A manufacturing method of no-lead semiconductor package component including: mounting a chip on a metal frame, wherein the metal frame includes two short metal connecting bars to allow the top metal contact and the bottom metal contact to be electrically connected to the two X-direction connecting metal bars, respectively, thereby performing bonding or soldering; performing a plastic package molding; cutting the Y-direction connecting bar by a first cutter so as to expose an entire of lateral surfaces of the plurality of metal contacts; applying a solderable metal layer on all of the plurality of metal contacts that are exposed by an electroplating process; and cutting off the plastic molding material by a second cutter whose diameter is smaller than a diameter of the first cutter to obtain a single semiconductor package component.

A method includes forming a first package component and a second package component. The first package component includes a first polymer layer, and a first electrical connector, with at least a part of the first electrical connector being in the first polymer layer. The second package component comprises a second polymer layer, and a second electrical connector, with at least a part of the second electrical connector being in the second polymer layer. The first package component is bonded to the second package component, with the first polymer layer being bonded to the second polymer layer, and the first electrical connector being bonded to the second electrical connector.