Patent classifications
H01F1/0315
Stylus pen
An exemplary embodiment of the present invention provides a stylus pen including: a body; a conductive tip configured to be exposed from an inside of the body to an outside thereof; and a resonance circuit connected to the conductive tip to resonate an electrical signal transferred from the conductive tip. An inductor unit of the resonance circuit includes a ferrite core and a coil wound in multiple layers over at least a portion of the ferrite core. The ferrite core includes nickel, and the coil can be formed by a litz wire with adjacent winding layers that are wound to be inclined in a zigzag form.
Polymer-bonded position sensor for electric machine
The rotor of a rotor assembly for an electric machine includes first magnetic structures utilized for torque production in the electric machine. Second magnetic structures including second magnetic poles not utilized for torque production in the electric machine are polymer-bonded to at least one of the rotor and the rotor shaft.
MAGNETIC BEADS, METHOD OF MAKING AND METHOD OF USE THEREOF
Magnetic beads comprise a plurality of magnetic nanoparticles, dispersed in a non-magnetic matrix. The magnetic beads have an average particle size of 0.1 μm to 100 μm. The matrix may comprise an inorganic metal oxide or a polymer. The magnetic beads have a specific surface area of at least 40 m.sup.2/g.
Method for transient liquid-phase bonding between metal materials using a magnetic force
Disclosed is a method for transient liquid-phase bonding between metal materials using a magnetic force. In particular, in the method, a magnetic force is applied to a transient liquid-phase bonding process, thereby shortening a transient liquid-phase bonding time between the metal materials, and obtaining high bonding strength. To this end, an attractive magnetic force is applied to a ferromagnetic base while a repulsive magnetic force is applied to a diamagnetic base, thereby to accelerate diffusion. This may reduce a bonding time during a transient liquid-phase bonding process between two bases and suppress formation of Kirkendall voids and voids and suppress a layered structure of an intermetallic compound, thereby to increase a bonding strength.
STYLUS PEN
An exemplary embodiment of the present invention provides a stylus pen including: a body; a conductive tip configured to be exposed from an inside of the body to an outside thereof; and a resonance circuit connected to the conductive tip to resonate an electrical signal transferred from the conductive tip. An inductor unit of the resonance circuit includes a ferrite core and a coil wound in multiple layers over at least a portion of the ferrite core. The ferrite core includes nickel, and the coil can be formed by a litz wire with adjacent winding layers that are wound to be inclined in a zigzag form.
FERRITE SINTERED MAGNET AND ROTARY ELECTRICAL MACHINE COMPRISING THE SAME
A ferrite sintered magnet 100 comprises M-type ferrite crystal grains 4 and multiple-crystal grain boundaries 6b surrounded by three or more of the M-type ferrite crystal grains 4. The ferrite sintered magnet 100 contains at least Fe, Ca, B, and Si, and contains 0.005 to 0.9 mass % of B in terms of B.sub.2O.sub.3. The multiple-crystal grain boundaries 6b contain Si and Ca, and in a case where the molar ratio of Ca to Si in the multiple-crystal grain boundaries 6b is represented by (Ca/Si).sub.G, the following formula is satisfied.
0.1<(Ca/Si).sub.G<0.9
Stylus pen
An exemplary embodiment of the present invention provides a stylus pen including: a body; a conductive tip configured to be exposed from an inside of the body to an outside thereof; and a resonance circuit connected to the conductive tip to resonate an electrical signal transferred from the conductive tip. An inductor unit of the resonance circuit includes a ferrite core and a coil wound in multiple layers over at least a portion of the ferrite core. The ferrite core includes nickel, and the coil can be formed by a litz wire with adjacent winding layers that are wound to be inclined in a zigzag form.
METHOD FOR TRANSIENT LIQUID-PHASE BONDING BETWEEN METAL MATERIALS USING A MAGNETIC FORCE
Disclosed is a method for transient liquid-phase bonding between metal materials using a magnetic force. In particular, in the method, a magnetic force is applied to a transient liquid-phase bonding process, thereby shortening a transient liquid-phase bonding time between the metal materials, and obtaining high bonding strength. To this end, an attractive magnetic force is applied to a ferromagnetic base while a repulsive magnetic force is applied to a diamagnetic base, thereby to accelerate diffusion. This may reduce a bonding time during a transient liquid-phase bonding process between two bases and suppress formation of Kirkendall voids and voids and suppress a layered structure of an intermetallic compound, thereby to increase a bonding strength.
Wireless charging coil apparatus
A wireless charging coil apparatus is provided. In one embodiment, the apparatus comprises a substrate; a wireless charging coil disposed on said substrate, said wireless charging coil comprising a coil section and a connection terminal; wherein said connection terminal comprises an enlarged end and a connection hole, said enlarged end having an outer width and said connection hole having an inner width, said inner width being less than said outer width, said substrate having an etched portion partially exposing said connection terminal on a bottom side. The apparatus of the present invention reduces the overall thickness thereof, while also maintaining a high operating performance, having good cooling performance and provides a robust connection.
COIL DEVICE AND WIRELESS CHARGING DEVICE INCLUDING SAME
The present embodiment relates to a coil device and a wireless charging device including the same. The coil device according to the present embodiment includes: a coil wound to form a hollow portion; and a shielding housing including a flat part on which the coil is disposed, an inner wall corresponding to a shape of the hollow portion, and an outer wall corresponding to an outer circumferential shape of the coil. The inner wall protruding from the flat part on which the coil is disposed may have a height of 0 to 1.5 times a height of the coil. An inductance of the coil may have a range of 9.2 H to 12.26 H.