A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The side wall and ceiling portions are forming accommodation space to accommodate electronic component, the ceiling portion has a first surface facing the space and a second surface on the opposite side, the side wall portion has a third surface facing the ceiling portion, a fourth surface on the opposite side, a fifth surface facing the space, and a sixth surface on the opposite side, and the side wall portion is formed such that the sixth surface has a first inclined portion increasing distance to the space from the third toward fourth surfaces and a second inclined portion increasing distance to the space from the fourth toward third surfaces.

A shield cap for protecting an electronic component includes a cap member having a ceiling portion, a side wall portion and a partition wall portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The cap member is formed such that the ceiling portion has an inner region and an outer region surrounding the inner region, the side wall portion is supporting the outer region, and the partition wall portion is supporting the inner region, the ceiling portion has a first surface facing the side wall portion and the partition portion and a second surface on the opposite side and includes a reinforcing material positioned between the first and second surfaces, and the cap member is formed such that the side wall, ceiling and partition wall portions are forming multiple accommodation spaces to accommodate multiple electronic components.

A shield can of a mobile terminal is provided. The shield can of the mobile terminal includes: at least one shield can installed in a main circuit board of the mobile terminal, and at least one separation wall formed between electronic elements in which electromagnetic interference occurs within the shield can. Hence, shield ability can be improved and simplified manufacturing process of the separation wall can reduce cost.

An electromagnetic wave shield structure includes: a substrate on which an electromagnetic wave emission source is mounted; a frame body provided over the substrate and including a conductor which surrounds an outer periphery of the electromagnetic wave emission source and receives a specific potential from the substrate; and a lid body, including a first insulator portion including a first surface facing the electromagnetic wave emission source and a second surface opposite to the first surface which are covered by a first conductive film electrically coupled with the frame body, configured to close an opening end of the frame body.

A method for manufacturing an electromagnetic shield housing for shielding an electronic component on a printed circuit board comprises providing a metallic lid with a shielding chamber at an underside for accommodating and covering the electronic component on the printed circuit board; filling the shielding chamber with an RF-absorber material; and removing RF-absorber material from the shielding chamber until the electronic component fits into the shielding chamber while a ceiling and lateral walls of the shielding chamber remain covered with RF-absorber material.

The disclosure relates to a shielded electronic module which includes a module shielding structure and an electronic module with an interposer, a shielded electronic submodule over the interposer, and a module mold compound over the interposer and encapsulating sides of the shielded electronic submodule. Herein, the shielded electronic submodule includes an electronic submodule and a submodule side shielding structure, which covers sides of the electronic submodule to provide the sides of the shielded electronic submodule. A top surface of the electronic module is a combination of a top surface of the module mold compound and a top surface of the shielded electronic submodule, which is not covered by the module mold compound. The module shielding structure directly and continuously covers the top surface and sides of the electronic module, such that the submodule side shielding structure is electrically connected to the module shielding structure to individually shield the electronic submodule.

A lightweight thermally dissipative EMI shield for electronics is composed of both metallic (e.g., conductive) and non-metallic (e.g., nonconductive) materials. The thermally dissipative EMI shield or cover may be formed of multiple layers of metallic or conductive materials and at least one layer of non-metallic or nonconductive material. There may be a conductive base layer, a lower intermediate nonconductive layer, an upper intermediate conductive layer, and an outer nonconductive layer. The conductive layers operate to thermally dissipate heat and suppress EMI, whereas the nonconductive layers provide lightweight rigidity and stiffness to support the EMI shield and protect components from foreign object ingress or damage of a circuit card or cover is coupled.

According to one embodiment, an electromagnetic wave attenuator includes a stacked member including a first planar portion. The first planar portion includes a first stacked body. The first stacked body includes a plurality of non-magnetic layers including Cr and Ti, and a plurality of first magnetic layers. A direction from one of the first magnetic layers to an other one of the first magnetic layers is along a first direction. One of the non-magnetic layers is between the one of the first magnetic layers and the other one of the first magnetic layers. The one of the first non-magnetic layers includes an amorphous region. The one of the first magnetic layers and the other one of the first magnetic layers include a crystal region.

Disclosed is an electronic device including a shielding member. The electronic device includes a substrate having an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate.