An electronic circuitry module and a method of potting an electronic circuit are provided. The electronic circuit module includes at least one heat generating electronic component and is potted in a potting material. Additionally, a cooling circuit is potted in the potting material. The cooling circuit includes an inlet and an outlet for flow of cooling liquid therebetween.

Components selected from bare die, surface mount devices and stacked devices are assembled using flip chip assembly methods on a printed circuit board assembly (PCBA) with no components having a mounted height exceeding a preferred height. The preferred height may correspond with the components having the highest power rating, because the most effective thermal coupling to a heat sinking surface will then be provided to these high-power components. A blade server is configured with the back face of high-power components coupled to a metal tank carrying cooling water. An electronic system has laminate blocks comprising repeated laminations of PCBAs coupled to metal foils. The laminate blocks are coupled to heat sink surfaces in direct contact with cooling liquid. Power density is superior to existing high-performance computing (HPC) systems and data center servers.

A new and improved intrinsically safe barrier (ISB) provides advantages in connection with installation of field equipment in hazardous areas including Division 2/Zone 2 areas. In one embodiment the new ISB provides a pluggable/unpluggable ISB for use with a receiving terminal base adapted for individual field mounting and alternatively for use with a circuit mount terminal base to permit direct mounting of ISB on circuit boards. A highly effective heat sink design and potting material allows for heat dissipation to allow the ISB to serve a wider range of applications.

Power supply apparatus (10) comprising a circuit board (11) and one or more power devices (12) attached to a first surface (11a) of the circuit board (11). A plate (14a) composed of a thermally conductive plastic faces the first surface of the circuit board (11). A thermally conductive encapsulant (15) is provided between the first surfaces (11a) of the circuit board (11) and the plate (14a). The circuit board (11) comprises one or more heat-spreading layers (212*,213*) configured to enhance heat transfer in directions parallel to the first surface (11a) of the circuit board (11). The first surface (14aa) of the plate (14a) may also be irregular and comprises one or more first regions (32) and one or more second regions (31) that are further from the first surface (11a) of the circuit board (11) than the one or more first regions (32), with the one or more power devices (12) being aligned with the one or more second regions (31).

Components selected from bare die, surface mount devices and stacked devices are assembled using flip chip assembly methods on a printed circuit board assembly (PCBA) with no components having a mounted height exceeding a preferred height. The preferred height may correspond with the components having the highest power rating, because the most effective thermal coupling to a heat sinking surface will then be provided to these high-power components. A blade server is configured with the back face of high-power components coupled to a metal tank carrying cooling water. An electronic system has laminate blocks comprising repeated laminations of PCBAs coupled to metal foils. The laminate blocks are coupled to heat sink surfaces in direct contact with cooling liquid. Power density is superior to existing high-performance computing (HPC) systems and data center servers.

An elastic heat-dissipation structure comprises a porous elastic member, a plurality of first thermal conductive members, and a plurality of second thermal conductive members. The first thermal conductive members and the second thermal conductive members are mixed in the porous elastic member. Each first thermal conductive member has a maximum width ranged from 5 m to 50 m, each second thermal conductive member has a maximum width ranged from 0 m to 5 m, and the thicknesses of each first thermal conductive member and each second thermal conductive member ranges from 0.3 nm to 30 nm. When the density of the elastic heat-dissipation structure is between 0.1 g/cm.sup.3 and 1.0 g/cm.sup.3, the contained percentages of the first thermal conductive members and the second thermal conductive members range from 0.01% to 20%. An electronic device containing the elastic heat-dissipation structure is also disclosed.

An electronic component module includes a second terminal electrode that is independent of a first terminal electrode in terms of potential. A second electronic component is mounted on a board, with a first surface thereof facing the board. A heat transfer portion is disposed on a second surface of the second electronic component, the heat transfer portion being connected to both the first terminal electrode and the second terminal electrode. A heat dissipation portion is connected to the board via the first terminal electrode, the second terminal electrode, and the heat transfer portion.

An elastic heat-dissipation structure comprises a porous elastic member, a plurality of first thermal conductive members, and a plurality of second thermal conductive members. The first thermal conductive members and the second thermal conductive members are mixed in the porous elastic member. Each first thermal conductive member has a maximum width ranged from 5 m to 50 m, each second thermal conductive member has a maximum width ranged from 0 m to 5 m, and the thicknesses of each first thermal conductive member and each second thermal conductive member ranges from 0.3 nm to 30 nm. When the density of the elastic heat-dissipation structure is between 0.1 g/cm.sup.3 and 1.0 g/cm.sup.3, the contained percentages of the first thermal conductive members and the second thermal conductive members range from 0.01% to 20%. An electronic device containing the elastic heat-dissipation structure is also disclosed.

Various embodiments relate to an electrical feedthrough assembly an elongate conductor and a collar at least partially surrounding the elongate conductor along a portion of a length of the elongate conductor. The collar can be composed of a material having a thermal conductivity of at least 170 W/(m-K). A shell can be disposed around the collar. At one or more operating frequencies, at least a portion of a length of the electrical feedthrough assembly can be selected to provide at least one quarter wave transform.

In an embodiment, a process for making a thermal interface article comprises shaping a flowable composite comprising a flowable matrix composition, a plurality of magnetic, thermally conductive particles having an average length greater than a thickness or diameter, wherein the plurality of magnetic, thermally conductive particles have magnetic or superparamagnetic nanoparticles attached thereto, to provide the flowable composite in a shape comprising a first surface and an opposing second surface, and having a Z-axis perpendicular to the first surface and the opposing second surface; subjecting the flowable composite to a rotating magnetic field and to a vibrational force in an amount and for a time effective to align the average length of the plurality of magnetic, thermally conductive particles along the Z-axis; and solidifying the flowable matrix composition to provide the thermal interface, wherein the thermal interface has a Z-direction thermal conductivity of at least 1.0 W/mK.