A heat-dissipating sheet includes a heat-dissipating member including a graphite sheet, a first thermally conductive layer, and a second thermally conductive layer stacked in this order. The first thermally conductive layer contains a thermally conductive filler dispersed in a polymer matrix and has an outer shape larger than the graphite sheet when viewed in plan. The second thermally conductive layer contains a thermally conductive filler dispersed in a polymer matrix, is more flexible than the first thermally conductive layer, and has an outer shape identical to or smaller than the first thermally conductive layer when viewed in plan.

A display device includes a flexible display panel, an ultrasonic fingerprint sensor which is disposed below a rear surface of an active area of the flexible display panel and has a first thickness and a first width, a cushion structure which is disposed below the rear surface of the flexible display panel, surrounds the periphery of the ultrasonic fingerprint sensor, and has a second thickness larger than the first thickness, and a circuit board which is electrically connected to the ultrasonic fingerprint sensor and has a second width larger than the first width.

An embodiment of an electronic apparatus may include an electronic device package having a first surface, a heat conductive structure having a second surface, a reservoir structure positioned between the first surface of the electronic device package and the second surface of the heat conductive structure, and a thermal interface material disposed within the reservoir structure between the first surface of the electronic device package and the second surface of the heat conductive structure to place the first surface in thermal communication with the second surface. Other embodiments are disclosed and claimed.

A micromobility transit vehicle may include a wheel, an electric motor associated with the wheel, and a motor controller configured to control a motive force provided by the electric motor to the wheel. The motor controller may include a printed circuit board (PCB), one or more MOSFETs attached to the PCB, and a respective aperture defined through the PCB below each MOSFET. The motor controller may include a thermal assembly associated with each MOSFET and capable of dissipating heat from the MOSFETs to a heat sink. Each thermal assembly may include a heat transfer plug positioned at least partially within an associated aperture of the PCBA to contact an associated MOSFET, and a thermal interface material positioned between the heat transfer plug and the heat sink and capable of dissipating heat from the heat transfer plug to the heat sink.