An altitude increasing connector and the method for manufacturing the same for an electrical connection of a sensor element and a circuit substrate inside a portable electronic device, such that the sensor element is altitude increased, thereby an appropriate disposition altitude of the sensor element is adjusted, in order to ensure normal function of the sensor element, so that the yield of the portable electronic device is increased. The altitude increasing connector has a plurality of conductive terminals, each of which has a first welding pad for welding the sensor element and a second welding pad for welding the circuit substrate, wherein a distance between welding surfaces of both the first, second welding pads of each conductive terminal is fixed, such that a relative distance between electrical joints of both the sensor element and the circuit substrate is fixed.

An electronic device for a vehicle includes a metal tubular casing extending longitudinally and opening at its two ends, and a wall having a curved profile with cooling fins on its outer surface. The electronic device includes an assembly of printed circuit boards comprising a first plurality of printed circuit boards that include heat-generating electronic components. The printed circuit boards of the assembly are connected together by flexible conductive elements. The device further comprises a first heat sink arranged inside the tubular casing comprising a curved wall generally extending parallel to the curved wall of the tubular casing. The first plurality of printed circuit boards is interposed between the curved inner surface of the wall of the casing and the curved wall of the first heat sink so heat is dissipated through the first heat sink and through the curved wall equipped with cooling fins of the tubular casing.

A plug contact for electrically contacting a circuit board by inserting the plug contact into a via hole in the circuit board, the plug contact having two flat contact arms that are resilient relative to each other, and a connecting region, from which the two contact arms extend in the plug-in direction of the plug contact, the plug contact being punched as a single piece from a flat metallic material. In the connection region, adjacent to the two contact arms, a recess is formed in the plug contact, the distance between the two contact arms increases from the recess towards the free ends of the contact arms, the two contact arms being spread apart relative to each other and the two contact arms together having a width which is the same as or only slightly smaller than the diameter of the corresponding via hole in the circuit board.

An electronic device for a motor vehicle includes a metal tubular casing extending longitudinally and opening at its two ends, and a wall having a curved profile with cooling fins on its outer surface. The electronic device includes an assembly of printed circuit boards comprising a first plurality of printed circuit boards that include heat-generating electronic components. The printed circuit boards of the assembly are connected together by flexible conductive elements. The device further comprises a first heat sink arranged inside the tubular casing comprising a curved wall generally extending parallel to the curved wall of the tubular casing. The first plurality of printed circuit boards is interposed between the curved inner surface of the wall of the casing and the curved wall of the first heat sink so heat is dissipated through the first heat sink and through the curved wall equipped with cooling fins of the tubular casing.

An altitude increasing connector and the method for manufacturing the same for an electrical connection of a sensor element and a circuit substrate inside a portable electronic device, such that the sensor element is altitude increased, thereby an appropriate disposition altitude of the sensor element is adjusted, in order to ensure normal function of the sensor element, so that the yield of the portable electronic device is increased. The altitude increasing connector has a plurality of conductive terminals, each of which has a first welding pad for welding the sensor element and a second welding pad for welding the circuit substrate, wherein a distance between welding surfaces of both the first, second welding pads of each conductive terminal is fixed, such that a relative distance between electrical joints of both the sensor element and the circuit substrate is fixed.

Provided is a circuit assembly that does not require e.g. bending of a terminal of an electronic component. A circuit assembly includes an electronic component that is to be mounted is connected to a conductive member through a first opening in a state in which its main body is disposed on one side of a substrate covering at least a part of the first opening formed in the substrate, and a first terminal is connected to a conductive pattern (a land) of the substrate, and a second terminal is connected to the conductive member through a second opening formed in the substrate.

Provided is a circuit assembly that does not require e.g. bending of a terminal of an electronic component. A circuit assembly includes an electronic component that is to be mounted is connected to a conductive member through a first opening in a state in which its main body is disposed on one side of a substrate covering at least a part of the first opening formed in the substrate, and a first terminal is connected to a conductive pattern (a land) of the substrate, and a second terminal is connected to the conductive member through a second opening formed in the substrate.

A semiconductor package comprising a substrate, at least one semiconductor die disposed on the substrate, at least one electrical connector connected with the semiconductor die, an encapsulant covering the substrate, the at least one semiconductor die, and at least partially the electrical connector, the encapsulant comprising a recess formed into a main surface of the encapsulant, wherein the at least one electrical connector is exposed within the recess.

A system board includes a module board that connects to the system board with an interposer having compressible connectors. The module board can further be covered by a shield that has a metal alloy having an element to provide good electrical conductivity and an element to provide structural integrity and heat transfer. The module board can further include gaskets to interconnect the shield to a ground plane of the module board. the interposer board can further include an extra column of ground connections to reduce signaling noise between the interposer board and the system board.

An electronic module, comprising: a first electronic device, a first circuit board disposed over the first top surface, and a second circuit board disposed under the bottom surface of the body of the first electronic device, wherein a plurality of conductors are disposed over a first lateral surface for electrically connecting the first circuit board and the second circuit board, wherein a plurality of electrodes of the electronic module are disposed on a bottom surface of the second circuit board.