Patent classifications
H01B3/423
SHIELDED BUSBAR
A shielded busbar has a casing having a duct housing, a conductor pack including three or more conductors arranged side by side, wherein each conductor extends along a longitudinal axis and has a rectangular cross-section. Each conductor has two primary lateral surfaces, which are opposite to each other, and two secondary lateral surfaces, which are opposite to each other, wherein each pair of adjacent conductors of the conductor pack are arranged side by side along respective primary lateral surfaces. The shielded busbar also includes two or more shielding elements extending along the longitudinal axis and made of magnetically shielding material. Each one of the two or more shielding elements has a primary plate that entirely overlaps a primary lateral surface of one or two of the three or more conductors, and wherein not more than one shielding element of the two or more shielding elements has a C-shaped cross-section.
Wire harness
A wire harness that includes an electric wire provided with a conductor and an insulator that coats an outer periphery of the conductor, a terminal connected to the conductor at a terminal end of the electric wire, and a molded resin portion that covers an outer periphery of the insulator at the terminal end of the electric wire and an outer periphery of an end portion on the electric wire side of the terminal. A storage modulus E of the insulator that is measured using a dynamic viscoelasticity measurement device in a tensed mode at a temperature increase rate of 5 C./min and a frequency of 10. Hz is 100 MPa or less at 25 C. and 1 MPa or more at 250 C., and a starting temperature (T) of a rubbery plateau region (G) is 150 C. or less.
METHOD FOR PRODUCING FLEXIBLE CONDUCTIVE SUBSTRATE WITH HIGH TRANSMITTANCE AND PRODUCT THEREOF
The method for producing a transparent conductive substrate includes forming metal meshes on a flexible non-conductive substrate with high transmittance. It's unnecessary to use palladium as a catalyst in this method. The metal meshes are in the form of nano/micro wires and the conductive substrate has high transmittance of 80%-90% at visible light wavelengths of 390-750 nm.
WIRE HARNESS
A wire harness that includes an electric wire provided with a conductor and an insulator that coats an outer periphery of the conductor, a terminal connected to the conductor at a terminal end of the electric wire, and a molded resin portion that covers an outer periphery of the insulator at the terminal end of the electric wire and an outer periphery of an end portion on the electric wire side of the terminal. A storage modulus E of the insulator that is measured using a dynamic viscoelasticity measurement device in a tensed mode at a temperature increase rate of 5 C./min and a frequency of 10. Hz is 100 MPa or less at 25 C. and 1 MPa or more at 250 C., and a starting temperature (T) of a rubbery plateau region (G) is 150 C. or less.
Polyester for profile extrusion and/or pipe extrusion
Thermoplastic molding compositions containing A) from 29 to 99.99% by weight of a polyester, B) from 0.01 to 3.0% by weight of an alkali metal salt of nitrous acid or of phosphoric acid or of carbonic acid, or a mixture of these, based on 100% by weight of A) and B), and C) from 0 to 70% by weight of further additives, where the sum of the % by weight values for A) to C) is 100%. The compositions are used in the production of cable sheathing or optical waveguide sheathing via blowmolding, profile extrusion, and/or tube extrusion.
Polymer composition for an electric circuit protection device
A polymer composition for use in an electric circuit protection device is provided. The polymer composition comprises a polymer matrix that includes a thermotropic liquid crystalline polymer. The polymer composition exhibits an in-plane thermal conductivity of about 3.5 W/m-K or more as determined in accordance with ASTM E1461-13 and a melt viscosity of from about 1 to about 100 Pa-s as determined in accordance with ISO Test No. 11443:2014 at a temperature 15? C. higher than the melting temperature.
Polymer Composition for Use in an Electronic Device
A polymer composition is disclosed that comprises carbon particles, a dielectric filler, and a polymer matrix containing at least one thermotropic liquid crystalline polymer is provided. The polymer composition exhibits a dissipation factor of about 0.02 or less as determined at a frequency of 5 GHz, a dielectric constant of about 8.5 or more as determined at a frequency of 5 GHz.
POLYETHERIMIDE COMPOSITIONS, METHOD OF MANUFACTURE, AND ARTICLES MADE THEREFROM
A thermoplastic composition includes a polyetherimide, a thermoplastic polyester elastomer comprising a hard segment comprising a polyester block, and a soft segment comprising a polyether block or a polyester block, and optionally, a polyester, one or more flame retardants, and one or more additives. Articles including the composition can include an extruded part, an injection molded part, or a hot-compressed part. Also described herein is an electrical wire including a conductor wire and a covering disposed over the conductor wire, wherein the covering includes the thermoplastic composition. Articles including the electrical wire are also discussed.
Solid Insulation Material
The present disclosure relates to insulation. Teachings thereof may be embodied in a solid insulation material, especially in tape form, the use thereof in a vacuum impregnation process and to an insulation system produced therewith, and also an electrical machine comprising the insulation system, especially for the medium- and high-voltage sector, namely for medium- and high-voltage machines, especially rotating electrical machines in the medium- and high-voltage sector, and to semifinished products for electrical switchgear. For example a solid insulation material with an anhydride-free impregnating agent may include: a carrier; a barrier material; a curing catalyst; and a tape adhesive. The curing catalyst and the tape adhesive are inert toward one another but react under the conditions of a vacuum impregnation process if combined with an anhydride-free impregnating agent having gelation times of 1 h to 15 h at impregnation temperature. The tape adhesive is free of oxirane groups and includes at least two free hydroxyl groups.
Multilayer insulated wire, coil, and electrical/electronic equipment
A multilayer insulated wire having a polyester-based resin layer formed of a polyester-based resin containing at least a trihydric or higher hydric alcohol constituent on a conductor, and a PEEK resin layer formed of polyether ether ketone or modified polyether ether ketone, directly or by interposing an intermediate layer, on the polyester-based resin layer; a coil formed by winding processing the insulated wire, and electronic/electrical equipment having the coil.