A printed circuit board includes first and second insulating layers, a wiring trace, a metal thin film, and a connection terminal. The wiring trace is formed on the first insulating layer. The metal thin film is formed on the wiring trace, and has a thickness larger than 0 nm and not more than 150 nm. The second insulating layer is formed on the first insulating layer to cover the metal thin film. The connection terminal is formed on the first insulating layer to be electrically connected to the wiring trace and exposed from the second insulating layer.

The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. A brain stimulator, preferably a deep brain stimulator, stimulates the brain in response to neural recordings in a closed feedback loop. The device is advantageous in providing neuromodulation therapies for neurological disorders such as chronic pain, post traumatic stress disorder (PTSD), major depression, or similar disorders. The invention and components thereof are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.

An electronic device where molten solder does not come into contact with a sealant so as not to destroy a sealing function. An electronic device is provided with: an insulating base mounted on a printed circuit board; a common planar terminal provided so as to extend from an outer side surface to a bottom surface edge of the insulating base, and cause electrical continuity between the outer side surface and the bottom surface edge of the insulating base; a cover fitted to the insulating base and covering the common planar terminal; and a sealant sealing a gap between the outer side surface of the insulating base and an inner circumferential surface of the cover. A solder pool is formed in a position surrounded by the printed circuit board and the common planar terminal at the bottom surface edge of the insulating base.

The invention is related to an electrical circuitry assembly as well as a method for manufacturing such an electrical circuitry assembly, wherein the assembly basically but not exclusively comprising of an electrically conductive metal plate and a circuit including a conductive layer and wherein both the metal plate and the circuit shall be electrically connected to each other.

Disclosed is an attenuation reduction structure for high-frequency connection pads of a circuit board with an insertion component. The circuit board includes at least one pair of differential mode signal lines formed thereon. A substrate has upper and lower surfaces respectively provided with at least one pair of upper connection pads and lower connection pads. A first metal layer is formed on the lower surface of the substrate. The first metal layer includes an attenuation reduction grounding pattern structure. The attenuation reduction grounding pattern structure includes a hollow area and at least one protruded portion. The protruded portion extends from the first metal layer in a direction toward the lower connection pads.

The present disclosure provides an electronic device. The electronic device includes a substrate, an electronic component, a circuit structure, and a shielding layer. The electronic component is disposed under the substrate. The circuit structure is disposed under the substrate. The shielding layer is disposed under the substrate and covers the electronic component and connected to the circuit structure. The circuit structure and the shielding layer are collectively configured to block the electronic component from electromagnetic interference.

A module includes a substrate having a first surface, components as one or more components mounted on the first surface, a resin film covering the one or more components along a shape of the one or more components and covering part of the first surface, a first shield film formed to overlap the resin film, and a first sealing resin as a sealing resin disposed to cover the first surface, the one or more components, and the first shield film. A stack including the resin film and the first shield film has a first opening. A first columnar conductor is disposed to be electrically connected to the first surface through the first sealing resin and the first opening. The first shield film is electrically connected to the first columnar conductor in the first opening.

A power semiconductor device includes: a circuit body having a pair of conductor parts and a power semiconductor element sandwiched between the pair of conductor parts; a substrate in which a through hole is formed; and a sealing material that seals at least a part of each of the circuit body and the substrate, in which the circuit body is inserted into the through hole and has first and second exposed surfaces exposed from the sealing material, and the substrate has, in the through hole, a first protrusion and a second protrusion that protrude toward a center of the through hole and are connected to the circuit body, the first protrusion and the second protrusion being formed at positions opposed to each other in the through hole, and at least one of the first protrusion and the second protrusion being a terminal that transmits power to the power semiconductor element.

Electronic assemblies and methods of joining components are described. The electronic assemblies may include a bottom component with one or more pins mounted over a top component with one or more recesses, where the pins of the bottom component align with the recesses of the top component. Further, the recesses and pins may be structured so that the shape of the pins matches the shape of the recesses, and that the recesses at least partially surround the pins.