The present disclosure provides a power module assembly and an assembling method thereof. The power module assembly includes a housing, a circuit board, at least one resilient set, at least two power devices, and at least one fastening unit. The housing includes at least one heat-dissipation surface. The at least one resilient set is disposed between the housing and the circuit board and includes at least one resilient piece. Each resilient piece includes a base section and two pushing fingers, so as to form an M-word shape or a bird-wings shape. The fastening unit is disposed between the two power devices, connected to the base section of the resilient piece and configured to drive the base section of the resilient piece, so that the two pushing fingers of the resilient piece push against the two power devices respectively and the two power devices are attached to the heat-dissipation surface.

A heat sink component can include a body including a thermally conductive material that is electrically non-conductive. At least one first terminal can be formed over a surface of the body. At least one second terminal can be formed over the surface of the body. A terminal spacing distance can be defined along the surface between the first terminal and the second terminal. A ratio of a length of the surface to the terminal spacing distance can be greater than about 10. Additionally or alternatively, a ratio of the area of the at least one body surface to the total terminal area can be less than 1.2. A component assembly can include a device having a plurality of terminals exposed on a top surface, and the heat source terminal and the heat sink terminal of the heat sink component can be connected with respective terminals of the device.

A solder component includes one or more terminal members each having a bending portion bending in a direction crossing a surface of a substrate and being connected to the surface of the substrate, and four or more substrate connection portions formed at end portions of the terminal members, three substrate connection portions out of the four or more substrate connection portions each having a width narrower than a width of the bending portion of the corresponding terminal member, when the solder component is disposed on the surface of the substrate, only the three substrate connection portions being in contact with the surface of the substrate, and no matter where a contact point contacting the surface of the substrate is provided on each substrate connection portion, a mass center of the solder component being located inside a triangle determined by three contact points of the three substrate connection portions.

A solder component includes one or more terminal members each having a bending portion bending in a direction crossing a surface of a substrate and being connected to the surface of the substrate, and four or more substrate connection portions formed at end portions of the terminal members, three substrate connection portions out of the four or more substrate connection portions each having a width narrower than a width of the bending portion of the corresponding terminal member, when the solder component is disposed on the surface of the substrate, only the three substrate connection portions being in contact with the surface of the substrate, and no matter where a contact point contacting the surface of the substrate is provided on each substrate connection portion, a mass center of the solder component being located inside a triangle determined by three contact points of the three substrate connection portions.

An automotive component assembly comprises an input circuit portion for a sensor and a component portion. The input circuit portion is aligned with the component portion in a desired assembly position. A pocket is at least partially defined by the component portion to receive the input circuit portion and a clamping force retains the input circuit portion between a first layer and a second layer of the component portion forming the pocket. An overmold material is applied to retain the input circuit portion and the component portion to one another.

A connection element for an electronic component assembly includes a support, a first contact pad, and a second contact pad. The first contact pad and the second contact pad are electrically connected. A first contact conductor has a first conductor surface electrically connected to the first contact pad at a first section, and is configured to form a welded connection in a second section of the first conductor surface, and/or on the second conductor surface. The invention also relates to an electronic component assembly which includes such a connection element, and which has at least one component welded to the contact conductor.

The present disclosure provides an integrated circuit comprising a main body and pins. The main body has a top and a bottom. The pins comprise upper pins placed on the top of the main body, and lower pins placed on the bottom of the main body.

An electronic device includes a substrate having a top surface, a bottom surface and at least one opening therethrough. The substrate has circuity. A relay is mounted to the substrate and is electrically connected to the circuitry. The relay has a switching device configured to activate the relay. The switching device has contacts electrically connected to the circuitry. The relay is mounted to the substrate in the opening such that at least a portion of the switching device is positioned above the top surface and at least a portion of the switching device is positioned below the top surface.

Assembly workability of an electric compressor to which an inverter circuit section and a filter circuit section are attached is improved. The inverter circuit section (3) includes an inverter control board (17), a sleeve assembly (18), and a power module (14). The inverter control board, the sleeve assembly, and the power module are integrated. The filter circuit section (4) includes a filter circuit board (66) and a support member (67). The filter circuit board (66) and the support member (67) are integrated. The inverter circuit section and the filter circuit section are structured to be capable of being stored each individually within an inverter storing section (8) from the same direction and detachably attached to the housing (2).

A semiconductor device package may include a substrate having an insulating layer with a patterned conductive layer formed thereon, the patterned conductive layer including at least a first pattern portion and a second pattern portion. The semiconductor device package may include a leadframe having a lead that is soldered to the substrate with solder provided in an opening between the first pattern portion and the second pattern portion and with the lead inserted into the opening.