Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/70
Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
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H01L21/71
Manufacture of specific parts of devices defined in group H01L21/70
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H01L21/768
Applying interconnections to be used for carrying current between separate components within a device; comprising conductors and dielectrics
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H01L21/76801
characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
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H01L21/76802
by forming openings in dielectrics
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H01L21/76817
using printing or stamping techniques
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H01L21/76817

Method of manufacturing semiconductor device using different types of plating films
12506016 · 2025-12-23 · ·

In a frame member including a first region and a second region that are extending in a first direction in parallel to each other while being spaced apart from each other, first and second plating films are formed in the first and second regions, respectively. The second plating film is different in a type from the first plating film. Then, a stamping process is performed to the frame member including the first region and the second region, thereby a lead frame including a plurality of leads is formed. The lead frame includes a first lead group and a second lead group. The first plating film is formed in the first lead group, but the second plating film is not formed in the first lead group. Meanwhile, the second plating film is formed in the second lead group, but the first plating film is not formed in the second lead group.