A press-fit terminal includes a bar part and a deformation part provided at an end portion of the bar part. The deformation part includes a recess, a front boundary portion and a rear boundary portion. The recess is provided between a front end portion of the deformation part and the end portion of the bar part. The front boundary portion defines a boundary between the recess and a surface of the deformation part adjacent to the front end portion of the deformation part. The rear boundary portion defines a boundary between the recess and the surface of the deformation part adjacent to the end portion of the bar part.

An electronic device where molten solder does not come into contact with a sealant so as not to destroy a sealing function. An electronic device is provided with: an insulating base mounted on a printed circuit board; a common planar terminal provided so as to extend from an outer side surface to a bottom surface edge of the insulating base, and cause electrical continuity between the outer side surface and the bottom surface edge of the insulating base; a cover fitted to the insulating base and covering the common planar terminal; and a sealant sealing a gap between the outer side surface of the insulating base and an inner circumferential surface of the cover. A solder pool is formed in a position surrounded by the printed circuit board and the common planar terminal at the bottom surface edge of the insulating base.

A connector assembly can be provided. A receptacle includes terminals that can be positioned in a card slot on a 0.60 mm pitch (or greater). A biasing element can be provided in the card slot to engage a mating paddle card. The receptacle can be configured to allow air to flow from a front face to a rear face, the air passing through a middle wall. A plug assembly can be provided that includes a conductive body and is configured to generate some amount of heat. The body can include a surface that has cooling grooves. The cooling grooves allow air flow over the plug assembly so that the plug assembly can be cooled directly.

A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween. One end of each of the first and second internal electrodes extends, respectively, to a third or fourth surface of the capacitor body. First and second external electrodes respectively include first and second connected portions disposed on the third and fourth surfaces, and first and second band portions respectively extended from the first and second connected portions to portions of a first surface of the capacitor body. A first connection terminal is disposed on the first band portion to provide a first solder accommodating portion, and a second connection terminal is disposed on the second band portion to provide a second solder accommodating portion.

A press-fit terminal includes a bar part and a deformation part provided at an end portion of the bar part. The deformation part includes a recess, a front boundary portion and a rear boundary portion. The recess is provided between a front end portion of the deformation part and the end portion of the bar part. The front boundary portion defines a boundary between the recess and a surface of the deformation part adjacent to the front end portion of the deformation part. The rear boundary portion defines a boundary between the recess and the surface of the deformation part adjacent to the end portion of the bar part.

A connector assembly can be provided. A receptacle includes terminals that can be positioned in a card slot on a 0.60 mm pitch (or greater). A biasing element can be provided in the card slot to engage a mating paddle card. The receptacle can be configured to allow air to flow from a front face to a rear face, the air passing through a middle wall. A plug assembly can be provided that includes a conductive body and is configured to generate some amount of heat. The body can include a surface that has cooling grooves. The cooling grooves allow air flow over the plug assembly so that the plug assembly can be cooled directly.

A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween. One end of each of the first and second internal electrodes extends, respectively, to a third or fourth surface of the capacitor body. First and second external electrodes respectively include first and second connected portions disposed on the third and fourth surfaces, and first and second band portions respectively extended from the first and second connected portions to portions of a first surface of the capacitor body. A first connection terminal is disposed on the first band portion to provide a first solder accommodating portion, and a second connection terminal is disposed on the second band portion to provide a second solder accommodating portion.

A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween. One end of each of the first and second internal electrodes extends, respectively, to a third or fourth surface of the capacitor body. First and second external electrodes respectively include first and second connected portions disposed on the third and fourth surfaces, and first and second band portions respectively extended from the first and second connected portions to portions of a first surface of the capacitor body. A first connection terminal is disposed on the first band portion to provide a first solder accommodating portion, and a second connection terminal is disposed on the second band portion to provide a second solder accommodating portion.

The present invention discloses a connection component, connector, manufacturing method for the same and panel component. The connection component includes a first connector and a second connector electrically connected to the first connector, wherein, between the first connector and the second connector, a connection adhesive is provided, the first connector and/or the second connector both include a base body and multiple connection terminals, wherein the multiple connection terminals are disposed on the base body, a terminal portion of each connection terminal has a protrusion, the protrusion has a saw-tooth shape, and the saw-tooth shape has a regular pattern or a non-regular pattern, Accordingly, the present invention can enhance the reliability of the connection and increase the production yield.

A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween. One end of each of the first and second internal electrodes extends, respectively, to a third or fourth surface of the capacitor body. First and second external electrodes respectively include first and second connected portions disposed on the third and fourth surfaces, and first and second band portions respectively extended from the first and second connected portions to portions of a first surface of the capacitor body. A first connection terminal is disposed on the first band portion to provide a first solder accommodating portion, and a second connection terminal is disposed on the second band portion to provide a second solder accommodating portion.