The present invention provides a printed substrate having a novel structure in which substrate terminals can be fixed to the printed substrate without needing a base, and the substrate terminals can be press-fitted into through-holes without applying pressing force to printed wiring and a plating layer in the through-holes, and also provides a printed substrate with terminals that uses this printed substrate. A printed substrate includes through-holes into which the first end portions of substrate terminals are to be inserted. The through-holes each include press-fitting regions into which the first end portion of a substrate terminal is to be press-fitted, and conduction regions arranged so as to oppose the outer circumferential surfaces of the first end portion of the substrate terminal via gaps in directions perpendicular to the axis. Printed wiring is connected to the conduction regions, and a plating layer is adhered to the conduction regions.

A substrate package includes a woven fabric having electrically non-conductive strands woven between electrically conductive strands including wire strands, co-axial strands, and/or an inductor pattern of strands. The package may be formed by an inexpensive and high throughput process that first weaves the non-conductive strands (e.g., glass) between the conductive strands to form a circuit board pattern of conductive strands in a woven fabric. Next, the woven fabric is impregnated with a resin material to form an impregnated fabric, which is then cured to form a cured fabric. The upper and lower surfaces of the cured fabric are subsequently planarized. Planarizing segments and exposes ends of the wire, co-axial, and inductor pattern strands. Since the conductive strands were formed integrally within the planarized woven fabric, the substrate has a high mechanical stability and provides conductor strand based electrical components built in situ in the substrate package.