An electronic device may comprise a printed circuit board (PCB) and a power source and processing circuitry mounted to the PCB. The PCB comprises one or more power planes and a plurality of power vias electrically connected to the power planes. The power sources are electrically connected to the power planes. The processing circuitry is electrically connected to the plurality of power vias through a plurality of interconnects. Respective diameters of the plurality of power vias vary based on location.

A power package includes at least one power substrate having at least one power trace, at least one power device on the at least one power trace, signal terminals, and at least one signal connection assembly. The at least one signal connection assembly includes at least one of the following: at least one signal trace that is thinner than the at least one power trace; at least one embedded routing layer within the at least one power substrate; and/or at least one routing layer on the at least one power substrate.