This document describes a thermal-control system that is integrated into a media-streaming device. The thermal-control system includes a combination of heat spreaders and materials with high thermal-conductivity. The thermal-control system may spread, transfer, and dissipate energy from a thermal-loading condition effectuated upon the media-streaming device to concurrently maintain temperatures of multiple thermal zones on or within the media-streaming device at or below multiple respective prescribed temperature thresholds.

The present disclosure provides a connector assembly comprising a cage and a heat sink. The cage has a receiving space and a wall constituting the receiving space, the wall is formed with a window which is communicated with the receiving space and two latching plates which are provided to two sides of the window and extend away from the receiving space, each latching plate is integrally formed with a latching protrusion, the latching protrusion has a guiding portion and a latching portion, a protruding amount of the guiding portion from the latching plate gradually increases as a distance of the guiding portion from the receiving space decreases, the latching portion is positioned to a tip end surface of the guiding portion. The heat sink has a base plate, in a process that the heat sink is assembled to the cage, the base plate pushes against the guiding portions of the latching protrusions of the two latching plates to make the two latching plates elastically move, after the base plate passes over the guiding portions of the latching protrusions of the two latching plates, the latching portions of the latching protrusions of the two latching plates latch with the base plate.

A solid-state drive device includes a first module including a first region containing a volatile main memory device and a controller device and a second region containing a first nonvolatile memory device, a second module disposed on the first module and having a third region containing a second nonvolatile memory device, the second module being connected to the first module, and a heat dissipating member disposed on the second module as vertically juxtaposed with the first and second modules. The heat dissipating member has a protruding portion protruding toward the first module and in direct thermal contact with the first region, and a plate-shaped portion having a main surface in direct thermal contact with the third region.

A heat radiation sheet includes: a film layer; a heat radiation layer on the film layer and having a first area, a second area, and a third area and a plurality of openings therein; and a first adhesive layer on the heat radiation layer. The openings include a plurality of first openings in the first area, a plurality of second openings in the second area, and a plurality of third openings in the third area, and an average distance between adjacent ones of the first openings is smaller than an average distance between adjacent ones of the third openings.

A heat radiation structure of an electric parts assembly, a heat conduction sheet, and a method of manufacturing an electric parts assembly are provided that are capable of reducing a gap between neighboring separate sheets after sheet compression while minimizing an unintentional increase in sheet reaction force. A heat conduction sheet (101A) disposed between a cooler and a heat generating element includes a plurality of separate sheets (102), each of the separate sheets (102) includes a plurality of convex sections protruding circumferentially outward from the sheet and a plurality of concave section recessed circumferentially inward on an outer circumferential edge of a shape when seen in a plan view in a state before being pinched between a cooler and a heat generating element, and the convex sections and the concave sections are disposed to be arranged alternately in a circumferential direction of the separate sheets (102) in a shape when seen in a plan view. When the plurality of separate sheets (102) are pinched between the cooler and the heat generating element, the gap between the neighboring separate sheets (102) is reduced by changing a shape of the outer circumferential edge of the plurality of separate sheets (102) to fill the neighboring concave sections.

A thermal bridge includes upper and lower bridge assemblies including upper and lower plates arranged in stacks. Sides of the plates face each other to thermally interface the lower plates with the upper plates. The thermal bridge includes a spring element positioned between the upper bridge assembly and the lower bridge assembly. The thermal bridge includes an internal bridge frame having connecting elements that extend internally through the upper plates and the lower plates to hold the upper plates in the upper plate stack and to hold the lower plates in the lower plate stack.

According to various embodiments, an electronic apparatus comprises: a housing including a first plate, a second plate facing in the opposite direction as the first plate, and side members surrounding the space between the second plate and the second plate; a printed circuit board which is disposed within the space and on which at least one electrical component is mounted; a shield can mounted on the printed circuit board and disposed to surround the at least one electrical component; and an insulating tape member attached to the inner surface of the shield can between the shield can and the electrical component. The insulating tape member may include: a first layer including a first material and formed to a first thickness; a second layer laminated on the first layer by means of an adhesive, including a second material, and formed to a second thickness that is the same as or thicker than the first thickness; and an adhesive layer formed on the second layer and for being attached to the shield can. Various other embodiments may also be possible.

An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.

An electronic device includes a top plate having a first surface and a second surface that is positioned at an elevation that is lower than an elevation of the first surface, the second surface extending from a first end part of the top plate to a second end part of the top plate, a bottom plate provided under the top plate, and a circuit board placed between the top plate and the bottom plate and mounted with an electronic component. The top plate has opposing first and second edges and opposing third and fourth edges that are perpendicular to the first and the second edges, the first end part being formed at the first edge and the second end part being formed at the second edge.

A resin composition includes: a resin as Component (A); and an inorganic filler as Component (B). The Component (B) includes anhydrous magnesium carbonate as Component (b1) and aluminum oxide as Component (b2). Content of the Component (b1) falls within a range from 35% by volume to 65% by volume relative to 100% by volume of the Components (b1) and (b2) combined. Content of the Component (B) falls within a range from 60% by volume to 75% by volume relative to 100% by volume of the resin composition.