Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, a hinge that rotatably couples the first housing to the second housing, and a flexible heat spreader that extends from the second housing, through the hinge, and to the first housing. The hinge can accommodate deformations in the flexible heat spreader when the first housing is rotated relative to the second housing.

A cooling device for a heterogeneous microchip is fabricated such that different cooling profiles can be provided for different chips. A housing is made of thermal conductive material, the housing having a plurality of channels formed therein. Electric contacts are provided inside each of the channels. Each channel can fit either a thermoelectric cooling device or a metallic block to provide different cooling profiles and design requirements. The cooling device is inserted between a liquid cooling plate and the chip to adjust and enhance heat transfer from the chip to the cooling plate. Alternatively, the cooling plate itself can serve as the housing with the channels, in which case the housing is provided with coupling for liquid pipes or hoses.

An electronic device includes a top plate having a first surface and a second surface that is positioned at an elevation that is lower than an elevation of the first surface, the second surface extending from a first end part of the top plate to a second end part of the top plate, a bottom plate provided under the top plate, and a circuit board placed between the top plate and the bottom plate and mounted with an electronic component. The top plate has opposing first and second edges and opposing third and fourth edges that are perpendicular to the first and the second edges, the first end part being formed at the first edge and the second end part being formed at the second edge.

A cooling device includes: an electronic component; a circuit board on which the electronic component is mounted; and a heat sink provided to dissipate heat to an outside of the cooling device. The cooling device also includes: a graphite sheet integrally provided on a surface of the heat sink on one side facing the electronic component; a heat conductive portion contacting both a part of the graphite sheet and the electronic component; and a shielding portion. The shielding portion is provided at a position between a portion of the circuit board where no electronic component is mounted and the graphite sheet to cover a shielded surface of the graphite sheet.

There is disclosed a missile comprising an outer skin, an electronics unit, and a thermal link between the electronics unit and the outer skin. The thermal link comprises a jumping drop vapour chamber arranged such that, when the outer skin is at an elevated temperature relative to the electronics unit, the electronics unit is thermally insulated from the outer skin; and such that, when the outer skin is at a lower temperature relative to the electronics unit, the electronics unit is thermally linked to the outer skin.

The heat dissipation assembly structure of a power includes a housing having an open upper portion, a power part having one surface supported by the housing, a printed circuit board disposed above the power part and electrically connected to the power part, and a cover member covering the upper portion of the housing and being coupled to the housing, wherein an inner surface of the cover member presses the other surface of the power part in a direction toward the housing to fixedly press the power part between the housing and the cover member.

With an objective of obtaining a temperature control unit capable of highly uniform temperature control, provided is a temperature control unit (1) having a heat transfer medium introduction port (2) configured to introduce a heat transfer medium from outside, a temperature control mechanism (3) through which the heat transfer medium from the heat transfer medium introduction port (2) passes, and a heat transfer medium discharge port (4) configured to discharge the heat transfer medium from the temperature control mechanism (3) to outside, wherein: the temperature control mechanism (3) is provided with a porous metal body and a housing (5) configured to house the porous metal body; at least one main surface of the housing (5) is exposed to an outer side of the temperature control mechanism (3), and an inner side of the main surface contacts the porous metal body, thereby exchanging heat between the porous metal body and outside; and a heat transfer medium dispersion area (10) is provided between the heat transfer medium introduction port (2) and the porous metal body.

According to an embodiment, an electronic apparatus includes a printed circuit board including a plurality of devices that include a nonvolatile memory package and a controller package configured to control the nonvolatile memory package, and a housing accommodating the printed circuit board. The housing includes an opening on a surface constituting the housing. An encryption device among the plurality of devices is present in a first region. The first region is a region on the printed circuit board that is not irradiated with light emitted from a light source placed at the opening. The encryption device is a device used for an encryption process of data to be stored into the nonvolatile memory package.

An electronic device having a shielding structure disposed around electronic components and having high heat dissipation performance is provided. The electronic device includes a circuit board, at least one electronic component mounted on a surface of the circuit board, a shielding sheet attached to the surface of the circuit board to cover the at least one electronic component, a thermal interface material stacked on the shielding sheet to overlap the at least one electronic component, and a heat dissipation member disposed to face the surface of the circuit board, being in surface contact with the thermal interface material, and fastened to at least a portion of the circuit board by a fixing member. Various other embodiments may be possible.

A solid-state drive device includes a first module including a first region containing a volatile main memory device and a controller device and a second region containing a first nonvolatile memory device, a second module disposed on the first module and having a third region containing a second nonvolatile memory device, the second module being connected to the first module, and a heat dissipating member disposed on the second module as vertically juxtaposed with the first and second modules. The heat dissipating member has a protruding portion protruding toward the first module and in direct thermal contact with the first region, and a plate-shaped portion having a main surface in direct thermal contact with the third region.