Provided is a display apparatus including a display panel, a covering member, and an intermediate member. The intermediate member includes a base material including an insulating material and a heat transfer particle, and is disposed between the display panel and the covering member The display panel includes: a substrate; an encapsulation member which faces the substrate; and a display device which is arranged between the substrate and the encapsulation member and displays an image, the covering member is arranged to face the display panel, and the intermediate member is disposed in a gap between the covering member and an area of the substrate where the encapsulation member is not disposed.

Provided are an electric appliance and a method of manufacturing the same, the electric appliance having a smaller size and a reduced overall weight by preventing a fluid from flowing into a space unrelated to a heating component in a state where the fluid fills its case. The electric appliance includes: a case including a first space and a second space communicated to each other; a first component disposed in the first space; a second component disposed in the second space; a connection portion electrically connecting the first component and the second component to each other; and a potting pattern including a resin material and formed in the first space.

Particular embodiments described herein provide for a thermal cooling system that is part of a device that includes a hole-in-motherboard configuration. The device can include a substrate, one or more dies on a top portion of the substrate, one or more printed circuit boards below the substrate, where the printed circuit boards are coupled to the substrate with solder balls, and one or more land side capacitors below the substrate. A thermal conducting plate, phase change material, and one or more sponge walls to help insulate the solder balls from the thermal conductive layer can be located in the hole of the hole-in-motherboard configuration and help transfer heat and thermal energy away from the device.

Provided is an inexpensive and highly reliable resin sealed-type onboard electronic control device is mounted in a vehicle such as an engine control unit and a control unit for automatic transmission, which have a heat dissipation structure for dissipating heat generated from an electronic component such as a semiconductor element. The onboard control device includes a circuit board, a member provided to face the circuit board, a heat generating electronic component mounted between the circuit board and the member, a heat dissipating material provided between the heat generating electronic component and the member, and a sealing resin to seal the circuit board and the heat generating electronic component. And a space between the member and the circuit board is at least a part of a range where the heat dissipating material is not provided, and is narrower than a range where the heat dissipating material is provided.

A speaker apparatus is provided in order to both receive and dissipate heat and to provide acoustic absorption for sound waves propagating through a speaker cavity. The speaker apparatus includes a speaker and a speaker cavity configured to receive sound waves emitted by the speaker for propagation through the speaker cavity. The speaker apparatus also includes a heat dissipation structure disposed at least partially within the speaker cavity. The heat dissipation structure includes a heat pipe or a heat sink configured to receive heat from a component that generates heat. The heat dissipation structure is configured to provide acoustic absorption for the sound waves propagating through the speaker cavity.

An electronic device includes a heat sink, where heat dissipating gel is interposed between the heat sink and a side of an electronic component, which is mounted on a substrate, opposite from the substrate. The electronic component includes an electrical conductor electrically connected to a chip, and an insulator portion that molds the chip with the electrical conductor. The heat sink includes a non-abutting surface that faces the electrical conductor of the electronic component, the heat dissipating gel interposed between the non-abutting surface and the electrical conductor, and an abutting surface that is positioned closer toward the substrate than the non-abutting surface is and abuttable with the insulator portion. Accordingly, when the abutting surface of the heat sink abuts the insulator portion of the electronic component, the non-abutting surface of the heat sink is prevented from abutting the electrical conductor of the electronic component.

The present invention provides a heat dissipation structure that does not cause problems such as contact failures in electronic components and that is applicable to electronic components with high heat densities. The present invention also provides a method for easily repairing an electronic device. The heat dissipation structure is obtained by filling and curing a thermally conductive curable resin composition in an electromagnetic shielding case on a substrate on which an electronic component with a heat density of 0.2 W/cm.sup.2 to 500 W/cm.sup.2 is mounted, the thermally conductive curable resin composition containing a curable liquid resin (I) and a thermally conductive filler (II), having a viscosity at 23 C. of 30 Pa.Math.s to 3000 Pa.Math.s and a thermal conductivity of 0.5 W/(m.Math.K) or more, and being curable by moisture or heat.

A flame retardant structure for electronic component includes a printed circuit board, an electronic component, a metal heat dissipation module, a first plastic part and a receiving space formed by the printed circuit board and the metal heat dissipation module. The metal heat dissipation module has an opening, or the metal heat dissipation module and the printed circuit board form an opening. The electronic component is located in the receiving space. When the electronic component is heated, the first plastic part melts and enters into the receiving space through the opening, and the first plastic part melts to cover and protect the electronic component. The first plastic part is offered with different structures to match with different metal heat dissipation module for flexible use, low cost and high fire retardant effect.

To provide an endoscope capable of appropriately dissipating heat of a heat generating portion with a simpler configuration.

In an endoscope including an image sensor that generates heat during operation, and a shield pipe and a mold resin portion that are integrated with the image sensor and dissipate heat transferred from the image sensor in a case where the image sensor generates heat, the mold resin portion has a linear expansion coefficient larger than those of the image sensor and the shield pipe.

A semiconductor module includes: one or more semiconductor elements; a wiring substrate having a first surface on which the one or more semiconductor elements are mounted, the wiring substrate being electrically connected to the one or more semiconductor elements; a heat sink on which the wiring substrate is mounted, the heat sink facing a second surface of the wiring substrate on a reverse side of the first surface; a binder which is formed in a die pad area on the heat sink so as to be present between the wiring substrate and the heat sink, and bonds the wiring substrate and the heat sink; and a support which is formed in a peripheral part of the die pad area on the heat sink, and fixes the wiring substrate to the heat sink by being in contact with a peripheral part of the second surface of the wiring substrate.