A circuit board includes two first insertion holes, a second insertion hole located on one side of the two first insertion holes, a third insertion hole located on the other side of the two first insertion holes, and a number of grounding points. The grounding points are distributed on a periphery of the first insertion holes. The grounding points, the second insertion hole and the third insertion hole together form a shielding layer surrounding the periphery of the first insertion holes. The present disclosure also relates to a backplane connector assembly having a backplane connector and the circuit board. Compared with the prior art, the circuit board disclosed in the present disclosure improves the shielding effect of differential signal terminals, reduces crosstalk and improves the quality of signal transmission.

A backplane connector includes a housing and a number of wafers assembled to the housing. Each wafer includes a number of conductive terminals, an insulating frame and a metal shield. The housing includes an insulating housing and a metal shell fixed to the insulating housing. The insulating housing includes a number of slots for positioning the wafers. The metal shell is provided with a mating surface and a number of terminal receiving grooves. The contact portions of the conductive terminals are exposed in the corresponding terminal receiving grooves. The present disclosure improves the structural strength of the backplane connector and reduces the risk of damage the mating surface due to the push or collision of a mating connector.

A backplane connector includes a number of wafers and a spacer for assembling the wafers together. Each wafer includes an insulating frame and a number of conductive terminals fixed to the insulating frame. The insulating bracket includes a first protrusion and a second protrusion. The spacer includes a first body portion and a second body portion. The first body portion includes a first clamping slot for clamping the first protrusion. The second body portion includes a second clamping slot for clamping the second protrusion. The present disclosure increases the ability of the spacer to resist external forces and improves the structural stability of the backplane connector.

A backplane connector assembly includes a first backplane connector and a second backplane connector. The first backplane connector includes a number of first conductive terminals, a first insulating frame, a first metal shield and a second metal shield. The first metal shield includes a first elastic piece, and the second metal shield includes a second elastic piece. The second backplane connector includes a number of second differential signal terminals, an insulating block sleeved on the second differential signal terminals, and a metal shell sleeved on the insulating block. When the first backplane connector is mated with the second backplane connector, the first elastic piece and the second elastic piece are in contact with the metal shell to increase the grounding shielding area, reduce crosstalk and improve the quality of signal transmission.

A wafer includes a number of conductive terminals and an insulating frame. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. Each conductive terminal includes a connection portion and a contact portion. The connection portions of the differential signal terminals, the first ground terminal and the second ground terminal are located in a first plane. The first ground terminal includes a first torsion portion and the second ground terminal includes a second torsion portion. The contact portion of the first ground terminal and the contact portion of the second ground terminal are both perpendicular to the first plane. This present disclosure can provide better shielding effect, reduce crosstalk and improve the quality of signal transmission. In addition, the present disclosure also relates to a backplane connector having the wafer.

A backplane connector includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. The conductive terminal includes a connection portion and a contact portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first metal shield has a first extension portion. The second metal shield has a second extension portion. The backplane connector includes an insulating block sleeved on the contact portions of the differential signal terminal and a metal shell sleeved on the insulating block. The metal shell is in contact with the first extension portion and the second extension portion. This arrangement increases the grounding shielding area, reduces crosstalk and improves the quality of signal transmission.

A backplane connector includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. Each conductive terminal includes a connection portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first metal shield and the second metal shield are respectively in contact with two opposite side surfaces of the first ground terminal and the second ground terminal. As a result, a shielding cavity surrounding the connection portions of the differential signal terminals is formed. This arrangement can provide better shielding for the differential signal terminals over the length of the connection portion, reduce crosstalk, and improve the quality of signal transmission.

A backplane connector includes a number of wafers. Each wafer includes a number of conductive terminals, a first metal shield and a second metal shield. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. Each conductive terminal has a contact portion. The first metal shield and the second metal shield respectively include a first extension portion and a second extension portion. The first extension portion and/or the second extension portion include a limiting structure for limiting the contact portion of the first ground terminal and/or the contact portion of the second ground terminal. Besides, in two adjacent wafers, the first extension portion of one wafer contacts the second extension portion of the other wafer through protruding tabs. As a result, the structural reliability of the backplane connector is improved.

A terminal module includes a number of conductive terminals. The conductive terminal includes a contact portion, a transition portion connected with the contact portion and a connection portion electrically connected with the transition portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The differential signal terminals include a first signal terminal and a second signal terminal. The terminal module further includes a fixing block fixed on the transfer portions of the first signal terminal and the second signal terminal. As a result, a distance between the first signal terminal and the second signal terminal can be controlled by the fixing block for improving the quality of data transmission. The present disclosure also discloses a backplane connector having the terminal module.

A terminal module includes a number of conductive terminals and an insulating frame. Each conductive terminal includes a contact portion. The conductive terminals include a first signal terminal and a second signal terminal. The contact portion of the first signal terminal includes a first contact arm, a second contact arm and a first clamping space. The terminal module includes an insulating block sleeved on the first contact arm and the second contact arm, and a metal shield surrounding member sleeved on the insulating block. The insulating block includes a limiting groove and the metal shield surrounding member includes a limiting protrusion protruding into the limiting groove. As a result, it facilitates to assemble the insulating block and the metal shield surrounding member. The present disclosure also relates to a backplane connector having the terminal module.