A heat radiation structure of an electric parts assembly, a heat conduction sheet, and a method of manufacturing an electric parts assembly are provided that are capable of reducing a gap between neighboring separate sheets after sheet compression while minimizing an unintentional increase in sheet reaction force. A heat conduction sheet (101A) disposed between a cooler and a heat generating element includes a plurality of separate sheets (102), each of the separate sheets (102) includes a plurality of convex sections protruding circumferentially outward from the sheet and a plurality of concave section recessed circumferentially inward on an outer circumferential edge of a shape when seen in a plan view in a state before being pinched between a cooler and a heat generating element, and the convex sections and the concave sections are disposed to be arranged alternately in a circumferential direction of the separate sheets (102) in a shape when seen in a plan view. When the plurality of separate sheets (102) are pinched between the cooler and the heat generating element, the gap between the neighboring separate sheets (102) is reduced by changing a shape of the outer circumferential edge of the plurality of separate sheets (102) to fill the neighboring concave sections.

This document describes a thermal-control system that is integrated into a security camera. The thermal-control system includes a combination of heatsinks and thermal interface materials with high thermal conductivities. The thermal-control system may transfer and spread energy from a high thermal-loading condition effectuated upon the security camera to concurrently maintain temperatures of multiple thermal zones on or within the security camera at or below prescribed temperature thresholds.

A solid state drive device is provided. The solid state drive device includes a lower plate which includes a lower flat part, and a lower side wall protruding from the lower flat part primarily in a first direction, an upper plate which includes an upper flat part facing the lower flat part, and an upper side wall protruding from the upper flat part primarily in a second direction opposite to the first direction. The solid state drive device further includes a gasket including a metal material formed in at least a part of a region in which the lower side wall and the upper side wall overlap each other.

A vapor chamber structure includes a thin-sheet housing with a hollow interior and a composite capillary layer installed in the thin-sheet housing. The composite capillary layer is a metal woven mesh formed by weaving plural metal filaments, and each metal filament of the composite capillary layer is a steel wire having a coating layer on the exterior of the steel wire. By pulling and drawing the steel into a linear shape, a smaller wire diameter is obtained, so that the composite capillary layer will not be broken easily and can be used for making a finer woven mesh which can be installed in a thinner vapor chamber.

The present application discloses a heat dissipation device. The heat dissipation device includes a heating element, a sounding device and a heat conductor. The speaker unit includes a diaphragm separating the accommodation space into a front cavity and a back cavity. The housing body is provided with first sound outlet holes communicating to the front cavity. Heat generated by the heating element is transferred outside along with an air flow in the front cavity. The heat dissipation device provided by the present application has the advantages of being good in heat dissipation effect and exquisite and compact in structure and capable of meeting the demand of miniaturization of the heat dissipation device.

An electronic device having a shielding structure disposed around electronic components and having high heat dissipation performance is provided. The electronic device includes a circuit board, at least one electronic component mounted on a surface of the circuit board, a shielding sheet attached to the surface of the circuit board to cover the at least one electronic component, a thermal interface material stacked on the shielding sheet to overlap the at least one electronic component, and a heat dissipation member disposed to face the surface of the circuit board, being in surface contact with the thermal interface material, and fastened to at least a portion of the circuit board by a fixing member. Various other embodiments may be possible.

According to an embodiment, an electronic apparatus includes a printed circuit board including a plurality of devices that include a nonvolatile memory package and a controller package configured to control the nonvolatile memory package, and a housing accommodating the printed circuit board. The housing includes an opening on a surface constituting the housing. An encryption device among the plurality of devices is present in a first region. The first region is a region on the printed circuit board that is not irradiated with light emitted from a light source placed at the opening. The encryption device is a device used for an encryption process of data to be stored into the nonvolatile memory package.

According to one embodiment, a semiconductor storage device includes a housing, a first board, a heat generating component, an electronic component, and a thermal-conductive sheet. The housing has a first vent hole. The first board is accommodated in the housing. The heat generating component is mounted on the first board. The electronic component is disposed between the heat generating component and the first vent hole. The thermal-conductive sheet is provided to extend over the heat generating component and the electronic component, or provided to extend from a region positioned on a rear side of the heat generating component on the first board to the electronic component.

A hermetically sealed electronic package may include a thermal panel having a panel interior surface and a panel exterior surface with electronic device(s) in thermal communication with the panel interior surface. An enclosure, isolating environmental communication from internal electronic devices and modules, may be coupled to the thermal panel, and the enclosure may have an enclosure interior surface and an enclosure exterior surface. A plurality of electrical feedthroughs may be coupled to the package enclosure for signal and data transmission, and the conducting pin(s) in every electrical feedthrough may be bonded by a hydrophobic sealing material for harsh environmental electrical signal, data and power transmission. The ratio of sealing length over sealing bead diameter in the electrical feedthrough subassembly may have a preferred value from 2 to 3; and the ratio of the sealing bead diameter over pin diameter in the electrical feedthrough subassembly may have a preferred value from 1.5 to 2.0, where a preferred thermal stress resistance could be designed for making highly hermetic sealed electronic package.

An electronic control device includes: a board; a heat generating component mounted on the board; a heat conductive sheet thermally coupled to one surface of the heat generating component located on a side opposite to the board side; and a cooling mechanism thermally coupled to the heat conductive sheet. The heat conductive sheet includes a folded structure having a plurality of folded-back portions and a plurality of connection portions provided between the folded-back portions, and the plurality of folded-back portions of the heat conductive sheet is thermally coupled to each of the heat generating component and the cooling mechanism.