A method for thermally processing a minimally absorbing thin film in a selective manner is disclosed. Two closely spaced absorbing traces are patterned in thermal contact with the thin film. A pulsed radiant source is used to heat the two absorbing traces, and the thin film is thermally processed via conduction between the two absorbing traces. This method can be utilized to fabricate a thin film transistor (TFT) in which the thin film is a semiconductor and the absorbers are the source and the drain of the TFT.

A method for crystallising an amorphous layer included in a stack, extending directly in contact with a crystalline layer of the stack by forming an interface with the crystalline layer, and having a first face opposite the interface, and having a melting threshold E.sub.M corresponding to the energy density to be provided to the amorphous layer to achieve its melting, for a thickness Ep of the amorphous layer defined between the first face and the interface, the method including a crystallisation annealing of the amorphous layer by subjecting it, by zones, to laser pulses, and in each zone, the laser pulses are emitted by series, each laser pulse having an energy density ED.sub.i different from one series to another so as to maintain the energy density of the pulses of each series below the melting threshold.

The purpose of the invention is to form the TFT of the oxide semiconductor, in which influence of variation in mask alignment is suppressed, thus, manufacturing a display device having a TFT of stable characteristics. The concrete measure is as follows. A display device including plural pixels, each of the plural pixels having a thin film transistor (TFT) of an oxide semiconductor comprising: a width of the oxide semiconductor in the channel width direction is wider than a width of the gate electrode in the channel width direction.

The purpose of the invention is to form the TFT of the oxide semiconductor, in which influence of variation in mask alignment is suppressed, thus, manufacturing a display device having a TFT of stable characteristics. The concrete measure is as follows. A display device including plural pixels, each of the plural pixels having a thin film transistor (TFT) of an oxide semiconductor comprising: a width of the oxide semiconductor in the channel width direction is wider than a width of the gate electrode in the channel width direction.

The purpose of the present invention is to realize a flexible display includes a resin substrate and a TFT having an oxide. The structure of the invention is as follows. A display device comprising: a substrate formed by resin, an inorganic insulating film and a thin film transistor including a semiconductor, wherein an infra-red light reflecting film is formed between the substrate and the thin film transistor.

The purpose of the present invention is to realize a flexible display includes a resin substrate and a TFT having an oxide. The structure of the invention is as follows. A display device comprising: a substrate formed by resin, an inorganic insulating film and a thin film transistor including a semiconductor, wherein an infra-red light reflecting film is formed between the substrate and the thin film transistor.

An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

In a manufacturing step of an oxide semiconductor device having an active layer of an oxide semiconductor, the step is simplified, thereby improving the productivity. A method for manufacturing an oxide semiconductor device having an active layer of an oxide semiconductor layer of indium (In), gallium (Ga), and zinc (Zn) includes a laser annealing treatment including irradiating an active layer formed region with a laser beam and imparting an etching resistance to the active layer.

In a manufacturing step of an oxide semiconductor device having an active layer of an oxide semiconductor, the step is simplified, thereby improving the productivity. A method for manufacturing an oxide semiconductor device having an active layer of an oxide semiconductor layer of indium (In), gallium (Ga), and zinc (Zn) includes a laser annealing treatment including irradiating an active layer formed region with a laser beam and imparting an etching resistance to the active layer.