A circuit board includes: a substrate having a main surface; a first terminal and a second terminal provided on the main surface of the substrate; and a wall of an insulating material, the wall provided on the main surface of the substrate, in which the wall has at least one groove portion passing through an outer peripheral surface from an inner peripheral surface, the first and second terminals are disposed in a cavity surrounded by the wall, and when a rectangular reference shape having a minimum area circumscribing the inner peripheral surface of the wall is set as viewed from a first direction orthogonal to the main surface of the substrate, at least one terminal of the first and second terminals has a portion disposed on an outer peripheral side from the reference shape via the groove portion.

The present disclosure describes a non-welded leaf spring battery cell connector which allows for unrestricted outgassing during Lithium-Ion thermal runaway. The connector also has a low-resistance electrical connection surface for applications with rough, uneven contact surfaces such as those on refurbished Lithium-Ion battery cells. The connector is compatible with both protected and unprotected Lithium-Ion cells, as it allows for up to about 5 mm of vertical travel to support varying battery cell lengths caused by battery protection circuits. The leaf spring connector for Lithium-Ion battery cells is made of a conductive sheet of metal, cut and folded into a leaf-spring connector for a removable, non-welded battery cell. The leaf spring connector has one or more areas of material removed, as to not block the flow of caustic gasses during emergency outgassing.

A semiconductor device according to an embodiment includes an insulating board having a circuit pattern, a semiconductor chip fixed on the insulating board and electrically-connected with the circuit pattern, and a power terminal that includes metal of a same type as the circuit pattern, and is electrically-connected with the circuit pattern, in which the power terminal includes a bond portion to be bonded with the circuit pattern, the bond portion having a plate shape, a penetrating portion penetrating through the bond portion in a thickness direction of the bond portion, and an extending portion that extends upward by bending from one end portion of the bond portion, and is configured to be able to connect the circuit pattern and an external device, and the bond portion and the circuit pattern are bonded by a bonding material containing particles of metal of a same type as the power terminal and the circuit pattern.

A circuit substrate includes a base material, a first electrode, and a second electrode. The base material has an upper side and a lower side opposite to each other in a length direction. The first electrode extends and is configured on the base material along the length direction. The second electrode is configured beside the first electrode and includes a first portion and a second portion connected to each other. The first portion is configured on the base material along the length direction. The second portion is configured on the base material along a width direction and is located between the upper side and the first electrode. A cross-sectional width of the first portion becomes larger from the lower side to the upper side.

A circuit board that includes a ceramic substrate; a protruding electrode on a surface of the ceramic substrate; and a protective layer containing a metal oxide and covering at least a portion of a lateral surface of the protruding electrode and extending continuously across a boundary between the portion of the lateral surface of the protruding electrode and the surface of the ceramic substrate.