Disclosed is an electronic device including a shielding member. The electronic device includes a substrate having an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate.

A new wiring and power and communications system for an automobile that includes a plurality of devices, wherein the devices are connected to a backbone section that has an outer sheathing, a first conductor disposed within the outer sheathing, a second conductor disposed within the outer sheathing, a pair of inner sheathing members disposed within the outer sheathing and located on opposing sides of the at least one conductor, the inner sheathing members configured to electrically insulate the first conductor from the second conductor, and a shield member disposed within the outer sheathing.

Disclosed are an electromagnetic shielding structure and a manufacturing method thereof, and an electronic product. The manufacturing method comprising the following steps: covering an injection mold on a circuit substrate, so that different circuit units on the circuit substrate are respectively accommodated in different injection molding cavities of the injection mold; injecting a non-conductive plastic sealant into the injection molding cavities so as to form non-conductive plastic sealing bodies on the circuit units, wherein spacing grooves are formed between the non-conductive plastic sealing bodies; and forming a conductive shielding layer on the non-conductive plastic sealing bodies, so that the conductive shielding layer covers the non-conductive plastic sealing bodies and fills the spacing grooves to form shielding barrier walls, thereby realizing shielding between the different circuit units in respective cavities. The present disclosure has the advantages of reducing manufacturing cost and simplifying manufacturing process.

An electrical junction box includes: a substrate unit having a circuit board on which a conductive path including a ground line is formed, a shield case for covering the circuit board, and a first fastening member for fastening the circuit board and the shield cases; a case unit having resin cases made of resin and a frame fixed to the resin case; and a second fastening member for fastening the circuit board in the substrate unit and the case unit, in which the shield case is electrically connected to the ground line by fastening the circuit board and the shield case with the first fastening member.

Disclosed are exemplary embodiments of thermally-conductive electromagnetic interference (EMI) absorbers. In exemplary embodiments, the thermally-conductive EMI absorber may have a thermal conductivity of at least 6 Watts per meter per Kelvin (W/mK) and an attenuation greater than 15 decibels per centimeter (dB/cm) at a frequency of 10 gigahertz (GHz) or higher.

Disclosed is an electromagnetic wave shielding structure. The electromagnetic wave shielding structure comprises: a printed circuit board having a plurality of elements mounted therein and having a ground pad surrounding the plurality of elements; an insulation member made of a pre-molded insulating material and attached to the printed circuit board to surround the plurality of elements; and a conductive coating layer covering an exterior surface of the insulation member, wherein the conductive coating layer is connected to the ground pad.

An optoelectronic device comprises a substrate, an optoelectronic element mounted on the substrate, a shielding cap providing electromagnetic shielding, at least one optical element attached to the shielding cap, and a detection element configured to detect if the shielding cap is mounted on the substrate.

Disclosed is an electromagnetic wave shielding structure. The electromagnetic wave shielding structure comprises: a printed circuit board having a plurality of elements mounted therein and having a ground pad surrounding the plurality of elements; an insulation member made of a pre-molded insulating material and attached to the printed circuit board to surround the plurality of elements; and a conductive coating layer covering an exterior surface of the insulation member, wherein the conductive coating layer is connected to the ground pad.

An electromagnetic shielding structure may be formed having a planar structure and at least one footing projecting from the planar structure, wherein at least one of the planar structure and the at least one footing comprises a heat resistant plastic core and an electrically conductive material abutting at least a portion of the heat resistant plastic core. In one embodiment, an integrated circuit assembly may be formed comprising at least one integrated circuit device electrically attached to an electronic substrate and the electromagnetic shield structure electrically attached to the electronic substrate adjacent to the at least one integrated circuit device.

A system includes a shield for a low noise amplifier. The shield includes a top and one or more walls extending from the top defining a cavity. The shield further comprises at least one conducting member extending outwardly from the top and within the cavity. The shield may enclose an amplifier circuit and improve its signal-to-noise ratio.