A semiconductor device according to an embodiment includes an insulating board having a circuit pattern, a semiconductor chip fixed on the insulating board and electrically-connected with the circuit pattern, and a power terminal that includes metal of a same type as the circuit pattern, and is electrically-connected with the circuit pattern, in which the power terminal includes a bond portion to be bonded with the circuit pattern, the bond portion having a plate shape, a penetrating portion penetrating through the bond portion in a thickness direction of the bond portion, and an extending portion that extends upward by bending from one end portion of the bond portion, and is configured to be able to connect the circuit pattern and an external device, and the bond portion and the circuit pattern are bonded by a bonding material containing particles of metal of a same type as the power terminal and the circuit pattern.

An optical component driving mechanism is provided. The optical component driving mechanism includes a first movable portion, a fixed portion, a first circuit member, and a first reinforcing component. The first movable portion is connected to the first optical component. The first optical component has a first optical axis. The first movable portion is movable relative to the fixed portion. The first circuit member is disposed on the fixed portion, and the first circuit member is configured to transmit electrical signals. The first reinforcing component is disposed on the first circuit member.

An optical component driving mechanism is provided. The optical component driving mechanism includes a movable portion, a fixed portion, a driving assembly, and a first circuit member. The movable portion is connected to an optical component. The movable portion includes a side portion. The optical component has an optical axis. The movable portion is movable relative to the fixed portion. The driving assembly includes a coil and a magnetically permeable component. The driving assembly is configured to drive the movable portion to move relative to the fixed portion. The first circuit member is configured to transmit electrical signals. The first circuit member includes a first portion. The first portion is disposed between the coil and the magnetically permeable component. The coil, the magnetically permeable component, and the first portion of the first circuit member are disposed on the side portion of the movable portion.