An electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed in a width direction. The capacitor body has first to sixth surfaces, the first and second internal electrodes being exposed through the third and fourth surfaces, respectively. First and second external electrodes are disposed on the third and fourth surfaces and extend to portions of the first surface. A first connection terminal and a second connection terminal are disposed to be respectively connected to be connected to the first and second external electrodes, and each has a shape including at least one indentation in a rectangular outline within which the respective connection terminal is inscribed.

In an exemplary embodiment, an electronic component with metal terminals includes a multilayer ceramic capacitor 10 having a pair of external electrodes 12, and a pair of metal terminals 20 each having, integrally, a plate-like supporting part 21 and a plate-like connecting part 22, and is constituted so that the supporting part 21 of each of the metal terminals 20 is joined to each of the external electrodes 12 in a manner allowing the connecting parts 22 to face each other, wherein two projecting parts 23 are provided on the connecting face of the connecting part 22 of each of the metal terminals 20.

Methods of and devices for using additive processes (e.g., 3D printing) to embed components inside an object are disclosed. In some embodiments, the components include active components, such as computer chips. In other embodiments, the components include passive components, such as inductor, resistor, and capacitors. The methods and devices disclosed herein can be used for rapid prototyping and fast manufacturing.

Implementations of semiconductor packages may include: one or more die electrically coupled to a lead frame. The lead frame may be included within a housing. The semiconductor package may also include a set of signal leads extending from the housing, a set of power leads extending from the housing, and a plurality of press fit pins each fixedly coupled to the set of signal leads and the set of power leads. The set of signal leads and the set of power leads may be configured to couple with a substrate.

A multilayer electronic component includes first and second frame terminals, and first and second electronic components. The first frame terminal includes a first side frame and a first bottom frame extended from a lower end of the first side frame. The second frame terminal includes a second side frame facing the first side frame and a second bottom frame extended from a lower end of the second side frame. The first electronic component is disposed between the first and second side frames, and the second electronic component is stacked on the first electronic component and disposed between the first and second side frames. Conductive adhesives are provided between the first and second side frames and the first and second electronic components, but a conductive adhesive is not formed between the first and second side frames and portions of the first electronic component close to a mounting surface.

The invention relates to an electronic component. The electronic component 2 has an electrical assembly 3 having two electrical connections 4, 5 that are each formed on opposing faces of the assembly. For each connection 4, 5, the component has at least one electrically conductive connection element 9, 10 having a mounting foot 14, 15 for connection to a circuit carrier 22. According to the invention, the connection element 8, 9 has at least two metal layers 10, 11, 12, 13 at least on one section, wherein the metal layers are each formed from different metals and integrally connected to one another. Preferably, one metal layer 12, 13 from the metal layers has greater thermal conductivity than the other metal layer 10, 11.

In an exemplary embodiment, an electronic component with metal terminals includes a multilayer ceramic capacitor 10 having a pair of external electrodes 12, and a pair of metal terminals 20 each having, integrally, a plate-like supporting part 21 and a plate-like connecting part 22, and is constituted so that the supporting part 21 of each of the metal terminals 20 is joined to each of the external electrodes 12 in a manner allowing the connecting parts 22 to face each other, wherein two projecting parts .sup.23 are provided on the connecting face of the connecting part 22 of each of the metal terminals 20.

Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

An electronic component includes: a multilayer capacitor having both ends on which external electrodes are disposed; connection terminals including vertical portions, lower horizontal portions having cut portions, respectively, and upper horizontal portions, respectively, lower surfaces of the upper horizontal portions being connected to the external electrodes; and a tantalum capacitor disposed on upper surfaces of the upper horizontal portions to be electrically connected thereto.