A mounting enclosure assembly is configured to mount electronic components onto a DIN rail. The mounting enclosure assembly includes a mounting bracket including a body having at least one elongate slot configured to receive an edge of the electronic component therein. The mounting enclosure assembly further includes a heat sink secured to the mounting bracket. The heat sink includes a mounting configuration configured to secure the heat sink and the mounting bracket to the DIN rail. The mounting enclosure assembly further includes a thermal bonding material disposed within the slot to secure the electronic component to the body of the mounting bracket within the slot. Other embodiments of the mounting enclosure assembly are further disclosed.

A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes fins and a mating surface positioned at a base of the fins. The TIM includes a first surface that is coupled to the mating surface of the heat sink and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a rotational cam. When the rotational cam is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the rotational cam moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

Disclosed is an electronic device including a shielding member. The electronic device includes a substrate having an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate.

A cooling device for a heterogeneous microchip is fabricated such that different cooling profiles can be provided for different chips. A housing is made of thermal conductive material, the housing having a plurality of channels formed therein. Electric contacts are provided inside each of the channels. Each channel can fit either a thermoelectric cooling device or a metallic block to provide different cooling profiles and design requirements. The cooling device is inserted between a liquid cooling plate and the chip to adjust and enhance heat transfer from the chip to the cooling plate. Alternatively, the cooling plate itself can serve as the housing with the channels, in which case the housing is provided with coupling for liquid pipes or hoses.

A mounting enclosure assembly is configured to mount electronic components onto a DIN rail. The mounting enclosure assembly includes a mounting bracket including a body having at least one elongate slot configured to receive an edge of the electronic component therein. The mounting enclosure assembly further includes a heat sink secured to the mounting bracket. The heat sink includes a mounting configuration configured to secure the heat sink and the mounting bracket to the DIN rail. The mounting enclosure assembly further includes a thermal bonding material disposed within the slot to secure the electronic component to the body of the mounting bracket within the slot. Other embodiments of the mounting enclosure assembly are further disclosed.

The present disclosure provides a connector assembly comprising a cage and a heat sink. The cage has a receiving space and a wall constituting the receiving space, the wall is formed with a window which is communicated with the receiving space and two latching plates which are provided to two sides of the window and extend away from the receiving space, each latching plate is integrally formed with a latching protrusion, the latching protrusion has a guiding portion and a latching portion, a protruding amount of the guiding portion from the latching plate gradually increases as a distance of the guiding portion from the receiving space decreases, the latching portion is positioned to a tip end surface of the guiding portion. The heat sink has a base plate, in a process that the heat sink is assembled to the cage, the base plate pushes against the guiding portions of the latching protrusions of the two latching plates to make the two latching plates elastically move, after the base plate passes over the guiding portions of the latching protrusions of the two latching plates, the latching portions of the latching protrusions of the two latching plates latch with the base plate.

A heat dissipation structure includes a heat sink, a first thermal interface material, a second thermal interface material, a circuit board and a circuit element. The first thermal interface material is connected to the heat sink and has fluidity. The second thermal interface material is connected to the first thermal interface material and has no fluidity. The circuit board is connected to the second thermal interface material and has an opening, a top board surface and a bottom board surface. The circuit element includes a convex portion and a base portion. The convex portion has a top convex surface and is disposed in the opening. The base portion is connected to the convex portion and the bottom board surface. The second thermal interface material is connected to the top board surface and the top convex surface.

Implementations for heat structure for thermal mitigation are described. The described heat structures, for instance, provide a multi-layered structure that optimizes heat spreading and dissipation, as well as wireless performance of wireless devices. A heat structure, for instance, is installed internally in a wireless device adjacent various internal components to absorb heat generated by the components, and to dissipate the heat. According to various implementations, a heat structure is implemented as a thermally conductive layer surrounded by layers of electrically conductive material. Electrically conductive vias can be formed that traverse the thermally conductive layer and form an electrical connection between different electrically conductive layers to mitigate current flow in the thermally conductive layer.

To obtain a heatsink having a plurality of components firmly joined together. The heatsink includes a tabular base part having an electronic component contact surface on one side in the thickness direction thereof to make contact with an electronic component, a tabular column portion arranged in parallel on the other side of the base part across a heat dissipation space, and the column portions provided between the base part and the heat dissipating part. The heat dissipating part, the column portions, and the base part are provided with insertion holes that extend therethrough, and the heat dissipating part, the column portions, and the base part are fixed together by an inner member inserted into the insertion holes.

An electronic device is provided, which may include at least one housing including a first housing and a second housing, wherein the first housing is movable relative to the second housing; a circuit board disposed in the at least one housing; at least one electronic component disposed on the circuit board; a side wall including a first surface and a second surface opposite to the first surface, wherein the first surface is facing at least a portion of the circuit board; a first heat dissipation structure configured to transfer at least some of heat from the at least one electronic component to the side wall; and a second heat dissipation structure configured to dissipate the at least some of heat transferred by the first heat dissipation structure.