A backplane connector includes a number of wafers. Each wafer includes a number of conductive terminals, a first metal shield and a second metal shield. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. Each conductive terminal has a contact portion. The first metal shield and the second metal shield respectively include a first extension portion and a second extension portion. The first extension portion and/or the second extension portion include a limiting structure for limiting the contact portion of the first ground terminal and/or the contact portion of the second ground terminal. Besides, in two adjacent wafers, the first extension portion of one wafer contacts the second extension portion of the other wafer through protruding tabs. As a result, the structural reliability of the backplane connector is improved.

A backplane connector includes a number of wafers and a spacer for assembling the wafers together. Each wafer includes an insulating frame and a number of conductive terminals fixed to the insulating frame. The insulating bracket includes a first protrusion and a second protrusion. The spacer includes a first body portion and a second body portion. The first body portion includes a first clamping slot for clamping the first protrusion. The second body portion includes a second clamping slot for clamping the second protrusion. The present disclosure increases the ability of the spacer to resist external forces and improves the structural stability of the backplane connector.

A backplane connector includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. The first metal shield and the second metal shield respectively include a first extension portion and a second extension portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first extension portion and the second extension portion in contact with the first ground terminal and the second ground terminal. As a result, a shielding space to enclose contact portions of the differential signal terminals is formed. This arrangement can provide better shielding for the differential signal terminals, reduce crosstalk, and improve the quality of signal transmission.

A circuit board includes two first insertion holes, a second insertion hole located on one side of the two first insertion holes, a third insertion hole located on the other side of the two first insertion holes, and a number of grounding points. The grounding points are distributed on a periphery of the first insertion holes. The grounding points, the second insertion hole and the third insertion hole together form a shielding layer surrounding the periphery of the first insertion holes. The present disclosure also relates to a backplane connector assembly having a backplane connector and the circuit board. Compared with the prior art, the circuit board disclosed in the present disclosure improves the shielding effect of differential signal terminals, reduces crosstalk and improves the quality of signal transmission.

A backplane connector includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. The conductive terminal includes a connection portion and a contact portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first metal shield has a first extension portion. The second metal shield has a second extension portion. The backplane connector includes an insulating block sleeved on the contact portions of the differential signal terminal and a metal shell sleeved on the insulating block. The metal shell is in contact with the first extension portion and the second extension portion. This arrangement increases the grounding shielding area, reduces crosstalk and improves the quality of signal transmission.

A backplane connector assembly includes a first backplane connector and a second backplane connector. The first backplane connector includes a number of first conductive terminals, a first insulating frame, a first metal shield and a second metal shield. The first metal shield includes a first elastic piece, and the second metal shield includes a second elastic piece. The second backplane connector includes a number of second differential signal terminals, an insulating block sleeved on the second differential signal terminals, and a metal shell sleeved on the insulating block. When the first backplane connector is mated with the second backplane connector, the first elastic piece and the second elastic piece are in contact with the metal shell to increase the grounding shielding area, reduce crosstalk and improve the quality of signal transmission.

A backplane connector includes a wafer. The wafer includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield located on opposite sides of the insulating frame. The insulating frame includes a number of first posts and a number of second posts. The first metal shield has a number of first mounting holes to receive the first posts. The second metal shield has a number of second mounting holes to receive the second posts. With this arrangement, the first metal shield and the second metal shield can be easily positioned with the insulating frame.

A backplane connector includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. Each conductive terminal includes a connection portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first metal shield and the second metal shield are respectively in contact with two opposite side surfaces of the first ground terminal and the second ground terminal. As a result, a shielding cavity surrounding the connection portions of the differential signal terminals is formed. This arrangement can provide better shielding for the differential signal terminals over the length of the connection portion, reduce crosstalk, and improve the quality of signal transmission.

A power semiconductor module has a substrate, load and auxiliary connector elements, and a plastic body, which preferably is a housing or a housing frame and which has a channel. The channel being for the arrangement of a compensating portion of a press-fit contact element. The press-fit contact element has a press-fit portion, a compensating portion and a foot portion, the compensating portion being elastic in a longitudinal direction of the press-fit contact element and having at least two O-shaped sub-portions arranged in succession in the longitudinal direction and having a constriction arranged between two sub-portions.

An electrical junction box includes a conductive input busbar, a conductive output busbar electrically connectable to the input busbar, a semiconductor relay electrically connected to the input busbar and the output busbar and configured to switch a connected state and a disconnected state of the input busbar and the output busbar, a substrate having mounted thereon a control circuit configured to output a control signal for controlling the semiconductor relay, and a control terminal electrically connecting the control circuit and the semiconductor relay to each other to output the control signal to the semiconductor relay. The semiconductor relay is mounted on at least one of the input busbar and the output busbar. The input busbar, the output busbar, and the semiconductor relay are disposed away from the substrate.