A method of manufacturing a test socket includes preparing a printed circuit board (PCB) on which a bonding pad is disposed, bonding a conductive wire on the bonding pad, mounting, on an upper surface of the PCB, a space through which the bonding pad is exposed, mounting, on an upper surface of the space, a base through which the bonding pad is exposed, mounting, on an upper surface of the base, a jig which covers the bonding pad, and injecting a liquid silicone rubber into a jig assembly by using the jig assembly as a mold, the jig assembly including the PCB, the space, the base, and the jig.

The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. A brain stimulator, preferably a deep brain stimulator, stimulates the brain in response to neural recordings in a closed feedback loop. The device is advantageous in providing neuromodulation therapies for neurological disorders such as chronic pain, post traumatic stress disorder (PTSD), major depression, or similar disorders. The invention and components thereof are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.

A laterally placed capacitor package assembly and an assembly method thereof are provided. The laterally placed capacitor package assembly includes a wound capacitor package structure and a capacitor supporting structure. The wound capacitor package structure includes a wound assembly, a conductive assembly and a package assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The capacitor supporting structure includes a supporting portion configured to support the wound capacitor package structure and a plurality of positioning portions extending outward from the supporting portion. When the laterally placed capacitor package assembly is configured to be laterally disposed on a circuit substrate, a first exposed portion of the first conductive pin and a second exposed portion of the second conductive pin can be laterally and electrically connected to the circuit substrate without bending.

A module includes: a substrate having a first surface; a first component mounted on the first surface; a first protruding electrode disposed on the first surface; a first resin film covering the first component along a shape of the first component, covering at least a part of the first surface, and partially covering the first protruding electrode; and a first shield film formed to overlap with the first resin film. The first protruding electrode includes a first sharpened portion, the first protruding electrode is exposed from the first resin film in at least a part of the first sharpened portion, and the first shield film is electrically connected to the first protruding electrode by covering a portion where the first protruding electrode is exposed from the first resin film.

Methods of connecting wires (126) to feedthrough pins (104) and apparatus including wires connected to feedthrough pins.

A semiconductor package includes a package substrate having first and second substrate pads thereon, a first semiconductor chip on the package substrate and including a first chip pad, a second semiconductor chip on the first semiconductor chip and including a second chip pad on a lower surface of the second semiconductor chip, a first bonding wire contacting the first substrate pad and the first chip pad, and a second bonding wire contacting the second substrate pad and the second chip pad. An uppermost portion of the second bonding wire is lower than or coplanar with the lower surface of the second semiconductor chip.

In a general aspect, an electronic device assembly includes a substrate arranged in a plane. The substrate has a first side and a second side, the second side being opposite the first side. The assembly also includes a plurality of semiconductor die disposed on the first side of the substrate and at least one signal pin. The at least one signal pin includes a proximal end portion coupled with the first side of the substrate, a distal end portion, and a medial portion disposed between the proximal end portion and the distal end portion. The medial portion is pre-molded in a molding compound, the proximal end portion and the distal end portion exclude the molding compound. The at least one signal pin is arranged along a longitudinal axis that is orthogonal to the plane of the substrate.