A modular system of plastic walls having embedded and coextensive electrically conductive components configured to electrically connect with each other when the walls are mated. The walls have joining edges that form joint seams with other walls when joined together to create an enclosure. When enough walls are used to surround a storage space, a Faraday cage is created. The walls additionally have portions of tortuous paths at each joining edge that mate with a complementary portion of a tortuous path of another wall when the walls are joined together. A torturous path seal is thereby created at each joint seam. The plastic walls can be configured in a multiplicity of combinations to create various enclosures necessary for RFID-enabled storage and tracking of medical articles. Containers, enclosures, cabinets, and drawers of differing heights and sizes can be made and they may be stacked or otherwise assembled.

According to various aspects, exemplary embodiments are disclosed of frames for shielding assemblies including detachable or severable pickup members. Also disclosed are exemplary embodiments of shielding assemblies (e.g., board level shields, etc.) including the same.

A first sheet metal is provided with slits. Elastic pieces having flat shapes are each formed between the slits adjacent to each other, and both ends of each of the elastic pieces are connected with both ends of an adjacent one of the elastic pieces. A second sheet metal is provided with protrusions each of which is protruded toward a corresponding one of the elastic pieces.

Disclosed is an electronic device including a shielding member. The electronic device includes a substrate having an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate.

An electronic device is disclosed. The electronic device may comprise: a housing; a substrate disposed inside the housing and comprising a first electric element and an adhesive material; and a shielding material fixed to the substrate by the adhesive material, the shielding member having a shielding space formed therein, the first electric element being disposed in the shielding space. The shielding member may comprise: a plate facing the substrate; and a side wall formed between the plate and the substrate so as to connect the plate and the substrate, the side wall extending in a peripheral direction so as to surround the shielding space. The adhesive material may be disposed on the substrate so as to surround at least a part of the side wall. The side wall may comprise: an outer surface directed toward the shielding space; an inner surface disposed opposite the outer surface; and a bottom surface facing the substrate. The adhesive material has at least a part formed to at least partially cover the outer surface and the inner surface. At least one of the outer surface and the inner surface may have a recess formed therein so as to contain the adhesive material. Various other embodiments understood from the specification are also possible.

An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

Provided is an electronic device including a circuit board having a first surface and a second surface, a first member covering the first surface to function as a shield of the circuit board and having a first encompassing region having, in at least a portion thereof, a first outer region, and a second member that is placed on a side of the second surface that has a second outer region. One of the first and the second outer regions has at least one outer fixed portion fixed to another of the first and the second outer regions and at least one projection located away from the at least one outer fixed portion in a direction along an outer edge of the circuit board. The first and the second members are in contact with each other with the at least one outer fixed portion and the at least one projection.

An electronic measuring device includes a main printed circuit assembly and one or more channel modules. At least one channel module includes a channel printed circuit board and a first insulating housing that defines a cavity covering at least part of electrical elements mounted on the channel printed circuit board. A first conductive shielding frame is placed on the first insulating housing and is separated from the channel printed circuit board by the first insulating housing. The first conductive shielding frame covers the electrical elements mounted on the channel printed circuit board. A second insulating housing sandwiches the first conductive shielding frame between the second insulating housing and the first insulating housing which lengthens an electrical path from the first conductive shielding frame to the channel printed circuit board.

A modular system of medical article containers is used to form enclosures of selectable storage space. The containers are each RF shielded and include an interconnect wall for connecting to another container to form the enclosure. The interconnect walls have a complementary design. The interconnect seam of two containers includes an electrically conductive component that also interconnects the RF shields of the two containers together. The interconnect seam also includes a tortuous path seal for greater RF shielding of the enclosure. The walls of the containers include a substrate of non-electrically conductive material for weight reduction and an electrically conductive element that is coextensive with the substrate. One embodiment is a plastic substrate with a metallic mesh. The enclosure provides a Faraday cage about the interconnected containers. Enclosures of differing heights and sizes can be made, and they may be stacked or otherwise assembled.

A semiconductor device has a substrate and a first semiconductor die disposed over the substrate. A first metal frame is disposed over the substrate around the first semiconductor die. A first metal lid is disposed over the first metal frame. A flap of the first metal lid includes an elastic characteristic to latch onto the first metal frame. An edge of the flap can have a castellated edge. A recess in the first metal frame and a protrusion on the first metal lid can be used to latch the first metal lid onto the first metal frame. A second metal frame and second metal lid can be disposed over an opposite surface of the substrate from the first metal frame.