A frame includes a plurality of walls each having a first end and a second end facing away from each other along a first direction, and a plurality of spring fingers on the second end of one or more walls of the plurality of walls and extending along the first direction. First ends of the plurality of walls define an open bottom, and second ends of the plurality of walls define an open top.

An electronic device includes a board having a first surface on which a heating element is mounted, a heat sink plate disposed to face the first surface of the board, and a heat pipe disposed between the board and the heat sink plate such that one end of the heat pipe is disposed at a position where the one end is in contact with the heating element, and the other end of the heat pipe is disposed to be in contact with the heat sink plate, wherein the heat sink plate has a stacking structure of a first heat sink plate of which a front surface faces the board, and a second heat sink plate disposed on a rear surface of the heat sink plate, and a through hole is formed at a position on the first heat sink plate.

Systems and methods for thermal management for high power density EMI shielded electronic devices. In one embodiment, an electronic module comprises: a circuit board; at least one integrated circuit mounted to the circuit board; at least one electro-magnetic interference (EMI) shield fence mounted to the circuit board, wherein the at least one integrated circuit is mounted within a perimeter defined by the EMI shield fence; a heatsink EMI shield lid secured onto the at least one EMI shield fence, wherein the heatsink EMI shield lid seals the at least one integrated circuit within the at least one EMI shield fence; wherein the heatsink EMI shield lid comprises a spring loaded thermal interface in conductive thermal contact with the at least one integrated circuit.

An electronic device includes a substrate, at least one electronic element and a heat dissipating electromagnetic shielding structure. The heat dissipating electromagnetic shielding structure is disposed on the substrate and covers the at least one electronic element, wherein the heat dissipating electromagnetic shielding structure includes a shielding frame and a heatsink. The shielding frame includes a plurality of spring members. The spring members are bent toward the substrate and partially abut against the heatsink. When the heatsink and the shielding frame are correspondingly arranged, a shielding space is defined, the electronic element is disposed in the shielding space, and a heat generated by the at least one electronic element is conducted out of the shielding space via the heatsink.

Provided is an electronic circuit board assembly. The electronic circuit board assembly includes an electronic circuit board, a plurality of electronic circuit devices disposed on the electronic circuit board, an electromagnetic interference (EMI) shielding structure configured to shield an electromagnetic wave generated from the plurality of electronic circuit devices, and a thermal pad configured to dissipate heat generated from the plurality of electronic circuit devices. The EMI shielding structure covers the plurality of electronic circuit devices and is attached to the electronic circuit board, and the thermal pad is disposed between the plurality of electronic circuit devices and the EMI shielding structure, contacts the plurality of electronic circuit devices and the EMI shielding structure, and thereby can transfers the heat generated from the plurality of electronic circuit devices to the EMI shielding structure.

An electronic device may have a printed circuit to which electrical components are mounted. Electromagnetic shields may be mounted to the printed circuit over the components to suppress interference. A shield may have a metal frame covered with a conductive fabric. The conductive fabric may cover an opening in the top of the frame. An insulating layer may be formed on the lower surface of the conductive fabric to prevent shorts between components on the printed circuit and the conductive fabric. An insulating cap such as an elastomeric polymer cap may also be formed over each component to provide electrical isolation between the components and the conductive fabric. Shields may be formed by coupling shield cans to subscriber identity module shields or other metal structures in a device. Intervening wall structures may be removed to help provide additional shielding volume.

A heat-dissipation and shielding structure, including a shielding case, a thermal pad, and a heat sink. The bottom of the shielding case is connected to a circuit board used to carry a heat emitting element, the heat sink is disposed on the top of the shielding case, the top of the shielding case is provided with an opening, the thermal pad runs through the opening, a bottom surface of the thermal pad is attached to the heat emitting element, and a top surface of the thermal pad is attached to the heat sink; and the heat-dissipation and shielding structure further includes a metal spring plate, where the metal spring plate is located on a periphery of the opening and encircles the opening, and the metal spring plate is elastically connected between the shielding case and the heat sink.

An electronic device may include a noise shielding device that may include: a substrate including at least one heat generating component; a metallic shield cover that is disposed on the substrate to enclose the at least one heat generating component; a metal housing disposed around the shield cover; and a heat transfer member that is configured to transfer heat emitted from the heat generating component through an opening formed at a position corresponding to the heat generating component to the metal housing, wherein the metallic shield cover includes a plurality of tension fingers that protrude at predetermined intervals and contact a bottom face of the metal housing, and noise emitted from the heat generating component is shielded by a shielding region that is formed by the tension fingers and the metal housing.

According to various aspects, exemplary embodiments are disclosed of board level shields. In an exemplary embodiment, a board level shield (BLS) includes a fence and a lid. The fence is solderable to a printed circuit board (PCB). When the lid is engaged to the fence that has been soldered to the PCB, the BLS provides substantial electromagnetic interference (EMI) shielding protection to the components covered by the BLS. The lid may be constructed of a frame and a cover. The cover may be a film or foil. The lid may attach to the fence via a one way directional latching mechanism, which may be enhanced by the use of one or more interior downward tabs on the lid that meet one or more inward protrusions from the fence to create pressure on the lid and fence.

An electronic device may include a printed circuit board (PCB) including at least one electronic component, and an electrically conductive enclosure surrounding the at least one electronic component to provide electromagnetic interference (EMI) shielding for the at least one component. The electrically conductive enclosure may include a frame, made of a resilient, electrically conductive material, on a mounting surface of the PCB, surrounding the at least one component, and an electrically conductive shielding cover extending across an open top area defined by the frame. The frame may be attached to the PCB and the cover by an electrically conductive material to provide for electrical continuity. The frame may be made of a resilient, electrically conductive material so that the frame may compress in response to an externally applied force, and may return to an original, non-compressed form upon removal of the externally applied force.