According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.

An electronic device for a motor vehicle includes a metal tubular casing extending longitudinally and opening at its two ends, and a wall having a curved profile with cooling fins on its outer surface. The electronic device includes an assembly of printed circuit boards comprising a first plurality of printed circuit boards that include heat-generating electronic components. The printed circuit boards of the assembly are connected together by flexible conductive elements. The device further comprises a first heat sink arranged inside the tubular casing comprising a curved wall generally extending parallel to the curved wall of the tubular casing. The first plurality of printed circuit boards is interposed between the curved inner surface of the wall of the casing and the curved wall of the first heat sink so heat is dissipated through the first heat sink and through the curved wall equipped with cooling fins of the tubular casing.

A signal transmission structure includes a circuit board, a chip, and a cable assembly. The chip is assembled on one side of the circuit board, and the cable assembly is assembled on the other side of the circuit board. The cable assembly includes a cable, and the circuit board includes a plurality of conductive holes. The chip is electrically connected to the cable of the cable assembly using the conductive hole to transmit a signal of the chip using the cable.

What is described is a mounting aid for mounting electrical components, in particular electrolytic capacitors or chokes, on a printed circuit board, said mounting aid comprising a body, which has compartments for receiving the electrical components, wherein the compartments have a base with openings for the insertion of connection wires of the electrical components, and metal parts fastened to the body, which metal parts each form at least one contact pin on the underside of the body and each from a busbar for connection to electrical components in a plurality of compartments of the body.

The present disclosure relates to a printed circuit board connected to a battery, and more particularly, to a printed circuit board having an improved structure connected to an electrode led out from a battery.

An electronic device is provided and includes a bearing member defined with a bearing surface, and at least one electronic element disposed on the bearing member, where the electronic element is disposed on the bearing member in a manner that can be inclined relative to the bearing surface, such that when the electronic element is a light-emitting element, the light presented by the electronic element can effectively illuminate a predetermined area.

A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.

In one embodiment, the apparatus comprises: a substrate having a first side and a second side, the second side being on an opposite side of the substrate from the first side, where the substrate has a first location on the first side at which an semiconductor package is to be coupled; and a cable coupled to the substrate on the second side of the substrate at a second location on the second side, the second location being at least partially below the first location.

A touch screen panel includes: a touch sensor film including: at least one corner formed in a curved line; and a through part; and a flexible printed circuit board including one end connected to a wiring extending from the touch sensor film; the flexible printed circuit board disposed through the through part, wherein the through part is disposed adjacent to the corner of the touch sensor film formed in the curved line, and wherein the through part includes a curved line corresponding to the corner of the touch sensor film formed in the curved line.

A flexible printed circuit board installed on a substrate in a display device is provided.