H05K2201/10757

Pressing of wire bond wire tips to provide bent-over tips

In a method for forming a microelectronic device, a substrate is loaded into a mold press. The substrate has a first surface and a second surface. The second surface is placed on an interior lower surface of the mold press. The substrate has a plurality of wire bond wires extending from the first surface toward an interior upper surface of the mold press. An upper surface of a mold film is indexed to the interior upper surface of the mold press. A lower surface of the mold film is punctured with tips of the plurality of wire bond wires for having the tips of the plurality of wire bond wires extending above the lower surface of the mold film into the mold film. The tips of the plurality of wire bond wires are pressed down toward the lower surface of the mold film to bend the tips over.

Printed circuit board configuration to facilitate a surface mount double density QSFP connector footprint in a belly-to-belly alignment
10791629 · 2020-09-29 · ·

An electronic device includes a printed circuit board (PCB). The PCB includes first and second grids disposed at a top surface and a bottom surface of the PCB, respectively. Each grid includes a plurality of footprint pins, and a plurality of vias extending through the PCB to the top and bottom surfaces. Each footprint pin includes a connecting end and a free end that opposes the connecting end. Each via includes a contact end located at one of grids and is in electrical contact with the connecting end of one of the footprint pins, and each via further includes a non-contact end that is located at the other of the grids and is not in electrical contact with any of the footprint pins. First and second connectors are mounted to the PCB top and bottom surfaces and connect with the footprint pins of the first and second grids.

LEAF SPRING CONNECTOR FOR LITHIUM-ION BATTERY CELLS
20240014515 · 2024-01-11 · ·

The present disclosure describes a non-welded leaf spring battery cell connector which allows for unrestricted outgassing during Lithium-Ion thermal runaway. The connector also has a low-resistance electrical connection surface for applications with rough, uneven contact surfaces such as those on refurbished Lithium-Ion battery cells. The connector is compatible with both protected and unprotected Lithium-Ion cells, as it allows for up to about 5 mm of vertical travel to support varying battery cell lengths caused by battery protection circuits. The leaf spring connector for Lithium-Ion battery cells is made of a conductive sheet of metal, cut and folded into a leaf-spring connector for a removable, non-welded battery cell. The leaf spring connector has one or more areas of material removed, as to not block the flow of caustic gasses during emergency outgassing.

Connection terminal assembled body and circuit board using same connection terminal assembled body

A unit connection terminal (26) is formed of an adhesion section (29) to be soldered onto a circuit board (21) and extending in a longitudinal direction, a terminal section (30) extending in the direction approximately orthogonal to the adhesion section extending in the longitudinal direction and to be connected to a counterpart-side circuit board, a bent section (31) bent so as to connect the adhesion section and the terminal section, and of a suction member (28) made of synthetic resin, fixed more to the terminal side than the bent section (31), and having a suction surface. More preferably, a projection position where the gravity center position of the entire unit connection terminal is projected toward the adhesion section side is included in the adhesion range of the adhesion section.

Connection terminal assembly and electromotive drive device using same
10770955 · 2020-09-08 · ·

In an electrical connection terminal assembly and an electromotive drive device, a connector-side terminal is divided into two portions along an insertion direction of the connector-side terminal, thereby constituting divided terminal pieces. These divided terminal pieces are inserted between elastic terminal pieces of a base-board-side terminal, thereby electrically connecting the two parties. In this manner, the connector-side terminal is divided into the two portions to constitute the divided terminal pieces, and thus the rigidity of each of the divided terminal pieces can be decreased. Even if the connector-side terminal has been connected to the base-board-side terminal by prying, the divided terminal pieces of the connector-side terminal deform readily to follow the shape of the base-board-side terminal and thus it is possible to suppress an increased change in an electrical resistance and/or a thermal resistance between the base-board-side terminal and the connector-side terminal.

Method for modifying small form factor pluggable transceiver for avionics applications

A method for modifying a low-cost small form factor pluggable optical-electrical bidirectional transceiver (hereinafter SFP transceiver) by converting the SFP transceiver into a dual-in-line package. Such conversion enables the SFP transceiver to be soldered directly on a printed circuit board of a line replaceable unit of an avionics system, thereby eliminating the concern that the SFP transceiver may become detached due to vibration during aircraft operation. The method also includes a sealing process to protect the contact pads on the SFP transceiver, thereby eliminating any concern that the contact pads could corrode due to long-term moisture and humidity exposure. The product of the method is a ruggedized SFP transceiver capable of withstanding the rigors of operating in a harsh avionics environment onboard an aircraft.

Reverse mounted gull wing electronic package

An electronic assembly that includes a substrate having an aperture which extends through the substrate. The electronic assembly further includes a gull wing electronic package that includes leads which are solder mounted to the substrate such that the gull wing electronic package is within the aperture in the substrate, wherein the aperture is concentric with an exterior of the gull wing electronic package.

SEMICONDUCTOR APPARATUS

A semiconductor apparatus includes a metal body in which a through hole is formed, a socket that covers the metal body without closing the through hole, a connection terminal connected to the metal body and exposed to an outside of the socket, a control board having a metal pattern and a circuit pattern, and a semiconductor chip having a control terminal connected to the circuit pattern via the through hole without being in contact with the metal body, the connection terminal being connected to the metal pattern.

ELECTRICAL CONNECTION BOX

Provided is an electrical connection box according to which it is possible to suppress the occurrence of mistakes in a manufacturing process, and it is possible to reliably prevent the occurrence of faulty products. The electrical connection box to be used in a vehicle includes a terminal having an inner-fitting plate portion that is fit into and held in a slit of a holding member; and multiple substrate connection portions that protrude along a surface of the inner-fitting plate portion from one side edge of the inner-fitting plate portion. The terminal has a shape that is asymmetrical in a direction in which the multiple substrate connection portions are arranged side by side.

ELECTRONIC COMPRESSOR
20200166034 · 2020-05-28 ·

An electric compressor, which may secure a space part between a mechanism part on which a receiving element is mounted and a printed circuit board (PCB), thereby reducing a package, and freely disposing an element, and the present disclosure provides an electric compressor, which includes an inverter housing, a printed circuit board (PCB) coupled to the inverter housing, and a mechanism part provided between the inverter housing and the printed circuit board and on which a receiving element is mounted, and a space part is secured between the printed circuit board and the mechanism part.