A shield structure includes: a shield frame electrically conductive and disposed around an electronic component mounted on a board top face of a circuit board, the shield frame having a lower end positioned toward, and secured to, the board top face to conduct electricity to the circuit board, and an upper end opened, and positioned across from the lower end; and an electrically conductive plate provided to the upper end of the shield frame, the electrically conductive plate including a thin area thinned across from the electronic component and the shield frame, and electrically connected to the shield frame through the thin area.

A semiconductor device has a substrate and a first semiconductor die disposed over the substrate. A first metal frame is disposed over the substrate around the first semiconductor die. A first metal lid is disposed over the first metal frame. A flap of the first metal lid includes an elastic characteristic to latch onto the first metal frame. An edge of the flap can have a castellated edge. A recess in the first metal frame and a protrusion on the first metal lid can be used to latch the first metal lid onto the first metal frame. A second metal frame and second metal lid can be disposed over an opposite surface of the substrate from the first metal frame.

An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

A shielding member includes a frame body and an outer cover. Two sides of a first end of the frame body respectively include a first shaft portion. Two sides of the frame body respectively include a first side plate. The frame body is covered by the outer cover. Two sides of a first end of the outer cover respectively include a second shaft portion, and each of the second shaft portions is pivotally connected to the corresponding first shaft portion. Two sides of the outer cover respectively include a second side plate, and each of the second side plates covers an outer side of the corresponding first side plate. Accordingly, the frame body and the outer cover are assembled to form a one-piece metallic shielding member. The structure of the shielding member is simple, the manufacturing for the shielding member is easy, and the cost for manufacturing the shielding member is reduced.

Disclosed are a housing for receiving an electronic device and an electronic system having the same. The electronic system includes a case having lower and upper cases detachably combined with the lower case, a circuit board arranged in an inner space of the case and secured to the lower case such that at least a grounding line and at least a connection line are provided with the circuit board, a plurality of devices arranged on the circuit board such that each device is separated from one another by the grounding line and is connected with one another by the connection line, and at least an electromagnetic shielding member embedded onto the upper case such that the electromagnetic shielding member is in contact with the grounding line around the device to provide a shielding space receiving the device. The device is protected from unexpected electromagnetic waves by the electromagnetic shielding member.

The proposed design concerns RF shielding can that has the benefits of an RF can, but without compromising the thermal design of the system.

A shield can assembly is described. In one or more implementations, a frame is installed on a printed circuit board (PCB) by using a cross-bar connected to opposing sides of the frame to place the frame on the PCB. Subsequent to installation of the frame on the PCB, the cross-bar is removed from the frame. Once the cross-bar is removed, one or more flexible printed circuits (FPCs) are installed on the PCB. Then, a lid is connected to the frame to from a shield can over the FPCs.

The present disclosure relates to a substrate structure, including a substrate including at least one electronic device, a first SMD gasket configured to remove an electromagnetic wave formed on the substrate and radiated from the substrate, a second SMD gasket configured to remove an electromagnetic wave formed on the substrate and radiated from the substrate, and a cover shield installed on a surface confronting the substrate to externally discharge heat within the installed region. Here, if a frequency generated from the electronic device is a specific frequency, a spaced distance between the first SMD gasket and the second SMD gasket is set to a length different from a prescribed magnification of a wavelength corresponding to the specific frequency.

Disclosed are a housing for receiving an electronic device and an electronic system having the same. The electronic system includes a case having lower and upper cases detachably combined with the lower case, a circuit board arranged in an inner space of the case and secured to the lower case such that at least a grounding line and at least a connection line are provided with the circuit board, a plurality of devices arranged on the circuit board such that each device is separated from one another by the grounding line and is connected with one another by the connection line, and at least an electromagnetic shielding member embedded onto the upper case such that the electromagnetic shielding member is in contact with the grounding line around the device to provide a shielding space receiving the device. The device is protected from unexpected electromagnetic waves by the electromagnetic shielding member.

An electronic device is provided. The electronic device includes a circuit board, at least one electric component disposed on one surface of the circuit board, a shield can mounted on the one surface of the circuit board, with the at least one electric component received in the shield can, and including at least one opening formed in an area corresponding to the at least one electric component, a shielding sheet disposed in at least a portion of the shield can and blocking at least a portion of the at least one opening, and a heat transfer member disposed in contact between the at least one electric component and the shielding sheet. The shielding sheet includes a flexible structure.