A constructive arrangement introduced in a housing for electronic circuit with power components is disclosed, in which a modular frame structure is provided, capable of being attached to the main structural frame and responsible for receiving the heat sink element. Said frame structure further includes holes bordered by contour walls, which optimize the application of high thermal conductivity coefficient resin between the electrical/electronic power components of the circuit board and the heat sink element.

An inverter for a photovoltaic system includes a substantially planar baseplate having a front and a rear, wherein the rear forms an outer rear wall of the inverter, and having at least one platform-like elevation that rises in the direction of the front of the baseplate. The inverter also includes a printed circuit board having one or more heat-generating components mounted thereon, wherein the printed circuit board is installed on the baseplate such that the one or more heat-generating components are arranged on the printed circuit board in the region of the platform-like elevation and are in thermal contact with the platform-like elevation. The inverter further includes a potting compound that fills a space on the front of the baseplate and surrounds at least partially the printed circuit board, and a cover arranged on or in the potting compound that adjoins the baseplate, so that the baseplate and the cover surrounding at least part of the potting compound form a housing, The inverter also includes at least four DC connectors that are arranged in pairs on at least one of the lateral end faces of the housing and at least part of which is cast in the potting compound, and an AC connector that is arranged on one of the lateral end faces of the housing, wherein electrical contacts of the AC connector are connected to the printed circuit board.

Disclosed is an ROV propeller tailhood comprising a body a control circuit board, a heat block, a thermal silica gel and long rod screws. The heat sink is fixed to the bottom of the control circuit board and disposed between the control circuit board and the body. The heat sink and the body are provided respectively with apertures that are matching with the long rod screws for fixing the heat sink to the body. The cooling silica gel is provided between the control circuit board and the heat sink.

An image capture assembly includes a heat-conducting housing, a camera component in the heat-conducting housing, and a heat-conducting sheet. The heat-conducting sheet is attached to the camera component and arranged between the camera component and the heat-conducting housing to dissipate heat generated by the camera component to the heat-conducting housing. The heat-conducting sheet extends to a side wall of the camera component from a bottom side of the camera component.

A constructive arrangement introduced in a housing for electronic circuit with power components is disclosed, in which a modular frame structure is provided, capable of being attached to the main structural frame and responsible for receiving the heat sink element. Said frame structure further includes holes bordered by contour walls, which optimize the application of high thermal conductivity coefficient resin between the electrical/electronic power components of the circuit board and the heat sink element.

An image capture assembly includes a heat-conducting housing, a camera component in the heat-conducting housing, a circuit board adapter, and a heat-conducting sheet. The circuit board adapter is in the heat-conducting housing and electrically coupled to the camera component. The heat-conducting sheet is attached to the camera component and arranged between the camera component and the heat-conducting housing to conduct heat generated by the camera component to the heat-conducting housing.

In some examples, an electronic device includes an outer housing and a heat spreader inside an inner chamber defined by the outer housing. The heat spreader is structurally engaged to the outer housing to provide structural support for the outer housing, and the heat spreader is to spread heat along two different directions. Electronic components are in thermal contact with a surface of the heat spreader to transfer heat produced by the electronic components to the heat spreader.

A solid-state drive device includes a first module including a first region containing a volatile main memory device and a controller device and a second region containing a first nonvolatile memory device, a second module disposed on the first module and having a third region containing a second nonvolatile memory device, the second module being connected to the first module, and a heat dissipating member disposed on the second module as vertically juxtaposed with the first and second modules. The heat dissipating member has a protruding portion protruding toward the first module and in direct thermal contact with the first region, and a plate-shaped portion having a main surface in direct thermal contact with the third region.

The present invention provides a single-piece printed circuit board heat sink and encapsulation device configured to efficiently dissipate heat away from the printed circuit board, along with associated methodology for dispersing heat from a printed circuit board.

Apparatus having means for cooling a current limiting thermistor which includes an elongated power cord first and second power conductors connected to respective male and female connectors at the axial extremities thereof and a thermistor disposed in series with at least one of the first and second power conductors, potting compound surrounding an axial part of said first and second power conductors as well as the thermistor. The apparatus further includes an elongated sleeve shaped heat exchanger dimensioned and configured with a central bore for thermal contact with the exterior of the potting compound. The heat exchanger has a plurality of fins disposed substantially in mutually parallel relationship as well as in substantially parallel relationship to an axial part of the first and second power conductors.