Heat-rejecting media configured to thermally couple to a heat-generating component of an information handling resource may include a source, a sink, and a thermally-conductive strip coupled between the source and the sink. The source may include a first flexible and thermally-conductive skin surrounding a first cavity comprising a first solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the source to the heat-generating component. The sink may include a second flexible and thermally-conductive skin surrounding a second cavity comprising a second solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the sink to a component of the information handling resource exposed externally to the information handling resource.

An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat transfer rail extending along an edge of circuit board and coupled to the heat generating component, a housing covering the circuit board, and a heat transfer clamp between the heat transfer rail and the housing. The heat transfer clamp includes a flexible, heat conductive layer having a first portion in thermal contact with the heat transfer rail and a second portion in thermal contact with the housing. The first and second portions are thermally coupled, and a clamp and a compressible layer thereon extends between the first and second portions of the flexible, heat conductive layer.

Various technologies described herein pertain to an autonomous vehicle computing device for an autonomous vehicle. The autonomous vehicle computing device includes a printed circuit board, a heat sink, and a thermal interface material layer between the printed circuit board and the heat sink. The autonomous vehicle computing device further includes a barrier layer between the thermal interface material layer and the printed circuit board. The thermal interface material layer can be formed of a two-part thermal interface material that cures in place. The barrier layer between the thermal interface material layer and the printed circuit board enables separation of the printed circuit board from the thermal interface material layer if reworking or modification of the autonomous vehicle computing device is desired. The barrier layer can enable the printed circuit board to be separated from the thermal interface material layer in a manner that mitigates damage to the printed circuit board.

An information handling system EMI shield system couples to a circuit board to enclose an electronic device in a Faraday cage and includes a surface painted with a graphene paint to aid in dissipation of excess thermal energy from the electronic device. The EMI shield system has a frame that couples to the circuit board and interfaces with ground to define a boundary around an electronic device connector and has a shield that couples as a separate piece over the frame to enclose the electronic device. Graphene paint applied to some or all of the shield encourages rejection of excess thermal energy from within shield.

Heat-rejecting media configured to thermally couple to a heat-generating component of an information handling resource may include a source, a sink, and a thermally-conductive strip coupled between the source and the sink. The source may include a first flexible and thermally-conductive skin surrounding a first cavity comprising a first solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the source to the heat-generating component. The sink may include a second flexible and thermally-conductive skin surrounding a second cavity comprising a second solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the sink to a component of the information handling resource exposed externally to the information handling resource

Disclosed herein are thermal interface materials (TIMs) including memory foam cores. In an exemplary embodiment, a thermal interface material generally includes a memory foam core including a plurality of sides defining a perimeter. A heat spreader is disposed at least partially around the perimeter defined by the plurality of sides of the memory foam core.

An electronic device includes a substrate, at least one electronic element and a heat dissipating electromagnetic shielding structure. The heat dissipating electromagnetic shielding structure is disposed on the substrate and covers the at least one electronic element, wherein the heat dissipating electromagnetic shielding structure includes a shielding frame and a heatsink. The shielding frame includes a plurality of spring members. The spring members are bent toward the substrate and partially abut against the heatsink. When the heatsink and the shielding frame are correspondingly arranged, a shielding space is defined, the electronic element is disposed in the shielding space, and a heat generated by the at least one electronic element is conducted out of the shielding space via the heatsink.

An apparatus includes multiple thermal interface segments collectively forming a discontinuous thermal interface configured to contact a curved surface of an object. The discontinuous thermal interface is configured to transfer thermal energy to or receive thermal energy from the curved surface of the object. Each of the thermal interface segments includes a major surface that is curved. The curved major surface of each of the thermal interface segments is configured to register with the curved surface of the object and has a specified area that is based on a Hertzian contact area defined partially by the curved surface of the object. The apparatus can also include a thermal gap pad configured to be compressed between the thermal interface segments and the object.

The technology of this application relates to a heat dissipation apparatus applicable to a circuit board, where a plurality of heating elements are disposed on the circuit board. The heat dissipation apparatus includes a substrate, at least one heat conductor is disposed on one surface that is of the substrate and that faces the circuit board, one end of the heat conductor is connected to the substrate, and the other end extends toward the circuit board and is close to the heating elements. At least one heat conductor is disposed on the one surface that is of the substrate and that faces the circuit board, one end of the heat conductor is connected to the substrate, and the other end of the heat conductor extends toward the circuit board and is close to the heating elements.

An electronic apparatus includes an interface unit including a connection unit, a heat transfer unit, a heat dissipation unit, and a fixation member. The connection unit is attachable to an interface terminal of an external apparatus. The fixation member is couplable to a fixation unit of the external apparatus. When the electronic apparatus is attached to the external apparatus, the heat dissipation unit, the heat transfer unit, and the interface unit are arranged in a layered manner in this order and are thermally coupled, and, along therewith, the fixation member is thermally coupled to the heat dissipation unit and the fixation unit.